Abstract: A display includes a display size adjustment module and a flexible display module. The display size adjustment module includes a first element and a second element. The first element includes multiple first ribs arranged at intervals. The second element includes multiple second ribs arranged at intervals and slidably engaged with the first ribs. A size of the display increases as the second element slides away from the first element and decreases as the second element slides toward the first element. The flexible display module is disposed on the display size adjustment module and is bent to a back side of the display size adjustment module. The flexible display module includes a flexible display panel and a flexible support member supporting the flexible display panel. The flexible support member is connected to the second element through at least one of magnetic attraction, electrostatic attraction, or a buckle.

Abstract: A capsule type electrophoretic display medium film and a manufacturing method thereof are provided. The capsule type electrophoretic display medium film includes a first stretchable film, a second stretchable film, and a capsule type electrophoretic display medium. The second stretchable film is disposed on the first stretchable film. The capsule type electrophoretic display medium is disposed between the first stretchable film and the second stretchable film and includes multiple capsules. At least one capsule among the capsules presents an elliptical, polygonal, or irregular shape when the capsule type electrophoretic display medium film is in a non-stretched state.

Abstract: A transistor backplane structure includes multiple pixel structures and a wire distribution layer. Each of the pixel structures includes a substrate, a transistor disposed on the substrate, and a first insulation layer disposed on the transistor. Multiple conductive vias are disposed in the first insulation layer. The wire distribution layer is disposed on the pixel structures. The stretchable electrode layer at a side of the wire distribution layer away from the pixel structure is connected to a contact of the transistor of the pixel structure through a conductive via in the first insulation layer of the pixel structure to form a pixel electrode.

Abstract: A transistor device includes a channel region, a first source/drain region adjacent to a first end of the channel region and a second source/drain region adjacent to a second end of the channel region, a gate structure disposed on the channel region, the first source/drain region and the second source/drain region, and an interlayer dielectric (ILD) structure disposed on the gate structure. The ILD structure includes a first dielectric layer including a first set of sublayers. The first set of sublayers includes a first sublayer including a first dielectric material having a first hydrogen concentration and a second sublayer including the first dielectric material having a second hydrogen concentration lower than the first hydrogen concentration. The ILD structure further includes a second dielectric layer including a second set of sublayers. The second set of sublayers includes a third sublayer including a second dielectric material different from the first dielectric material.

Abstract: A method includes forming a first dielectric layer of an interlayer dielectric (ILD) structure of a transistor device, wherein forming the first dielectric layer includes forming a first sublayer including a first dielectric material on a gate structure and forming a second sublayer including the first dielectric material on the first sublayer, wherein forming the first sublayer includes depositing the first dielectric material of the first sublayer at a first deposition rate, and wherein forming the second sublayer includes depositing the first dielectric material of the second sublayer at a second deposition rate less than the first deposition rate, and forming a second dielectric layer of the ILD structure by forming a third sublayer including a second dielectric material on the first dielectric layer using a third deposition rate, wherein the second dielectric material is different from the first dielectric material.

Abstract: A transistor device includes a channel region, a first source/drain region adjacent to a first end of the channel region and a second source/drain region adjacent to a second end of the channel region, a gate structure disposed on the channel region, the first source/drain region and the second source/drain region, and an interlayer dielectric (ILD) structure disposed on the gate structure. The ILD structure includes a first dielectric layer including a first set of sublayers. The first set of sublayers includes a first sublayer including a first dielectric material having a first hydrogen concentration and a second sublayer including the first dielectric material having a second hydrogen concentration lower than the first hydrogen concentration. The ILD structure further includes a second dielectric layer including a second set of sublayers. The second set of sublayers includes a third sublayer including a second dielectric material different from the first dielectric material.

Abstract: A flexible display device includes a supporting layer and a flexible display panel. The supporting layer has two non-folding regions and a folding region between the two non-folding regions. The folding region has a central region and two edge regions. Each of the edge regions is located between one of the two non-folding regions and the central region, and open porosities of the two edge regions are different from an open porosity of the central region. The flexible display panel is located on the supporting layer.

Abstract: A display device includes a driving substrate, an electronic ink layer, and a conductive barrier layer. The electronic ink layer is located on the driving substrate. The conductive barrier layer is located on the electronic ink layer, the conductive barrier layer includes a conductive layer and a base layer, the conductive layer is located between the base layer and the electronic ink layer, and the conductive layer is separated from the electronic ink layer.

Abstract: Embodiments described herein relate to engineering metal oxide layer interfaces to improve electronic device stability. For example, a transistor device can include a base structure and a metal oxide layer disposed on the base structure. The metal oxide layer includes at least one region having a gradient profile with respect to oxygen (O2) composition.

Abstract: A scrollable device including a fixture, a flexible display panel and a scroll device having a roller, a roller end cap and a torsion spring is provided. One side of the flexible display panel is connected to the fixture, while the other side is connected to the cylindrical surface of the roller. The roller end cap is rotatably disposed on the end part of the roller, and the torsion spring is inside the roller. One end of the torsion spring is connected to the roller, while the other end is connected to the roller end cap. When a relative rotation between the roller and the roller end cap is occurred, the torsion spring is rotated and deformed to form a restoring force. This restoring force can drive the roller to rotate relative to the roller end cap, thereby making the flexible display panel to roll up along the roller.

