Patents by Inventor Christopher Michael Verreen

Christopher Michael Verreen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240014129
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Application
    Filed: September 26, 2023
    Publication date: January 11, 2024
    Applicant: X Display Company Technology Limited
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
  • Patent number: 11804431
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Grant
    Filed: February 14, 2022
    Date of Patent: October 31, 2023
    Assignee: Display Company Technology Limited
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
  • Publication number: 20220165666
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Application
    Filed: February 14, 2022
    Publication date: May 26, 2022
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
  • Patent number: 11282786
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: March 22, 2022
    Assignee: X Display Company Technology Limited
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick
  • Patent number: 11088121
    Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: August 10, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
  • Patent number: 10748793
    Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: August 18, 2020
    Assignee: X Display Company Technology Limited
    Inventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
  • Publication number: 20200259057
    Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.
    Type: Application
    Filed: March 2, 2020
    Publication date: August 13, 2020
    Inventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
  • Publication number: 20200258761
    Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.
    Type: Application
    Filed: February 13, 2019
    Publication date: August 13, 2020
    Inventors: Andrew Tyler Pearson, Erich Radauscher, Christopher Michael Verreen, Matthew Alexander Meitl, Christopher Andrew Bower, Ronald S. Cok
  • Publication number: 20200194370
    Abstract: A parallel redundant system comprises a substrate, a first circuit disposed over the substrate, a first conductor disposed at least partially in a first layer over the substrate and wire routed to the first circuit, a second circuit disposed over the substrate, the second circuit redundant to the first circuit, a second conductor disposed in a second layer over the substrate and electrically connected to the second circuit, the second conductor disposed at least partially over the first conductor, a dielectric layer disposed at least partially between the first layer and the second layer, and a laser weld electrically connecting the first conductor to the second conductor.
    Type: Application
    Filed: December 3, 2019
    Publication date: June 18, 2020
    Inventors: Erich Radauscher, Ronald S. Cok, Matthew Alexander Meitl, Christopher Andrew Bower, Christopher Michael Verreen, Erik Paul Vick