Patents by Inventor Christopher Wiegand
Christopher Wiegand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240001948Abstract: A computer-implemented method for criterion-based updating of a scenarios library having virtual vehicle environments for testing automated driving functions of a motor vehicle includes: providing a scenarios library having a number of test scenario data sets and a requirements profile having at least one scenario element for creating or updating the scenarios library; comparing a further test scenario data set having a plurality of scenario elements to at least one cluster of the number of test scenario data sets comprised in the scenarios library and to the requirements profile; and adding the further test scenario data set to the scenarios library or discarding the further test scenario data set.Type: ApplicationFiled: March 27, 2023Publication date: January 4, 2024Inventor: Christopher Wiegand
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Patent number: 11818963Abstract: An apparatus is provided which comprises: a magnetic junction including: a stack of structures including: a first structure comprising a magnet with an unfixed perpendicular magnetic anisotropy (PMA) relative to an x-y plane of a device, wherein the first structure has a first dimension along the x-y plane and a second dimension in the z-plane, wherein the second dimension is substantially greater than the first dimension. The magnetic junction includes a second structure comprising one of a dielectric or metal; and a third structure comprising a magnet with fixed PMA, wherein the third structure has an anisotropy axis perpendicular to the plane of the device, and wherein the third structure is adjacent to the second structure such that the second structure is between the first and third structures; and an interconnect adjacent to the third structure, wherein the interconnect comprises a spin orbit material.Type: GrantFiled: January 18, 2022Date of Patent: November 14, 2023Assignee: Intel CorporationInventors: Sasikanth Manipatruni, Kaan Oguz, Chia-Ching Lin, Christopher Wiegand, Tanay Gosavi, Ian Young
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Patent number: 11770979Abstract: A memory device includes a bottom electrode, a conductive layer such as an alloy including ruthenium and tungsten above the bottom electrode and a perpendicular magnetic tunnel junction (pMTJ) on the conductive layer. In an embodiment, the pMTJ includes a fixed magnet, a tunnel barrier above the fixed magnet and a free magnet on the tunnel barrier. The memory device further includes a synthetic antiferromagnetic (SAF) structure that is ferromagnetically coupled with the fixed magnet to pin a magnetization of the fixed magnet. The conductive layer has a crystal texture which promotes high quality FCC <111> crystal texture in the SAF structure and improves perpendicular magnetic anisotropy of the fixed magnet.Type: GrantFiled: June 29, 2018Date of Patent: September 26, 2023Assignee: Intel CorporationInventors: Daniel Ouellette, Justin Brockman, Tofizur Rahman, Angeline Smith, Andrew Smith, Christopher Wiegand, Oleg Golonzka
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Patent number: 11737368Abstract: A memory device includes a first electrode, a conductive layer including iridium above the first electrode and a magnetic junction directly on the conductive layer. The magnetic junction further includes a pinning structure above the conductive layer, a fixed magnet above the pinning structure, a tunnel barrier on the fixed magnet, a free magnet on the tunnel barrier layer and a second electrode above the free magnet. The conductive layer including iridium and the pinning structure including iridium provide switching efficiency.Type: GrantFiled: March 27, 2019Date of Patent: August 22, 2023Assignee: Intel CorporationInventors: Daniel Ouellette, Christopher Wiegand, Justin Brockman, Tofizur Rahman, Oleg Golonzka, Angeline Smith, Andrew Smith, James Pellegren, Michael Robinson, Huiying Liu
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Patent number: 11683939Abstract: A memory apparatus includes a first electrode having a spin orbit material. The memory apparatus further includes a first memory device on a portion of the first electrode and a first dielectric adjacent to a sidewall of the first memory device. The memory apparatus further includes a second memory device on a portion of the first electrode and a second dielectric adjacent to a sidewall of the second memory device. A second electrode is on and in contact with a portion of the first electrode, where the second electrode is between the first memory device and the second memory device. The second electrode has a lower electrical resistance than an electrical resistance of the first electrode. The memory apparatus further includes a first interconnect structure and a second interconnect, each coupled with the first electrode.Type: GrantFiled: April 26, 2019Date of Patent: June 20, 2023Assignee: INTEL CORPORATIONInventors: Benjamin Buford, Angeline Smith, Noriyuki Sato, Tanay Gosavi, Kaan Oguz, Christopher Wiegand, Kevin O'Brien, Tofizur Rahman, Gary Allen, Sasikanth Manipatruni, Emily Walker
