Abstract: A differential charge and dump optoelectronic receiver for baseband digital optoelectronic data links is disclosed having a preamplifier and a voltage controlled current source that defines the tail current of a differential pair functioning as a two quadrant multiplier, and using capacitors as loads on the differential pair making said differential pair an integrator. The integrator provides a full differential output, part of which is fedback to control the gain of the preamplifier. In a preferred embodiment, one integrator pair is used to recover the data from a Manchester encoded data stream. In another preferred embodiment, two pairs of integrators are used for QPSK like codes.

Abstract: A projection system for a computer has an electronic slide (94) that is coupled to an electronic image signal (84) from a processor (82) in the computer (50). Projection optics (102) focus an optical image from the electronic slide (94) onto a screen (58).

Abstract: One surface of a semiconductor component attached to one surface of a header with an opposite surface of the component having an optical input/output positioned adjacent one end of an optical fiber. The component and optical fiber are fixedly attached with no strain by a curable gel with the header acting as a heat sink. Electrical contacts are made to the component by means of leads formed on the header and/or a conductive coating deposited on the optical fiber.

Abstract: In accordance with a first aspect, a binding assay comprises a machine-readable storage medium which supports a molecular receptor (22). In accordance with a second aspect, a support member (50) supports first (22) and second (24) molecular receptors and first (26) and second (28) data identifying the molecular receptors (22,24). In accordance with a third aspect, a support member has a first annular portion (106) to support molecular receptors and a second annular portion (108) to support machine-readable data identifying the plurality of molecular receptors.

Abstract: An optical hinge (20) provides one or more free space optical communication links through the hinge (17) of an instrument (10). The optical links include a transmitter (24) in one section (14) of the instrument (10) and a receiver (34) in the other section (16) of the instrument (10). An optical coupler (27) connects the transmitter (24) to the receiver (34) through a hinge (17).

Abstract: A process combines a high performance silicon pin diode (60) and other semiconductor devices such as transistors, resistors, and capacitors. The pin diode (60) is formed beneath an epitaxial layer (44) of the device at a depth that maximizes absorption of light having a wavelength greater than approximately 600 nanometers. Devices such as transistors are formed in the epitaxial layer (44). An integrated circuit has a substrate (41), an intrinsically doped layer (42), a buried layer (43), and an epitaxial layer (44). An isolation region (45) isolates an intrinsically doped region (46), a buried layer region (47), and the epitaxial layer region (48). The pin diode (32) has a substrate (41), an intrinsically doped region (46), and a buried layer region (47). A polysilicon region (62) provides a top side contact for the pin diode (60).

Abstract: A flexible electro-optic circuit board (20) includes a polymer circuit board (22) and a polymer optical backplane (34). The polymer circuit board (22) includes a plurality of circuit elements (50, 52). The polymer optical backplane (34) has a plurality of optical transmission lines (44). A plurality of optical vias (30) couple the polymer circuit board (22) to the polymer optical backplane (34).

Abstract: A signal processing circuit (10) performs a sample and hold (16) of an input signal (14) and stores a maximum value of the input signal (18). A guardband signal (21) is developed that is less than the maximum value that is stored. The input signal is compared to the guardband signal to determine if the input signal is above or below the guardband signal. A threshold signal (25) is developed by taking a percentage of the maximum value that is stored. The input signal is compared to the threshold signal to regenerate the input waveform. If the input signal is below the guardband signal and above the threshold signal, the sample and hold circuit is reset to acquire a new maximum value of the input signal so that a new threshold can be used for regenerating the input signal.

Abstract: A signal processing circuit (10) generates a bias signal (27) that is used for biasing a comparator (26). An input signal (14) is compared to the bias signal (27) in order to reconstruct the input signal (14) on an output of the comparator. The bias signal (27) is generated by selecting the larger of a percent of the input signal (23) or an offset signal (24) that is larger than a minimum value of the input signal.

Abstract: A data transmitter (12) transmits parallel data as light pulses over multiple optical channels (14). A data receiver (16) converts the light pulses back to a voltage level and compares the voltage level to a reference capacitor voltage (42). The capacitor voltage should maintain a mid-range value for proper noise margin in detecting logic ones and logic zeroes. Any long series of consecutive logic ones or zeroes causes the capacitor voltage to charge or discharge toward the same level as the data voltage, which causes data errors. To prevent the data errors, the data is encoded (18) by inverting certain bits to break up the long series of consecutive logic states. The encoding information is transmitted as a transmitted clock to the data receiver over another fiber optic channel. The decoding information is retrieved (20) so that the encoded data can be converted back to proper logic states.

