Patents by Inventor Christopher Michael Verreen
Christopher Michael Verreen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240014129Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: ApplicationFiled: September 26, 2023Publication date: January 11, 2024Applicant: X Display Company Technology LimitedInventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
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Patent number: 11804431Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: GrantFiled: February 14, 2022Date of Patent: October 31, 2023Assignee: Display Company Technology LimitedInventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
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Publication number: 20220165666Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: ApplicationFiled: February 14, 2022Publication date: May 26, 2022Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
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Patent number: 11282786Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: GrantFiled: December 3, 2019Date of Patent: March 22, 2022Assignee: X Display Company Technology LimitedInventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
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Patent number: 11088121Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.Type: GrantFiled: March 2, 2020Date of Patent: August 10, 2021Assignee: X Display Company Technology LimitedInventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
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Patent number: 10748793Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.Type: GrantFiled: February 13, 2019Date of Patent: August 18, 2020Assignee: X Display Company Technology LimitedInventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
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Publication number: 20200259057Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.Type: ApplicationFiled: March 2, 2020Publication date: August 13, 2020Inventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
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Publication number: 20200258761Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.Type: ApplicationFiled: February 13, 2019Publication date: August 13, 2020Inventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
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Publication number: 20200194370Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.Type: ApplicationFiled: December 3, 2019Publication date: June 18, 2020Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick