Abstract: A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A metallic enclosure is arranged for receiving the semiconductor switch module. The metallic enclosure has a recess of a size and shape for receiving the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A metallic bridging connection fills and hydraulically seals what would otherwise be a perimeter gap between the metallic base and the metallic enclosure.

Abstract: A coaxial bus connector has a first end and a second end opposite the first end. The first end has a first positive terminal and a first negative terminal coupled to a primary direct current bus of a primary inverter. The second end has a second positive terminal and a second negative terminal coupled to the secondary direct current bus of a secondary inverter, wherein the coaxial bus connector comprises a dielectric material between a center conductor and a coaxial sleeve to form a snubber capacitor to absorb electrical energy or to absorb voltage spikes.

Abstract: A frame is secured to a first circuit board by provisions and respective fasteners to form a first circuit board assembly. A second circuit board has a second connector portion for mating with the first connector portion of the first circuit board. A holder overlies the second circuit board. The holder has a recess with an opening for the second connector portion to extend through. A clearance gap between the interior perimeter of the recess and the outer perimeter of the circuit board assembly allows alignment or registration of the first connector portion and the second connector portion. A lid is connected to the holder via one or more fasteners to secure the first circuit board assembly with respect to the second circuit board.

Abstract: A fastener assembly includes a second part for fastening to the first part. The first and second parts have openings for aligning with each other. The second part has a plurality of slots spaced apart from its opening. A nut holder is mounted to the second part. The holder has a base and a plurality of flexible legs projecting from the base. Each leg is adapted to be inserted through a corresponding one of the slots and to hold the holder to the second part. The base has a hexagonal shaped opening. The assembly also includes a hexagonal nut and a bolt. The nut is non-rotatably received by the hexagonal opening. The threaded shaft of the bolt extends through the first and second openings, and is threadably received by the nut so that the first part is held between the bolt head and the second part.

Abstract: A first bus structure comprises a first outer conductive layer and a first inner conductive layer separated by a an first dielectric layer. A second bus structure comprises a second outer conductive layer and a second inner conductive layer separated by a second dielectric layer. An outer sleeve electrically connects the first inner conductive layer to the second inner conductive layer. An inner sleeve electrically connects the first outer conductive layer to the second outer conductive layer. A fastener extends through the inner sleeve to clamp or compress the first outer conductive layer and the second outer conductive layer toward each other.

Abstract: A first bus structure comprises a first outer conductive layer and a first inner conductive layer separated by a an first dielectric layer. A second bus structure comprises a second outer conductive layer and a second inner conductive layer separated by a second dielectric layer. An outer sleeve electrically connects the first inner conductive layer to the second inner conductive layer. An inner sleeve electrically connects the first outer conductive layer to the second outer conductive layer. A fastener extends through the inner sleeve to clamp or compress the first outer conductive layer and the second outer conductive layer toward each other.

Abstract: A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A sealed metallic enclosure holds the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the sealed metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A housing is adapted for housing the semiconductor switch module within the metallic enclosure. The housing comprises chamber for holding or circulating a coolant overlying the metallic base.

Abstract: A package for a semiconductor device or circuit comprises a semiconductor switch module having a metallic base on an exterior side and metallic pads. A metallic enclosure is arranged for receiving the semiconductor switch module. The metallic enclosure has a recess of a size and shape for receiving the semiconductor switch module. The metallic enclosure has a set of dielectric regions with embedded or pass-through electrical terminals that are electrically insulated or isolated from the metallic enclosure. The electrical terminals are electrically connected to the metallic pads. A metallic bridging connection fills and hydraulically seals what would otherwise be a perimeter gap between the metallic base and the metallic enclosure.

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

Abstract: A case assembly encloses heat generating electronic components. The case includes first and second housing parts which can be cast from the same mold. Covers are mounted to the housings to form coolant passages. The housing parts include built-in the connecting parts which are coupled together to form additional coolant passages. One of the connecting parts has a lip which sealingly receives an end of another connecting part. The lip is received by a slot adjacent to the other connecting part. The slot communicates with an exterior of the housing.

