Abstract: A display device and a display method thereof are provided. The display device includes a display, a light sensing element, and a processor. The display is configured to display an image content. The light sensing element is configured to acquire ambient light information. The processor is coupled to the display and the light sensing element, is configured to provide the image content to the display, and adjusts an output color temperature of the display toward an ambient color temperature according to the ambient light information.

Abstract: A display device and a display method thereof are provided. The display device includes a display, a light sensing element, and a processor. The display is configured to display an image content. The light sensing element is configured to acquire ambient light information. The processor is coupled to the display and the light sensing element, is configured to provide the image content to the display, and adjusts an output color temperature of the display toward an ambient color temperature according to the ambient light information.

Abstract: An insect trap device includes a housing, a sticky board, and at least one LED light bar. The housing is formed with a plurality of holes. The sticky board is arranged on a bottom of the housing. The sticky board has a surface coated with insect sticking glue. The at least one LED light bar is arranged in an interior of the housing to form indirect lighting and emit a wavelength of insect luring light. As such, the at least one LED light bar emits light that attracts insects to enter through the plurality of holes of the housing to get stuck to the sticky board.

Abstract: A method for fabricating a semiconductor memory device is disclosed. A substrate having a main surface is provided. A memory gate is formed on the main surface of the substrate. The memory has a first sidewall and a second sidewall opposite to the first sidewall. A control gate is formed in proximity to the memory gate. The control gate has a third sidewall directly facing the second sidewall, and a fourth sidewall opposite to the third sidewall. A gap is formed between the second sidewall of the memory gate and the third sidewall of the control gate. A first single spacer structure is formed on the first sidewall of the memory gate and a second single spacer structure on the fourth sidewall of the control gate. A gap-filling layer is formed to fill up the gap.

Abstract: A method for fabricating a semiconductor memory device is disclosed. A substrate having a main surface is provided. A memory gate is formed on the main surface of the substrate. The memory has a first sidewall and a second sidewall opposite to the first sidewall. A control gate is formed in proximity to the memory gate. The control gate has a third sidewall directly facing the second sidewall, and a fourth sidewall opposite to the third sidewall. A gap is formed between the second sidewall of the memory gate and the third sidewall of the control gate. A first single spacer structure is formed on the first sidewall of the memory gate and a second single spacer structure on the fourth sidewall of the control gate. A gap-filling layer is formed to fill up the gap.

Abstract: A semiconductor device includes a substrate, having a cell region and a core region. A plurality of gate structures is disposed on the substrate in the cell region. Each of the gate structures has a spacer on a sidewall of the gate structures. The gate structure includes a charge storage layer, on the substrate; a first polysilicon layer on the charge storage layer; and a mask layer on the first polysilicon layer, the mask layer comprising a first polishing stop layer on top. A preliminary material layer also with the first polishing stop layer on top is disposed on the substrate at the core region. A second polysilicon layer is filled between the gate structures at the cell region. A second polishing stop layer is on the second polysilicon layer. The first polishing stop layer and the second polishing stop layer are same material and same height.

Abstract: A semiconductor memory device includes a memory gate disposed on a main surface of a substrate. The memory has a first sidewall and a second sidewall opposite to the first sidewall. A control gate is in proximity to the memory gate. The control gate has a third sidewall directly facing the second sidewall, and a fourth sidewall opposite to the third sidewall. A gap is provided between the second sidewall of the memory gate and the third sidewall of the control gate. A first single spacer structure is disposed on the first sidewall of the memory gate. A second single spacer structure is disposed on the fourth sidewall of the control gate. A gap-filling layer is deposited into the gap and fills up the gap.

Abstract: A memory structure including a substrate, a first gate structure, a second gate structure, a first spacer, a second spacer, and a third spacer is provided. The first gate structure includes a first gate and a charge storage layer. The charge storage layer is disposed between the first gate and the substrate. The second gate structure is disposed on the substrate. The second gate structure includes a second gate. A height of the first gate is higher than a height of the second gate. The first spacer and the second spacer are respectively disposed on one sidewall and the other sidewall of the first gate structure. The first spacer is located between the first gate structure and the second gate structure. The third spacer is disposed on a sidewall of the first spacer and covers a portion of a top surface of the second gate.

Abstract: A semiconductor memory device includes a memory gate disposed on a main surface of a substrate. The memory has a first sidewall and a second sidewall opposite to the first sidewall. A control gate is in proximity to the memory gate. The control gate has a third sidewall directly facing the second sidewall, and a fourth sidewall opposite to the third sidewall. A gap is provided between the second sidewall of the memory gate and the third sidewall of the control gate. A first single spacer structure is disposed on the first sidewall of the memory gate. A second single spacer structure is disposed on the fourth sidewall of the control gate. A gap-filling layer is deposited into the gap and fills up the gap.

Abstract: A communication system with train bus architecture is described. The communication system with the train bus architecture comprises a coupling device for transmitting a first instruction packet string having instruction packets via first path; the controlled module for receiving the first instruction packet string via first path, wherein the controlled module selects one instruction packet from the instruction packets, replaces the selected instruction packet by first response packet for forming second instruction packet string, and processes the selected instruction packet to generate a second response packet; and a terminal device for receiving the second instruction packet string via the first path, and for transmitting the second instruction packet string back to the coupling device via the at least one controlled module along a second path from the terminal device to the coupling device wherein the first path is connected to the second path to form train bus architecture.

Abstract: A semiconductor memory device includes a substrate, having a plurality of cell regions, wherein the cell regions are parallel and extending along a first direction. A plurality of STI structures is disposed in the substrate, extending along the first direction to isolate the cell regions, wherein the STI structures have a uniform height lower than the substrate in the cell regions. A selection gate line is extending along a second direction and crossing over the cell regions and the STI structures. A control gate line is adjacent to the selection gate line in parallel extending along the second direction and also crosses over the cell regions and the STI structures. The selection gate line and the control gate line together form a two-transistor (2T) memory cell.

