Abstract: An airflow control system includes a chassis defining a chassis housing that includes at least one airflow inlet and an airflow outlet. A cooled device is located in the chassis housing between the at least one airflow inlet and the airflow outlet. A convection enhancing heat element is located in the chassis housing between the cooled device and the airflow outlet. A controller is coupled to the convection enhancing heat element and configured to activate the convection enhancing heat element such that a convective airflow through the chassis housing is increased.

Abstract: An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate.

Abstract: An information handling system (IHS) cooling system includes a multi-IHS chassis having at least one fan system that produces an airflow. An IHS is positioned in the multi-IHS chassis. The IHS includes an IHS chassis that houses a processing system and a memory system. An airflow channel is defined within the IHS chassis and is configured to receive at least a portion of the airflow produced by the at least one fan system. An airflow impedance element is positioned in the airflow channel, and includes a first orientation in which the airflow impedance element extends into the airflow channel to impede airflow through the airflow channel. The airflow impedance element is configured to change shape as a function of temperature into at least one second orientation that reduces the impedance of airflow through the airflow channel. In some embodiments, the airflow impedance element is a bimetallic plate.