Abstract: Systems and methods are disclosed for a liquid cooling module for an information handling system that may include a mounting card configured to mount the liquid cooling module to a card slot proximate to a graphics card; a radiator inlet configured to receive a heated liquid from a pump of the graphics card; a radiator inlet tube configured to transfer the heated liquid from the graphics card to the liquid cooling module; a radiator configured to receive the heated liquid via a radiator inlet; a blower configured to direct a surrounding air flow across the radiator to cool the heated liquid; a radiator outlet configured to receive the cooled liquid from the radiator; and a radiator outlet tube configured to transfer the cooled liquid from the liquid cooling module to the graphics card.

Abstract: A modular desktop computing system includes a display stand chassis having a display stand base, a display stand support member extending from the display stand base and including a display device mounting subsystem, and a display stand cover removeably coupled to the display stand support member to define a computing module housing between the display stand support member and the display stand cover. A display device is removeably mounted to the display device mounting subsystem. A computing module is located in the computing module housing. The computing module includes a computing module chassis removeably positioned in the computing module housing and housing: a processing system coupled to the display device, and a memory system coupled to the processing system. The memory system includes instructions that, when executed by the processing system, cause the processing system to provide for the display of images on the display device.

Abstract: Systems and methods are disclosed for a liquid cooling module for an information handling system that may include a mounting card configured to mount the liquid cooling module to a card slot proximate to a graphics card; a radiator inlet configured to receive a heated liquid from a pump of the graphics card; a radiator inlet tube configured to transfer the heated liquid from the graphics card to the liquid cooling module; a radiator configured to receive the heated liquid via a radiator inlet; a blower configured to direct a surrounding air flow across the radiator to cool the heated liquid; a radiator outlet configured to receive the cooled liquid from the radiator; and a radiator outlet tube configured to transfer the cooled liquid from the liquid cooling module to the graphics card.

Abstract: A heat dissipation wall system includes a base wall having an outer surface, a plurality of side walls extending approximately perpendicularly from the base wall to define a component housing between the base wall and the side walls, and a plurality of heat dissipation channels defined by the base wall and extending into the base wall from the outer surface. Each of the heat dissipation channels includes a respective first airflow aperture that extends through the base wall from the outer surface to the component housing and that is configured to allow an airflow adjacent the outer surface to enter the component housing, and a respective second airflow aperture that is spaced apart from the first airflow aperture, that extends through the base wall from the outer surface to the component housing, and that is configured to allow an airflow adjacent the outer surface to enter the component housing.

Abstract: A heat dissipation wall system includes a base wall having an outer surface, a plurality of side walls extending approximately perpendicularly from the base wall to define a component housing between the base wall and the side walls, and a plurality of heat dissipation channels defined by the base wall and extending into the base wall from the outer surface. Each of the heat dissipation channels includes a respective first airflow aperture that extends through the base wall from the outer surface to the component housing and that is configured to allow an airflow adjacent the outer surface to enter the component housing, and a respective second airflow aperture that is spaced apart from the first airflow aperture, that extends through the base wall from the outer surface to the component housing, and that is configured to allow an airflow adjacent the outer surface to enter the component housing.

Abstract: A modular desktop computing system includes a display stand chassis having a display stand base, a display stand support member extending from the display stand base and including a display device mounting subsystem, and a display stand cover removeably coupled to the display stand support member to define a computing module housing between the display stand support member and the display stand cover. A display device is removeably mounted to the display device mounting subsystem. A computing module is located in the computing module housing. The computing module includes a computing module chassis removeably positioned in the computing module housing and housing: a processing system coupled to the display device, and a memory system coupled to the processing system. The memory system includes instructions that, when executed by the processing system, cause the processing system to provide for the display of images on the display device.

Abstract: An expansion module system includes a board having a plurality of expansion modules connectors mounted to the board. A shared expansion module coupling feature is provided on the board and includes a coupling member. A respective expansion module is connected to each of the plurality of expansion module connectors, and the coupling member engages each of the respective expansion modules to secure each of the respective expansion modules in their respective expansion module connectors. The shared expansion module coupling feature may includes a standoff that is mounted to the board immediately adjacent a single hole defined by the board, and the coupling member may be provided by a single screw that engages each of the respective expansion modules and at least one of: the shared expansion module coupling feature and the portion of the board that defines the hole.