Abstract: A shapable display device includes a first deformable substrate, a first stretchable electrode layer, a stretchable display medium layer, and a second stretchable electrode layer. The first stretchable electrode layer is disposed on the first deformable substrate. The stretchable display medium layer is disposed on the first stretchable electrode layer. The second stretchable electrode layer is disposed on the stretchable display medium layer. The stretchable display medium layer is between the first stretchable electrode layer and the second stretchable electrode layer.

Abstract: An array substrate includes a substrate, a gate line, multiple active elements, a protective layer, a pixel electrode, and an extension electrode. The substrate has an active area and a peripheral area. The gate line and the active elements are disposed in the active area of the substrate. The protective layer is disposed on the substrate and covers the gate lines and the active elements. The protective layer has multiple openings-exposing a portion of the gate line and a portion of the active elements. The pixel electrode is extended to and disposed in the openings of the protective layer to electrically connect to the gate line and the active elements. The extension electrode is disposed in the peripheral area and located on the protective layer. A portion of the extension electrode is extended to and overlapped with the pixel electrode and is electrically connected to the pixel electrode.

Abstract: An electronic paper display device includes a frame, an upper protective layer, a lower protective layer, a flexible substrate, a reinforcing layer, and a front panel. The upper protective layer and the lower protective layer are respectively located on a top surface and a bottom surface of the frame. The flexible substrate extends from the upper protective layer to the lower protective layer. The flexible substrate has a first area located on the upper protective layer, a second area located on the lower protective layer, a bending area, and two non-deformed areas. One of the two non-deformed areas is located between the first area and the bending area, and another one of the two non-deformed areas is located between the second area and the bending area. The reinforcing layer is located on the flexible substrate. The front panel is located on the first area.

Abstract: A flexible display panel includes a bottom support layer, a backside protective film layer, a display layer and a frontside protective film layer. The bottom support layer includes an adhesive area and a buffer area. The adhesive area is located at an end of the bottom support layer. The buffer area is adjacent to the side of the adhesive area. The backside protective film layer is located on the bottom support layer. The display layer is located on the backside protective film layer. An interface of the adhesive area and the buffer area and an edge of the display layer are misaligned in a vertical direction. The frontside protective film layer is located on the display layer. A portion of the frontside protective film layer adheres to the backside protective film layer.

Abstract: A display device includes a driving substrate, a display medium layer, a conductive material, a protection assembly and a conductive terminal. The driving substrate includes a first portion, a second portion and a bent portion connecting the first portion and the second portion. The display medium layer is disposed on the first portion of the driving substrate. The conductive material is disposed on the second portion of the driving substrate. The protection assembly is disposed on the first portion of the driving substrate and located on the display medium layer. The protection assembly includes a film and a transparent conductive layer. The transparent conductive layer is disposed on the film and faces the display medium layer. The conductive terminal is connected to the protection assembly, and electrically connected to the transparent conductive layer and the conductive material.

Abstract: A display device includes a driving substrate, a display medium layer and a material layer. The display medium layer is disposed on the driving substrate. The material layer is disposed on a side of the display medium layer, and extends to the driving substrate. The material layer is a material layer with conductivity properties.

Abstract: An electrothermal module includes a first conductive layer, a second conductive layer, and a heat generating layer. The first conductive layer and the second conductive layer respectively include silver metal. The heat generating layer has a first portion, the first portion is disposed between the first conductive layer and the second conductive layer to form an electrothermal conversion portion of the electrothermal module, and the heat generating layer includes a conductive carbon material.

Abstract: An electrothermal module includes a first conductive layer, a second conductive layer, and a heat generating layer. The first conductive layer and the second conductive layer respectively include silver metal. The heat generating layer has a first portion, the first portion is disposed between the first conductive layer and the second conductive layer to form an electrothermal conversion portion of the electrothermal module, and the heat generating layer includes a conductive carbon material.

Abstract: We disclose herein a viable, cost efficient method for the instantaneous production of hydrogen gas. Hydrogen gas production is increased by utilizing solar and lunar energy. The hydrogen gas is generated spontaneously by the reaction of sodium hydroxide and aluminum as corrosion occurs, forming a layer of aluminum oxide upon the aluminum. This aluminum oxide layer prevents further reaction of sodium hydroxide and aluminum, and thus no more hydrogen gas is produced. Production of aluminum oxide can be bypassed by adding acetic acid or sodium acetate to the reaction. In this reaction the products are aluminum hydroxide and hydrogen gas. Thus, we disclose herein a method that prevents of the formation of aluminum oxide by the use of sodium acetate or acetic acid, the use of iron as a catalyst, and the enhancement of the reaction using natural light.

Abstract: A method (480, 580) of depositing layers of a thin-film transistor on a substrate using a sputter deposition source comprising at least one first pair of electrodes and at least one second pair of electrodes, the method comprising moving (482, 582) the substrate to a first vacuum chamber; depositing (484, 584) a first layer of the layers on the substrate by supplying the at least one first pair of electrodes with bipolar pulsed DC voltage, wherein a first material of the first layer comprises a first metal oxide; moving (486, 586) the substrate from the first vacuum chamber to a second vacuum chamber without a vacuum break; and depositing (488, 588) a second layer of the layers on the first layer by supplying the at least one second pair of electrodes with bipolar pulsed DC voltage, wherein a second material of the second layer comprises a second metal oxide, the second material being different from the first material.