Abstract: A substrate having a photonic device mounted thereon with a working portion that is operably connected to at least one electrical lead. A molded optical portion having a surface for light signal to enter and to exit is formed that encapsulates the substrate, the photonic device, and a portion of the first and second electrical lead. An optical connector is formed to plug into the molded optical portion to connect a fiber bundle thereto and the optical portion is electrically connected to an interconnect module.

Abstract: A flexible circuit film (103) having a plurality of electrical tracings (118) is provided. A mold (102) having a cavity (112) capable of accepting the flexible circuit film (103) is provided. The flexible circuit film (103) is placed into the mold (102). A first optical portion (203) is molded with the flexible circuit film (103) in the cavity (112) of the mold (102) so as to join the flexible circuit film (103) to the first optical portion (203).

Abstract: An article and method for making an integrated light emitting optical fiber (101) is provided. The optical fiber (101) having an optical surface (106) and an external surface (105) is provided. A first conductive layer (109) is disposed on the optical fiber (101). A light emitting layer (115) is disposed on a portion of the optical surface (106) of the optical fiber (101) and a second conductive layer (121) is disposed on the light emitting layer (115).

Abstract: A molded optical interconnect is provided. A plurality of electrical tracings is disposed thereon. An optical module having an optical surface and a photonic device are operably coupled to an interconnect substrate. A molded optical portion having a core region with a first end and a cladding region is positioned with the first end of the core region being adjacent to the optical surface of the integrated circuit to operably couple the first end of the core region to the optical surface of the integrated circuit.

Abstract: A substrate having a photonic device mounted thereon with a working portion that is operably connected to at least one electrical lead. A molded optical portion having a surface for light signal to enter and to exit is formed that encapsulates the substrate, the photonic device, and a portion of the first and second electrical lead. An optical connector is formed to plug into the molded optical portion to connect a fiber bundle thereto and the optical portion is electrically connected to an interconnect module.

Abstract: An adjoining waveguide and optical connector is provided. A waveguide including a first end surface, a second end surface, and an adjoining surface is formed. The adjoining waveguide further includes a core region that extends from the first end surface to the second end surface and a cladding region that surrounds the core region. The first end surface and the second end surface of the waveguide exposes a portion of the core region that is used for optical coupling. The joining surface forms an interconnecting surface for another waveguide.

Abstract: A method for making an optical interconnect unit is disclosed. A mold (100) with surface (107) having a groove (112) is formed. An optical fiber (117) is placed into the groove (112) of the surface (107). A molding material is applied onto the surface (107) of the mold (100) and onto the optical fiber (117), thereby affixing the optical fiber (117) to the molding material.

Abstract: A flexible circuit film (103) having a plurality of electrical tracings (118) is provided. A mold (102) having a cavity (112) capable of accepting the flexible circuit film (103) is provided. The flexible circuit film (103) is placed into the mold (102). A first optical portion (203) is molded with the flexible circuit film (103) in the cavity (112) of the mold (102) so as to join the flexible circuit film (103) to the first optical portion (203).

Abstract: A coaxial optoelectronic mount is provided. A coax cable having an inner conductor, an outer conductor, and an insulating region therebetween, and an end is formed. The end of the coax cable exposes portions of the inner conductor, the outer conductor, and the insulating region. A photonic device having a working portion, a first contact, and a second contact is mounted on the end of the coaxial cable. An optical fiber having a core region with a refractive index, a cladding region with a refractive index, and a surface is aligned to the working portion of the photonic device. An optical gel having a refractive index is disposed on the surface of the optical fiber and on the working portion of the photonic device operatively coupling the core region of the optical fiber to the working portion of the photonic device.

Abstract: A molded reflective optical waveguide module is provided. A molded first optical portion having a fist surface or a major surface is formed. A core region having a first end and a second end is disposed into the first surface of the molded first optical portion with the first end of the core region terminating in a surface having an angle. A second molded optical portion having electrical traces and photonic devices can be applied to the molded first optical portion.