Abstract: A modular desktop computing system includes a display stand chassis having a display stand base, a display stand support member extending from the display stand base and including a display device mounting subsystem, and a display stand cover removeably coupled to the display stand support member to define a computing module housing between the display stand support member and the display stand cover. A display device is removeably mounted to the display device mounting subsystem. A computing module is located in the computing module housing. The computing module includes a computing module chassis removeably positioned in the computing module housing and housing: a processing system coupled to the display device, and a memory system coupled to the processing system. The memory system includes instructions that, when executed by the processing system, cause the processing system to provide for the display of images on the display device.

Abstract: A forced convection system includes a chassis defining a chassis housing and including an outer surface opposite the chassis housing. A forced convection device channel is defined by the chassis adjacent the outer surface and opposite the chassis housing. A heat dissipation structure extends from the chassis adjacent the outer surface, opposite the chassis housing, and adjacent the forced convection device channel. A first heat producing device is located in the chassis housing and engages the chassis immediately opposite the heat dissipation structure to allow the chassis and the heat dissipation structure to conduct heat generated by the first heat producing device. A forced convection device is located in the forced convection device channel, and produces a forced convective airflow past the heat dissipation structure to dissipate the heat generated by the first heat producing device and conducted by the chassis and the heat dissipation structure.

Abstract: An externally mounted component cooling system includes a chassis defining a chassis housing and including an outer surface that is located opposite the chassis from the chassis housing. An air inlet is defined by the chassis and extends through the chassis from the outer surface to the chassis housing. At least one external component mounting feature is included on the outer surface of the chassis adjacent the air inlet. An external component is coupled to the at least one external component mounting feature. A forced convection device is located in the chassis housing and is configured to generate an airflow through chassis housing. The generation of the airflow by the forced convection device draws air past the external component and through the air inlet to cool the external component.

Abstract: An expansion module system includes a board having a plurality of expansion modules connectors mounted to the board. A shared expansion module coupling feature is provided on the board and includes a coupling member. A respective expansion module is connected to each of the plurality of expansion module connectors, and the coupling member engages each of the respective expansion modules to secure each of the respective expansion modules in their respective expansion module connectors. The shared expansion module coupling feature may includes a standoff that is mounted to the board immediately adjacent a single hole defined by the board, and the coupling member may be provided by a single screw that engages each of the respective expansion modules and at least one of: the shared expansion module coupling feature and the portion of the board that defines the hole.

Abstract: A modular desktop computing system includes a display stand chassis having a display stand base, a display stand support member extending from the display stand base and including a display device mounting subsystem, and a display stand cover removeably coupled to the display stand support member to define a computing module housing between the display stand support member and the display stand cover. A display device is removeably mounted to the display device mounting subsystem. A computing module is located in the computing module housing. The computing module includes a computing module chassis removeably positioned in the computing module housing and housing: a processing system coupled to the display device, and a memory system coupled to the processing system. The memory system includes instructions that, when executed by the processing system, cause the processing system to provide for the display of images on the display device.

Abstract: A cooling system includes a chassis defining a housing and including a wall having an outer surface. A computing device is located in the housing. A heat transfer device located in the housing engages the computing device and the wall, providing for heat transfer from the computing device, through the heat transfer device, and through the wall to the outer surface to produce supplemental passive cooling of the computing device via the outer surface. A heat dissipation aperture is defined by the chassis, and a heat dissipation device located in the housing adjacent the heat dissipation aperture engages the heat transfer device, which provides for heat transfer from the heat transfer device to the heat dissipation device. A forced convection device located in the housing generates an airflow past the heat dissipation structure and through the heat dissipation aperture to enable primary active cooling of the computing device.