Abstract: A communication system with train bus architecture is described. The communication system with the train bus architecture comprises a coupling device for transmitting a first instruction packet string having instruction packets via first path; the controlled module for receiving the first instruction packet string via first path, wherein the controlled module selects one instruction packet from the instruction packets, replaces the selected instruction packet by first response packet for forming second instruction packet string, and processes the selected instruction packet to generate a second response packet; and a terminal device for receiving the second instruction packet string via the first path, and for transmitting the second instruction packet string back to the coupling device via the at least one controlled module along a second path from the terminal device to the coupling device wherein the first path is connected to the second path to form train bus architecture.

Abstract: A communication structure with connecting assembly is described. The communication structure comprises a housing base, a circuit board, a connecting assembly and a cover body wherein the connecting assembly comprises a plurality of conducting terminals, an adapting board coupled to the conducting terminals, and a first connecting socket coupled to the adapting board. The communication structure stably and electrically connected to another communication structure by the connecting assembly and at least two communication structures are electrically connected together to construct a communication system for conveniently expending more communication nodes.

Abstract: A heat spreading/temperature uniformity device for a bake oven is disclosed. The heat spreading/temperature uniformity device is applicable to the bake oven, including at least one rack body movably disposed in a receiving space defined by the bake oven, and multiple heat spreading members distributed over and arranged on the rack body and integrally connected therewith. Each heat spreading member and the rack body contain a first angle and a second angle. The heat spreading/temperature uniformity device is up and down adjustably disposed in the bake oven for transferring heat to the relatively low heating intensity areas of the receiving space in the form of heat radiation. Accordingly, the food placed in the bake oven can be uniformly heated at a uniform heating intensity and a uniform temperature.

Abstract: An LED bulb includes a bulb body and an adapter detachably connecting with the bulb body. The bulb body has two pins function as a negative electrode and a positive electrode. The two pins are for inserting into and electrically connecting with a bi-pin socket connector for light bulb, such as MR16 socket connector. The adapter includes a junction seat, a first connector, a second connector, and a bulb cap. Metallic threads are formed on the bulb cap. The first connector is received in the junction seat and electrically contacts the threads. The second connector extends through the junction seat and the bulb cap to make a bottom end thereof being exposed. The adapter is able to engage and electrically connect with an Edison screw socket connector, for example, E-10 socket connector.

Abstract: A temperature sensing device includes a bandgap voltage generator, N mirror current sources, a temperature voltage generator, and a temperature calculating unit. The mirror current sources mirror N mirror currents according to a positive temperature coefficient current. The temperature voltage generator sets the conducting number M of the mirror current sources based on a control signal, so as to generate a temperature voltage. The temperature calculating unit gradually counts the control signal and compares a potential of the temperature voltage with a potential of a reference voltage generated by the bandgap voltage generator after counting the control signal, so as to calculate and obtain temperature information. Thus, the temperature sensing device controls the conducting number M of the mirror current sources to generate the temperature voltage instead of applying serially-connected resistors, so as to reduce a circuit area of the temperature sensing device and reduce noise.

Abstract: An LED bulb includes a bulb body and an adapter detachably connecting with the bulb body. The bulb body has two pins function as a negative electrode and a positive electrode. The two pins are for inserting into and electrically connecting with a bi-pin socket connector for light bulb, such as MR16 socket connector. The adapter includes a junction seat, a first connector, a second connector, and a bulb cap. Metallic threads are formed on the bulb cap. The first connector is received in the junction seat and electrically contacts the threads. The second connector extends through the junction seat and the bulb cap to make a bottom end thereof being exposed. The adapter is able to engage and electrically connect with an Edison screw socket connector, for example, E-10 socket connector.

Abstract: A speaker control method includes steps of detecting whether there is any audio signal input; outputting a first voltage signal if there is no audio signal input; outputting a second voltage signal if there is an audio signal input; and selectively turning off an audio amplifier according to the first voltage signal or turning on the audio amplifier according to the second voltage signal, wherein the audio amplifier is used for driving a speaker.

Abstract: A modular door case for bathing enclosure includes two jambs, two frame members, and four fasten components. Each frame member has an accommodating portion at ends thereof, and at least one pair clasp holes respectively formed on upper and lower walls of the accommodating portion. Each fasten component has a base, at least one pair of clasp members, and at least one compelling bolt. A clasp protrusion is disposed at opposite distal end of each clasp member, so that space between the pair of clasp members, in normal state, shrinks from the joint ends to the distal ones. Each clasp protrusion of the clasp member contacts each clasp hole of the frame member, while the base inserts into each accommodating portion. The compelling bolt is between the pair of the clasp members, and further capable of moving towards the distal ends of the clasp members.

Abstract: A modular door case for bathing enclosure includes two jambs, top and bottom frame members, and four fasten components. Each frame member has an accommodating portion disposed at ends thereof, and at least one pair clasp holes respectively formed on upper and lower walls of the accommodating portion. Each fasten component has a base, at least one pair of clasp members above and below, and at least one compelling bolt. A clasp protrusion is disposed at opposite distal end of each clasp member, so that space between the pair of clasp members, in normal state, shrinks from the joint ends to the distal ones. Each clasp protrusion of the clasp member contacts each clasp hole of the frame member, while the base inserts into each accommodating portion. The compelling bolt is between the pair of the clasp members, and further capable of moving towards the distal ends of the clasp members to shove the clasp members for engaging with each clasp hole.