Abstract: An electronic assembly with phase-change material for thermal performance comprises a substrate and a semiconductor device mounted on the substrate. A sealed first thermal channel comprises a first evaporator section, a first fluid transport section, and a first condenser section. A phase-change material is contained in the sealed first thermal channel. The first evaporator section overlies the semiconductor device. The first fluid transport section extends between the first evaporator section and the first condenser section. The first evaporator section is spaced apart from the first condenser section. The first condenser section is in thermal communication with the heat sink.

Abstract: A folded outer tab comprises a first outer dielectric layer and a second outer dielectric layer that contact or overlie an outer terminal, where the outer terminal is associated with a first polarity of the DC bus. A bent inner tab comprises a first inner dielectric layer and a second inner dielectric layer that contact or overlie an inner terminal, where the inner terminal is associated with a second polarity of the DC bus that is opposite the first polarity. The folded outer tab and the bent inner tab comprise electrically conductive faces, of opposite polarities, formed of exposed portions of the outer terminal and the inner terminal.

Abstract: The first board section comprises a switching module with heat-generating semiconductor switches associated with a first operational temperature range. The first board section has a first conductive layer of a first thickness. The second board section comprises a plurality of capacitors mounted on a second circuit board. The second board section has conductive traces for interconnecting the capacitors as a network. The capacitors are associated with a second operational temperature range that is lower than the first operational temperature range. A thermal isolation intermediary forms a barrier between, or adjoining, the first board section and the second board section, where the first board section and the second board section are spaced part from each other by the thermal isolation intermediary.

Abstract: A folded outer tab comprises a first outer dielectric layer and a second outer dielectric layer that contact or overlie an outer terminal, where the outer terminal is associated with a first polarity of the DC bus. A bent inner tab comprises a first inner dielectric layer and a second inner dielectric layer that contact or overlie an inner terminal, where the inner terminal is associated with a second polarity of the DC bus that is opposite the first polarity. The folded outer tab and the bent inner tab comprise electrically conductive faces, of opposite polarities, formed of exposed portions of the outer terminal and the inner terminal.

Abstract: The first board section comprises a switching module with heat-generating semiconductor switches associated with a first operational temperature range. The first board section has a first conductive layer of a first thickness. The second board section comprises a plurality of capacitors mounted on a second circuit board. The second board section has conductive traces for interconnecting the capacitors as a network. The capacitors are associated with a second operational temperature range that is lower than the first operational temperature range. A thermal isolation intermediary forms a barrier between, or adjoining, the first board section and the second board section, where the first board section and the second board section are spaced part from each other by the thermal isolation intermediary.

Abstract: An electronic assembly with phase-change material for thermal performance comprises a substrate and a semiconductor device mounted on the substrate. A sealed first thermal channel comprises a first evaporator section, a first fluid transport section, and a first condenser section. A phase-change material is contained in the sealed first thermal channel. The first evaporator section overlies the semiconductor device. The first fluid transport section extends between the first evaporator section and the first condenser section. The first evaporator section is spaced apart from the first condenser section. The first condenser section is in thermal communication with the heat sink.

Abstract: The first wall has a first inbound cavity for receiving a coolant from an inlet port. The first wall has a first outbound cavity for directing the coolant from the inbound cavity to the input of the transition passage. The second wall has a second inbound cavity for receiving a coolant from the output of the transition passage. The second wall has a second outbound cavity for directing the coolant from the inbound cavity to the outlet port. The transition passage comprises a transverse hollow volume for interconnecting the first outbound cavity of the first wall to the second inbound cavity of a second wall. At least one heat-generating component (e.g., inductor) in the interior of the housing generates heat that is dissipated.

Abstract: A metallic island is disposed between a first metallic bus and a second metallic bus. The first metallic strip is isolated from the metallic island by a first dielectric barrier. At least a parallel portion of the first metallic strip is generally parallel to the first metallic bus, the second metallic strip isolated from the second metallic bus by a second dielectric barrier. Each first semiconductor terminals that are coupled to the first metallic bus and to the metallic island. Each second semiconductor has terminals coupled to the metallic island and to the second metallic bus.

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

Abstract: A metallic island is disposed between a first metallic bus and a second metallic bus. The first metallic strip is isolated from the metallic island by a first dielectric barrier. At least a parallel portion of the first metallic strip is generally parallel to the first metallic bus, the second metallic strip isolated from the second metallic bus by a second dielectric barrier. Each first semiconductor terminals that are coupled to the first metallic bus and to the metallic island. Each second semiconductor has terminals coupled to the metallic island and to the second metallic bus.

Abstract: The first wall has a first inbound cavity for receiving a coolant from an inlet port. The first wall has a first outbound cavity for directing the coolant from the inbound cavity to the input of the transition passage. The second wall has a second inbound cavity for receiving a coolant from the output of the transition passage. The second wall has a second outbound cavity for directing the coolant from the inbound cavity to the outlet port. The transition passage comprises a transverse hollow volume for interconnecting the first outbound cavity of the first wall to the second inbound cavity of a second wall. At least one heat-generating component (e.g., inductor) in the interior of the housing generates heat that is dissipated.

Abstract: A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.

Abstract: An electrical assembly includes a heat conducting housing. A conductor is supported by the housing and conducts electrical current. An electrical insulator member surrounds the conductor. A core surrounds the insulator member and the conductor so that current flowing through the conductor induces a magnetic field in the core. A transducer is coupled to the core for generating a signal representing current in the conductor. A thermal interface member engages the core and engages the housing. The interface member conducts or can conduct heat to the housing.

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

Abstract: A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.

Abstract: An electrical assembly includes a heat conducting housing. A conductor is supported by the housing and conducts electrical current. An electrical insulator member surrounds the conductor. A core surrounds the insulator member and the conductor so that current flowing through the conductor induces a magnetic field in the core. A transducer is coupled to the core for generating a signal representing current in the conductor. A thermal interface member engages the core and engages the housing. The interface member conducts or can conduct heat to the housing.

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

Abstract: A coaxial bus connector has a first end and a second end opposite the first end. The first end has a first positive terminal and a first negative terminal coupled to a primary direct current bus of a primary inverter. The second end has a second positive terminal and a second negative terminal coupled to the secondary direct current bus of a secondary inverter, wherein the coaxial bus connector comprises a dielectric material between a center conductor and a coaxial sleeve to form a snubber capacitor to absorb electrical energy or to absorb voltage spikes.

Abstract: A frame is secured to a first circuit board by provisions and respective fasteners to form a first circuit board assembly. A second circuit board has a second connector portion for mating with the first connector portion of the first circuit board. A holder overlies the second circuit board. The holder has a recess with an opening for the second connector portion to extend through. A clearance gap between the interior perimeter of the recess and the outer perimeter of the circuit board assembly allows alignment or registration of the first connector portion and the second connector portion. A lid is connected to the holder via one or more fasteners to secure the first circuit board assembly with respect to the second circuit board.

Abstract: A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A sealed metallic enclosure holds the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the sealed metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A housing is adapted for housing the semiconductor switch module within the metallic enclosure. The housing comprises chamber for holding or circulating a coolant overlying the metallic base.