Abstract: An externally mounted component cooling system includes a chassis defining a chassis housing and including an outer surface that is located opposite the chassis from the chassis housing. An air inlet is defined by the chassis and extends through the chassis from the outer surface to the chassis housing. At least one external component mounting feature is included on the outer surface of the chassis adjacent the air inlet. An external component is coupled to the at least one external component mounting feature. A forced convection device is located in the chassis housing and is configured to generate an airflow through chassis housing. The generation of the airflow by the forced convection device draws air past the external component and through the air inlet to cool the external component.

Abstract: An expansion module system includes a board having a plurality of expansion modules connectors mounted to the board. A shared expansion module coupling feature is provided on the board and includes a coupling member. A respective expansion module is connected to each of the plurality of expansion module connectors, and the coupling member engages each of the respective expansion modules to secure each of the respective expansion modules in their respective expansion module connectors. The shared expansion module coupling feature may includes a standoff that is mounted to the board immediately adjacent a single hole defined by the board, and the coupling member may be provided by a single screw that engages each of the respective expansion modules and at least one of: the shared expansion module coupling feature and the portion of the board that defines the hole.

Abstract: An expansion module system includes a board having a plurality of expansion modules connectors mounted to the board. A shared expansion module coupling feature is provided on the board and includes a coupling member. A respective expansion module is connected to each of the plurality of expansion module connectors, and the coupling member engages each of the respective expansion modules to secure each of the respective expansion modules in their respective expansion module connectors. The shared expansion module coupling feature may includes a standoff that is mounted to the board immediately adjacent a single hole defined by the board, and the coupling member may be provided by a single screw that engages each of the respective expansion modules and at least one of: the shared expansion module coupling feature and the portion of the board that defines the hole.

Abstract: A forced convection system includes a chassis defining a chassis housing and including an outer surface opposite the chassis housing. A forced convection device channel is defined by the chassis adjacent the outer surface and opposite the chassis housing. A heat dissipation structure extends from the chassis adjacent the outer surface, opposite the chassis housing, and adjacent the forced convection device channel. A first heat producing device is located in the chassis housing and engages the chassis immediately opposite the heat dissipation structure to allow the chassis and the heat dissipation structure to conduct heat generated by the first heat producing device. A forced convection device is located in the forced convection device channel, and produces a forced convective airflow past the heat dissipation structure to dissipate the heat generated by the first heat producing device and conducted by the chassis and the heat dissipation structure.

Abstract: A modular desktop computing system includes a display stand chassis having a display stand base, a display stand support member extending from the display stand base and including a display device mounting subsystem, and a display stand cover removeably coupled to the display stand support member to define a computing module housing between the display stand support member and the display stand cover. A display device is removeably mounted to the display device mounting subsystem. A computing module is located in the computing module housing. The computing module includes a computing module chassis removeably positioned in the computing module housing and housing: a processing system coupled to the display device, and a memory system coupled to the processing system. The memory system includes instructions that, when executed by the processing system, cause the processing system to provide for the display of images on the display device.

Abstract: A cooling system includes a chassis defining a housing and including a wall having an outer surface. A computing device is located in the housing. A heat transfer device located in the housing engages the computing device and the wall, providing for heat transfer from the computing device, through the heat transfer device, and through the wall to the outer surface to produce supplemental passive cooling of the computing device via the outer surface. A heat dissipation aperture is defined by the chassis, and a heat dissipation device located in the housing adjacent the heat dissipation aperture engages the heat transfer device, which provides for heat transfer from the heat transfer device to the heat dissipation device. A forced convection device located in the housing generates an airflow past the heat dissipation structure and through the heat dissipation aperture to enable primary active cooling of the computing device.

Abstract: An airflow control system includes a chassis defining a chassis housing that includes at least one airflow inlet and an airflow outlet. A cooled device is located in the chassis housing between the at least one airflow inlet and the airflow outlet. A convection enhancing heat element is located in the chassis housing between the cooled device and the airflow outlet. A controller is coupled to the convection enhancing heat element and configured to activate the convection enhancing heat element such that a convective airflow through the chassis housing is increased.