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Patent number: 11594673Abstract: A memory device includes a first electrode including a spin-orbit material, a magnetic junction on a portion of the first electrode and a first structure including a dielectric on a portion of the first electrode. The first structure has a first sidewall and a second sidewall opposite to the first sidewall. The memory device further includes a second structure on a portion of the first electrode, where the second structure has a sidewall adjacent to the second sidewall of the first structure. The memory device further includes a first conductive interconnect above and coupled with each of the magnetic junction and the second structure and a second conductive interconnect below and coupled with the first electrode, where the second conductive interconnect is laterally distant from the magnetic junction and the second structure.Type: GrantFiled: March 27, 2019Date of Patent: February 28, 2023Assignee: Intel CorporationInventors: Noriyuki Sato, Angeline Smith, Tanay Gosavi, Sasikanth Manipatruni, Kaan Oguz, Kevin O'Brien, Benjamin Buford, Tofizur Rahman, Rohan Patil, Nafees Kabir, Michael Christenson, Ian Young, Hui Jae Yoo, Christopher Wiegand
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Patent number: 11594270Abstract: An apparatus is provided which comprises: a magnetic junction having a magnet with perpendicular magnetic anisotropy (PMA) relative to an x-y plane of a device. In some embodiments, the apparatus comprises an interconnect partially adjacent to the structure of the magnetic junction, wherein the interconnect comprises a spin orbit material, wherein the interconnect has a pocket comprising non-spin orbit material, wherein the pocket is adjacent to the magnet of the magnetic junction. In some embodiments, the non-spin orbit material comprises metal which includes one or more of: Cu, Al, Ag, or Au.Type: GrantFiled: September 25, 2018Date of Patent: February 28, 2023Assignee: Intel CorporationInventors: Tanay Gosavi, Sasikanth Manipatruni, Chia-Ching Lin, Dmitri Nikonov, Christopher Wiegand, Ian Young
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Patent number: 11557629Abstract: A spin orbit memory device includes a material layer stack on a spin orbit electrode. The material layer stack includes a magnetic tunnel junction (MTJ) and a synthetic antiferromagnetic (SAF) structure on the MTJ. The SAF structure includes a first magnet structure and a second magnet structure separated by an antiferromagnetic coupling layer. The first magnet structure includes a first magnet and a second magnet separated by a single layer of a non-magnetic material such as platinum. The second magnet structure includes a stack of bilayers, where each bilayer includes a layer of platinum on a layer of a magnetic material such.Type: GrantFiled: March 27, 2019Date of Patent: January 17, 2023Assignee: Intel CorporationInventors: Kaan Oguz, Christopher Wiegand, Noriyuki Sato, Angeline Smith, Tanay Gosavi
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Patent number: 11508903Abstract: An insertion layer for perpendicular spin orbit torque (SOT) memory devices between the SOT electrode and the free magnetic layer, memory devices and computing platforms employing such insertion layers, and methods for forming them are discussed. The insertion layer is predominantly tungsten and improves thermal stability and perpendicular magnetic anisotropy in the free magnetic layer.Type: GrantFiled: June 28, 2018Date of Patent: November 22, 2022Assignee: Intel CorporationInventors: Angeline Smith, Ian Young, Kaan Oguz, Sasikanth Manipatruni, Christopher Wiegand, Kevin O'Brien, Tofizur Rahman, Noriyuki Sato, Benjamin Buford, Tanay Gosavi
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Patent number: 11476412Abstract: An apparatus is provided which comprises: a magnetic junction including: a first structure comprising a magnet with an unfixed perpendicular magnetic anisotropy (PMA) relative to an x-y plane of a device; a second structure comprising one of a dielectric or metal; a third structure comprising a magnet with fixed PMA, wherein the third structure has an anisotropy axis perpendicular to the plane of the device, and wherein the third structure is adjacent to the second structure such that the second structure is between the first and third structures; a fourth structure comprising an antiferromagnetic (AFM) material, the fourth structure adjacent to the third structure; a fifth structure comprising a magnet with PMA, the fifth structure adjacent to the fourth structure; and an interconnect adjacent to the first structure, the interconnect comprising spin orbit material.Type: GrantFiled: June 19, 2018Date of Patent: October 18, 2022Assignee: Intel CorporationInventors: Tanay Gosavi, Sasikanth Manipatruni, Kaan Oguz, Noriyuki Sato, Kevin O'Brien, Benjamin Buford, Christopher Wiegand, Angeline Smith, Tofizur Rahman, Ian Young
