Patents by Inventor Chuan Jin
Chuan Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8836134Abstract: A method of fabricating a semiconductor stacked package is provided. A singulation process is performed on a wafer and a substrate, on which the wafer is stacked. A portion of the wafer on a cutting region is removed, to form a stress concentrated region on an edge of a chip of the wafer. The wafer and the substrate are then cut, and a stress is forced to be concentrated on the edge of the chip of the wafer. As a result, the edge of the chip is warpaged. Therefore, the stress is prevented from extending to the inside of the chip. A semiconductor stacked package is also provided.Type: GrantFiled: January 10, 2013Date of Patent: September 16, 2014Assignee: Xintec Inc.Inventors: Po-Shen Lin, Chuan-Jin Shiu, Bing-Siang Chen, Chen-Han Chiang, Chien-Hui Chen, Hsi-Chien Lin, Yen-Shih Ho
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Patent number: 8785956Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer.Type: GrantFiled: July 27, 2012Date of Patent: July 22, 2014Inventors: Chuan-Jin Shiu, Po-Shen Lin, Yi-Ming Chang, Hui-Ching Yang, Chiung-Lin Lai
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Patent number: 8779452Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer disposed on the second surface of the substrate, wherein the protection layer has an opening; a conducting bump disposed on the second surface of the substrate and filled in the opening; a conducting layer disposed between the protection layer and the substrate, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump; and a light shielding layer disposed on the protection layer, wherein the light shielding layer does not contact with the conducting bump.Type: GrantFiled: September 1, 2011Date of Patent: July 15, 2014Inventors: Tzu-Hsiang Hung, Hsin-Chih Chiu, Chuan-Jin Shiu, Chia-Sheng Lin, Yen-Shih Ho, Yu-Min Liang
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Patent number: 8633558Abstract: The embodiment provides a package structure for a chip and a method for fabricating the same. The package structure for the chip includes a chip having a substrate and a bonding pad structure. The chip has an upper surface and a lower surface. An upper packaging layer covers the upper surface of the chip. A spacer layer is between the upper packaging layer and the chip. A conductive path is electrically connected to the bonding pad structure. An anti-reflective layer is disposed between the spacer layer and the upper packaging layer. An overlapping region is between the anti-reflective layer and the spacer layer.Type: GrantFiled: December 30, 2010Date of Patent: January 21, 2014Inventors: Ta-Hsuan Lin, Chuan-Jin Shiu, Chia-Ming Cheng, Tsang-Yu Liu
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Patent number: 8604578Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer located on the second surface of the substrate, wherein the protection layer has an opening; a light shielding layer located on the second surface of the substrate, wherein a portion of the light shielding layer extends into the opening of the protection layer; a conducting bump disposed on the second surface of the substrate and filled in the opening of the protection layer; and a conducting layer located between the substrate and the protection layer, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump.Type: GrantFiled: October 21, 2011Date of Patent: December 10, 2013Inventors: Hsin-Chih Chiu, Chia-Ming Cheng, Chuan-Jin Shiu, Bai-Yao Lou
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Patent number: 8575634Abstract: The present invention provides a chip package, including: a chip having a semiconductor device thereon; a cap layer over the semiconductor device; a spacer layer between the chip and the cap layer, wherein the spacer layer surrounds the semiconductor device and forms a cavity between the chip and the cap layer; and an anti-reflective layer between the cap layer and the chip, wherein the anti-reflective layer has a overlapping region with the spacer layer and extends into the cavity. Furthermore, a method for fabricating a chip package is also provided.Type: GrantFiled: December 30, 2010Date of Patent: November 5, 2013Inventors: Tsang-Yu Liu, Yu-Lin Yen, Chuan-Jin Shiu, Po-Shen Lin
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Patent number: 8536671Abstract: According to an embodiment of the invention, a chip package is provided, which includes: a substrate having a first surface and a second surface; an optical device between the first surface and the second surface of the substrate; a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening; at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device; and a light shielding layer formed on the protection layer, wherein the light shielding layer is further extended onto a sidewall of the opening of the protection layer.Type: GrantFiled: June 6, 2011Date of Patent: September 17, 2013Inventors: Tsang-Yu Liu, Yu-Lin Yen, Chuan-Jin Shiu, Po-Shen Lin
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Patent number: 8448658Abstract: A rescue device for treating leakage of dangerous chemical includes a first container having a closed negative pressure chamber and an intake which allows outside dangerous chemicals to enter the first container and a second container installed and fixed in the first container. The second container contains a substantially harmless liquefied gas and has an opening which controllably communicates with the external environment. When the dangerous chemicals are leaking, the rescue device can be used to reduce the loss of dangerous chemical, alleviate the harm to the environment and human, and avoid the possible disastrous consequences.Type: GrantFiled: July 6, 2009Date of Patent: May 28, 2013Assignee: Beijing Tianqing Chemicals Co, Ltd.Inventors: Yuechun Jin, Junbo Zhang, Chuan Jin
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Patent number: 8431946Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optical device disposed on the first surface; a conducting pad disposed on the first surface; a first alignment mark formed on the first surface; and a light shielding layer disposed on the second surface and having a second alignment mark, wherein the second alignment mark corresponds to the first alignment mark.Type: GrantFiled: May 24, 2011Date of Patent: April 30, 2013Inventors: Hsin-Chih Chiu, Chia-Ming Cheng, Chuan-Jin Shiu, Bai-Yao Lou
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Patent number: 8384174Abstract: A chip package includes: a substrate having a first and a second surfaces; an optical device on the first surface; a conducting layer on the second surface; a passivation layer on the second surface and the conducting layer, wherein the passivation layer has an opening exposing the conducting layer; a conducting bump on the second surface and having a bottom and an upper portions, wherein the bottom portion is disposed in the opening and electrically contacts the conducting layer, and the upper portion is located outside of the opening and extends along a direction away from the opening; a recess extending from a surface of the conducting bump toward an inner portion of the conducting bump; and a light shielding layer on the second surface, extending under the upper portion, and partially located in the recess and overlapping a portion of the conducting bump.Type: GrantFiled: March 23, 2011Date of Patent: February 26, 2013Inventors: Hsin-Chih Chiu, Chia-Ming Cheng, Chuan-Jin Shiu, Bai-Yao Lou