Abstract: A case assembly encloses heat generating electronic components. The case includes first and second housing parts which can be cast from the same mold. Covers are mounted to the housings to form coolant passages. The housing parts include built-in the connecting parts which are coupled together to form additional coolant passages. One of the connecting parts has a lip which sealingly receives an end of another connecting part. The lip is received by a slot adjacent to the other connecting part. The slot communicates with an exterior of the housing.

Abstract: A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.

Abstract: A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.

Abstract: A lower enclosure has a first recess. A first annular retainer is adapted for engaging a lower portion of a capacitor and the first recess. The first annular retainer has a plurality of tabs that extend radially outward from an outer diameter surface of the first annular retainer. Each of the tabs has a sloped surface or a peaked surface for compression of the first annular retainer against the capacitor. An upper enclosure has a plurality of second recesses. A second annular retainer is adapted for engaging an upper portion of the capacitor and the second recesses. The second annular retainer has a plurality of protrusions that extend upward from the second annular retainer. Each of the protrusions has a slit for receiving a wedge, such that if the protrusions engage the wedge the second annular retainer is compressed against the capacitor.

Abstract: A lower enclosure has a first recess. A first annular retainer is adapted for engaging a lower portion of a capacitor and the first recess. The first annular retainer has a plurality of tabs that extend radially outward from an outer diameter surface of the first annular retainer. Each of the tabs has a sloped surface or a peaked surface for compression of the first annular retainer against the capacitor. An upper enclosure has a plurality of second recesses. A second annular retainer is adapted for engaging an upper portion of the capacitor and the second recesses. The second annular retainer has a plurality of protrusions that extend upward from the second annular retainer. Each of the protrusions has a slit for receiving a wedge, such that if the protrusions engage the wedge the second annular retainer is compressed against the capacitor.

Abstract: An electrical assembly comprises a housing, where the housing has an inner housing and a removable outer housing removably connected to the inner housing. A first connector portion is secured to the inner housing. The first connector portion comprises a dielectric body and connector terminals. A subscriber identification module is supported by the inner housing. The subscriber identification module has device terminals. A group of conductors or a conductor assembly supports an electrical connection of the connector terminals to the device terminals. A holder retains the subscriber identification module with respect to the inner housing.

Abstract: The assembly has a subscriber identification module comprising a housing with a recess disposed in the housing. An electrical connector portion is secured to the housing. The connector portion comprises a dielectric body and connector terminals. A subscriber identification module is housed in the housing, where the subscriber identification module has device terminals. A conductor or flexible substrate electrically connects the connector terminals to the device terminals. A protective filler overlies the subscriber identification module and at least part of the conductor or the flexible substrate.

Abstract: In accordance with one embodiment, an electrical assembly comprises a housing having a recess in the housing. A first connector portion is securable to the housing. The connector portion comprises a dielectric body and connector terminals. A subscriber identification module is located in or mounted in the housing and has device terminals. A substrate comprises a first section that intersects at an angle a second section. The first section comprises first conductive traces electrically connected to the device terminals. The second section comprises second conductive traces electrically connected to the connector terminals. Conductors are electrically connected to the first conductive traces and the second conductive traces.

Abstract: An electrical assembly comprises a housing having a frame portion. A substrate has a first side and a second side opposite the first side. A subscriber identification module is mounted to a first side of the substrate and has device terminals. A first connector portion is secured to the second side of the substrate and has connector terminals. A retainer is associated with an interior of the frame portion. The retainer retains at least one of the substrate and the first connector portion. Conductive (e.g., conductive vias or through-holes) in the substrate connect the connector terminals to the device terminals.

Abstract: The assembly has a subscriber identification module comprising a housing with a recess disposed in the housing. An electrical connector portion is secured to the housing. The connector portion comprises a dielectric body and connector terminals. A subscriber identification module is housed in the housing, where the subscriber identification module has device terminals. A conductor or flexible substrate electrically connects the connector terminals to the device terminals. A protective filler overlies the subscriber identification module and at least part of the conductor or the flexible substrate.