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Patent number: 11476408Abstract: A perpendicular spin orbit torque (SOT) memory device includes an electrode having a spin orbit coupling material and a perpendicular magnetic tunnel junction (pMTJ) device on a portion of the electrode. The pMTJ device includes a free magnet, a fixed magnet and a tunnel barrier layer in between, where at least one of the fixed magnet or the free magnet includes two magnetic layers and a spacer layer comprising tungsten in between.Type: GrantFiled: September 27, 2018Date of Patent: October 18, 2022Assignee: Intel CorporationInventors: Angeline Smith, Sasikanth Manipatruni, Christopher Wiegand, Tofizur Rahman, Noriyuki Sato, Benjamin Buford
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Patent number: 11444237Abstract: A spin orbit torque (SOT) memory device includes a SOT electrode having a spin orbit coupling material. The SOT electrode has a first sidewall and a second sidewall opposite to the first sidewall. The SOT memory device further includes a magnetic tunnel junction device on a portion of the SOT electrode. A first MTJ sidewall intersects the first SOT sidewall and a portion of the first MTJ sidewall and the SOT sidewall has a continuous first slope. The MTJ device has a second sidewall that does not extend beyond the second SOT sidewall and at least a portion of the second MTJ sidewall has a second slope.Type: GrantFiled: June 29, 2018Date of Patent: September 13, 2022Assignee: Intel CorporationInventors: Noriyuki Sato, Tanay Gosavi, Gary Allen, Sasikanth Manipatruni, Kaan Oguz, Kevin O'Brien, Christopher Wiegand, Angeline Smith, Tofizur Rahman, Ian Young, Ben Buford
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Patent number: 11437567Abstract: An apparatus comprises a magnetic tunnel junction (MTJ) including a free magnetic layer, a fixed magnetic layer, and a tunnel barrier between the free and fixed layers, the tunnel barrier directly contacting a first side of the free layer, a capping layer contacting the second side of the free magnetic layer and boron absorption layer positioned a fixed distance above the capping layer.Type: GrantFiled: December 28, 2016Date of Patent: September 6, 2022Assignee: Intel CorporationInventors: Justin Brockman, Christopher Wiegand, MD Tofizur Rahman, Daniel Ouelette, Angeline Smith, Juan Alzate Vinasco, Charles Kuo, Mark Doczy, Kaan Oguz, Kevin O'Brien, Brian Doyle, Oleg Golonzka, Tahir Ghani
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Patent number: 11430944Abstract: An apparatus includes a first interconnect structure above a substrate, a memory device above and coupled with the first interconnect structure in a memory region. The memory device includes a non-volatile memory element, an electrode on the non-volatile memory element, and a metallization structure on a portion of the electrode. The apparatus further includes a second interconnect structure in a logic region above the substrate, where the second interconnect structure is laterally distant from the first interconnect structure. The logic region further includes a second metallization structure coupled to the second interconnect structure and a conductive structure between the second metallization structure and the second interconnect structure. The apparatus further includes a dielectric spacer that extends from the memory device to the conductive structure.Type: GrantFiled: March 19, 2019Date of Patent: August 30, 2022Assignee: INTEL CORPORATIONInventors: Christopher Wiegand, Gokul Malyavanatham, Oleg Golonzka
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Patent number: 11411047Abstract: An apparatus is provided which comprises: a magnetic junction (e.g., a magnetic tunneling junction or spin valve). The apparatus further includes a structure (e.g., an interconnect) comprising spin orbit material, the structure adjacent to the magnetic junction; first and second transistors. The first transistor is coupled to a bit-line and a first word-line, wherein the first transistor is adjacent to the magnetic junction. The second transistor is coupled to a first select-line and a second word-line, wherein the second transistor is adjacent to the structure, wherein the interconnect is coupled to a second select-line, and wherein the magnetic junction is between the first and second transistors.Type: GrantFiled: September 11, 2018Date of Patent: August 9, 2022Assignee: Intel CorporationInventors: Sasikanth Manipatruni, Christopher Wiegand, Tanay Gosavi, Ian Young
