Abstract: The present invention discloses a Nanowire Field Effect Transistor Detection Device and the Detection Method thereof. The Nanowire Field Effect Transistor Detection Device of the present invention comprises: gate oxide, SiNW chip, surface oxide, and surface molecule layer. The circuit structure of the Nanowire Field Effect Transistor Detection Device comprises a first resistor, a second resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, an AC voltage source, and an ammeter. In addition, the present invention provides a method for attaching the probe Ni-NTA to the Nanowire Field Effect Transistor Detection Device. Furthermore, the present invention provides a method for attaching the isooctyl trimethoxysilane molecule to the Nanowire Field Effect Transistor Detection Device.

Abstract: A pipe shears includes a base, a ratchet plate pivotally connected to the base, a cutter blade detachably mounted to the ratchet plate, a positioning member mounted between an elongated hole of the ratchet plate and a positioning groove of the cutter blade, and a push rod inserted in the base and stopped against a stop member. When the push rod is not pushed, it is positioned in the elongated hole of the ratchet plate and stopped against the positioning member to force the positioning member into engagement with the positioning groove of the cutter blade, and the cutter blade is not detachable at this time. When the push rod is pushed, the stop member is moved out of the elongated hole of the ratchet plate to unlock the positioning member from the positioning groove of the cutter blade for allowing removal of the cutter blade.

Abstract: A linkage mechanism including a base, at least one first linking rod, a first linkage member and a driving member is provided. Each of the at least one first linking rod includes a first pivot portion and a second pivot portion. Each of the first linking rod is pivoted to the base via the first pivot portion. The first linking member includes a first engaged portion and a first groove along a first direction. Each of the first linking rod is pivoted in the first groove of the first linkage member via the second pivot portion. The first linking rod is connected to the driving member. When the driving member is located at an unlocked position, the first engaged portion is retracted inside the base. When the driving member is moved from the unlocked position to a locked position, the first linking rod is driven by the driving member, so that the first linkage member is moved along a second direction, and the first engaged portion protrudes from the base. An electronic device is further provided.

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.

Abstract: An electronic device includes a base, a pivoting component, a display and a supporting component. The base has an upper side and a lower side and is suitable to be placed on a surface. The pivoting component is pivotally connected to a rear end of the base. The display is connected to the pivoting component and suitable to be unfolded or closed at the upper side of the base by the pivoting of the pivoting component. The supporting component is pivotally connected to the lower side of the base and suitable to be unfolded or closed at the lower side of the base. When the display is unfolded on the base, an end of the display slides along the supporting component, and the supporting component is unfolded on the base and supports the pivoting component and the rear end of the base away from the surface.

Abstract: A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

Abstract: A pipe shears includes a base, a ratchet plate pivotally connected to the base, a cutter blade detachably mounted to the ratchet plate, a positioning member mounted between an elongated hole of the ratchet plate and a positioning groove of the cutter blade, and a push rod inserted in the base and stopped against a stop member. When the push rod is not pushed, it is positioned in the elongated hole of the ratchet plate and stopped against the positioning member to force the positioning member into engagement with the positioning groove of the cutter blade, and the cutter blade is not detachable at this time. When the push rod is pushed, the stop member is moved out of the elongated hole of the ratchet plate to unlock the positioning member from the positioning groove of the cutter blade for allowing removal of the cutter blade.

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract: A card edge connector includes an insultive housing, a plurality of conductive terminals retained in the insultive housing and a metal frame retained in the insultive housing. The insultive housing defines two sidewalls extending along a longitudinal direction and two endwalls connected to the longitudinal ends of the sidewalls. The metal frame is integrally formed in the insulative housing and defines an elongated flat portion and a pair of fixing portions extending downwardly from both longitudinal ends of the flat portion, the flat portion is embedded into an upper portion of the insulative housing.

Abstract: A flexible electronic device including a flexible panel and an auxiliary layer is provided. The flexible panel has a plurality of operation portions, wherein a predetermined bending portion disposed between each adjacent two of the operation portions. The auxiliary layer is disposed on a surface of the flexible panel and at least located above the predetermined bending portion. The predetermined bending portion of the flexible panel may be bent in a first bending state for the auxiliary layer to be in contact with the predetermined bending portion, and a radius of curvature of the auxiliary layer is greater than a radius of curvature of the predetermined bending portion. The flexible electronic device has a first compressive stress region and a first tensile stress region, and a range of the first compressive stress region is greater than a range of the first tensile stress region.

Abstract: According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.

Abstract: Embodiments of the disclosure generally provide methods of forming a capacitor with high capacitance and low leakage as well as a good interface control for thin film transistor (TFT) applications. In one embodiment, a thin film transistor structure includes a capacitor formed in a thin film transistor device. The capacitor further includes a common electrode disposed on a substrate, a dielectric layer formed on the common electrode and a pixel electrode formed on the dielectric layer. An interface protection layer formed between the common electrode and the dielectric layer, or between the dielectric layer and the pixel electrode. A gate insulating layer fabricated by a high-k material may also be utilized in the thin film transistor structure.

Abstract: A portable electronic-device adapted to photograph an object including a first camera module, a second camera module, a processing unit and a control unit. The first camera module obtains a first reference image according to a first predetermined focal length. The second camera module obtains a second reference image according to a second predetermined focal length. The processing unit determines the photographed focal length according to the first reference image and the second reference image. The control unit controls the first camera module or the second camera module to photograph the object according to the photographed focal length. The first camera module and the second camera module face toward a direction corresponding to the object.

Abstract: A card edge connector includes an insultive housing, a plurality of conductive terminals retained in the insultive housing and a metal frame retained in the insultive housing. The insultive housing defines two sidewalls extending along a longitudinal direction and two endwalls connected to the longitudinal ends of the sidewalls. The metal frame is integrally formed in the insulative housing and defines an elongated flat portion and a pair of fixing portions extending downwardly from both longitudinal ends of the flat portion, the flat portion is embedded into an upper portion of the insulative housing.

Abstract: A device is for removing a first substrate from a second substrate or adhering the first substrate to the second substrate. The device includes a carrier, a flexible member and a supporting member. The carrier is for fixing the first substrate. The flexible member is for fixing the second substrate. The supporting member is connected to the carrier and the flexible member. The carrier and the flexible member are spaced a distance from each other. The carrier, the flexible member and the supporting member together define a first variable pressure chamber. The first variable pressure chamber has a first air hole.

Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.

Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.

Abstract: According to embodiments of the disclosure, an electronic device package may include a wire layer and a rigid element. The wire layer includes a first surface and a second surface opposite to each other, and the second surface of the wire layer has at least one coarse structure. A portion of the second surface having the coarse structure has a greater roughness than another portion of the second surface. The rigid element is disposed on the first surface of the wire layer, wherein a stiffness of the rigid element is greater than a stiffness of the wire layer and a projection area of the coarse structure on the first surface of the wire layer overlaps an edge of the rigid element.

Abstract: A dynamic exposure adjusting method and an electronic apparatus using the same are provided. The method includes the following steps: capturing a plurality of preview images, a plurality of additional images and a first image, wherein the additional images are not displayed in a display unit of the electronic apparatus; analyzing a luminance distribution condition of the first image; obtaining a long exposure time and a short exposure time according to the luminance distribution condition; retrieving at least one specific image corresponding to the long exposure time and the short exposure time from the additional images; combining the first image with the at least one specific image as a processed image.