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Patent number: 11411173Abstract: Material stacks for perpendicular spin transfer torque memory (pSTTM) devices, pSTTM devices and computing platforms employing such material stacks, and methods for forming them are discussed. The material stacks include a cladding layer of predominantly tungsten on a protective layer, which is in turn on an oxide capping layer over a magnetic junction stack. The cladding layer reduces oxygen dissociation from the oxide capping layer for improved thermal stability and retention.Type: GrantFiled: June 15, 2018Date of Patent: August 9, 2022Assignee: Intel CorporationInventors: Angeline Smith, Justin Brockman, Tofizur Rahman, Daniel Ouellette, Andrew Smith, Juan Alzate Vinasco, James ODonnell, Christopher Wiegand, Oleg Golonzka
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Patent number: 11380838Abstract: A memory device method of fabrication that includes a first electrode having a first conductive layer including titanium and nitrogen and a second conductive layer on the first conductive layer that includes tantalum and nitrogen. The memory device further includes a magnetic tunnel junction (MTJ) on the first electrode. In some embodiments, at least a portion of the first conductive layer proximal to an interface with the second conductive layer includes oxygen.Type: GrantFiled: June 29, 2018Date of Patent: July 5, 2022Assignee: Intel CorporationInventors: Justin Brockman, Conor Puls, Stephen Wu, Christopher Wiegand, Tofizur Rahman, Daniel Ouellette, Angeline Smith, Andrew Smith, Pedro Quintero, Juan Alzate-Vinasco, Oleg Golonzka
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Patent number: 11374164Abstract: Embodiments herein relate to a system, apparatus, and/or process for producing a spin orbit torque (SOT) electrode that includes a first layer with a first side to couple with a free layer of a magnetic tunnel junction (MTJ) and a second layer coupled with a second side of the first layer opposite the first side, where a value of an electrical resistance in the first SOT layer is lower than a value of an electrical resistance in the second SOT layer and where a current applied to the SOT electrode is to cause current to preferentially flow in the first SOT layer to cause a magnetic polarization of the free layer to change directions. During production of the SOT electrode, the second layer may act as an etch stop.Type: GrantFiled: June 29, 2018Date of Patent: June 28, 2022Assignee: Intel CorporationInventors: Tanay Gosavi, Sasikanth Manipatruni, Chia-Ching Lin, Kaan Oguz, Christopher Wiegand, Angeline Smith, Noriyuki Sato, Kevin O'Brien, Benjamin Buford, Ian Young, Md Tofizur Rahman
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Patent number: 11367749Abstract: A spin orbit torque (SOT) memory device includes a magnetic tunnel junction (MTJ) device with one end coupled with a first electrode and an opposite end coupled with a second electrode including a spin orbit torque material. In an embodiment, a second electrode is coupled with the free magnet and coupled between a pair of interconnect line segments. The second electrode and the pair of interconnect line segments include a spin orbit torque material. The second electrode has a conductive path cross-section that is smaller than a cross section of the conductive path in at least one of the interconnect line segments.Type: GrantFiled: June 28, 2018Date of Patent: June 21, 2022Assignee: Intel CorporationInventors: Noriyuki Sato, Angeline Smith, Tanay Gosavi, Sasikanth Manipatruni, Kaan Oguz, Kevin O'Brien, Tofizur Rahman, Gary Allen, Atm G. Sarwar, Ian Young, Hui Jae Yoo, Christopher Wiegand, Benjamin Buford
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Patent number: 11362263Abstract: A perpendicular spin orbit torque (SOT) memory device includes an electrode having a spin orbit coupling material and a magnetic tunnel junction (MTJ) device on a portion of the electrode. The electrode has a first SOC layer and a second SOC layer on a portion of the first SOC layer, where at least a portion of the first SOC layer at an interface with the second SOC layer includes oxygen.Type: GrantFiled: June 29, 2018Date of Patent: June 14, 2022Assignee: Intel CorporationInventors: Noriyuki Sato, Tanay Gosavi, Justin Brockman, Sasikanth Manipatruni, Kaan Oguz, Kevin O'Brien, Christopher Wiegand, Angeline Smith, Tofizur Rahman, Ian Young