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Publication number: 20130045549Abstract: An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.Type: ApplicationFiled: August 17, 2012Publication date: February 21, 2013Inventors: Chuan-Jin SHIU, Po-Shen LIN, Shen-Yuan MAO, Cheng-Chi PENG
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Publication number: 20130026523Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer.Type: ApplicationFiled: July 27, 2012Publication date: January 31, 2013Inventors: Chuan-Jin SHIU, Po-Shen LIN, Yi-Ming CHANG, Hui-Ching YANG, Chiung-Lin LAI
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Publication number: 20130001621Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a light shielding layer disposed on the second surface of the substrate and directly contacting with the conducting layer, wherein the light shielding layer has a light shielding rate of more than about 80% and has at least an opening exposing the conducting layer; and a conducting bump disposed in the opening of the light shielding layer to electrically contact with the conducting layer, wherein all together the light shielding layer and the conducting bump substantially and completely cover the second surface of the substrate.Type: ApplicationFiled: June 28, 2012Publication date: January 3, 2013Inventors: Chuan-Jin SHIU, Po-Shen LIN, Yi-Ming CHANG
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Publication number: 20120097999Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer located on the second surface of the substrate, wherein the protection layer has an opening; a light shielding layer located on the second surface of the substrate, wherein a portion of the light shielding layer extends into the opening of the protection layer; a conducting bump disposed on the second surface of the substrate and filled in the opening of the protection layer; and a conducting layer located between the substrate and the protection layer, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump.Type: ApplicationFiled: October 21, 2011Publication date: April 26, 2012Inventors: Hsin-Chih CHIU, Chia-Ming CHENG, Chuan-Jin SHIU, Bai-Yao LOU
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Publication number: 20120056226Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer disposed on the second surface of the substrate, wherein the protection layer has an opening; a conducting bump disposed on the second surface of the substrate and filled in the opening; a conducting layer disposed between the protection layer and the substrate, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump; and a light shielding layer disposed on the protection layer, wherein the light shielding layer does not contact with the conducting bump.Type: ApplicationFiled: September 1, 2011Publication date: March 8, 2012Inventors: Tzu-Hsiang HUNG, Hsin-Chih CHIU, Chuan-Jin SHIU, Chia-Sheng LIN, Yen-Shih HO, Yu-Min LIANG
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Publication number: 20110308976Abstract: A rescue device for treating leakage of dangerous chemical includes g a first container having a closed negative pressure chamber and an intake which allows outside dangerous chemicals to enter the first container, and a second container installed and fixed in the first container. The second container contains a substantially harmless liquefied gas and has an opening which controllably communicates with the external environment. When the dangerous chemicals are leaking, the rescue device can be used to reduce the loss of dangerous chemical, alleviate the harm to the environment and human, and avoid the possible disastrous consequences.Type: ApplicationFiled: July 6, 2009Publication date: December 22, 2011Inventors: Yuechun Jin, Junbo Zhang, Chuan Jin
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Publication number: 20110297242Abstract: A rescue device for treating leakage of dangerous chemical includes a first container having a closed negative pressure chamber and an intake which allows outside dangerous chemicals to enter the first container and a second container installed and fixed in the first container. The second container contains a substantially harmless liquefied gas and has an opening which controllably communicates with the external environment. When the dangerous chemicals are leaking, the rescue device can be used to reduce the loss of dangerous chemical, alleviate the harm to the environment and human, and avoid the possible disastrous consequences.Type: ApplicationFiled: July 6, 2009Publication date: December 8, 2011Inventors: Yuechun Jin, Junbo Zhang, Chuan Jin
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Publication number: 20110298000Abstract: According to an embodiment of the invention, a chip package is provided, which includes: a substrate having a first surface and a second surface; an optical device between the first surface and the second surface of the substrate; a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening; at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device; and a light shielding layer formed on the protection layer, wherein the light shielding layer is further extended onto a sidewall of the opening of the protection layer.Type: ApplicationFiled: June 6, 2011Publication date: December 8, 2011Inventors: Tsang-Yu LIU, Yu-Lin YEN, Chuan-Jin SHIU, Po-Shen LIN
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Publication number: 20110291139Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optical device disposed on the first surface; a conducting pad disposed on the first surface; a first alignment mark formed on the first surface; and a light shielding layer disposed on the second surface and having a second alignment mark, wherein the second alignment mark corresponds to the first alignment mark.Type: ApplicationFiled: May 24, 2011Publication date: December 1, 2011Inventors: Hsin-Chih CHIU, Chia-Ming Cheng, Chuan-Jin SHIU, Bai-Yao LOU
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Publication number: 20110233770Abstract: A chip package includes: a substrate having a first and a second surfaces; an optical device on the first surface; a conducting layer on the second surface; a passivation layer on the second surface and the conducting layer, wherein the passivation layer has an opening exposing the conducting layer; a conducting bump on the second surface and having a bottom and an upper portions, wherein the bottom portion is disposed in the opening and electrically contacts the conducting layer, and the upper portion is located outside of the opening and extends along a direction away from the opening; a recess extending from a surface of the conducting bump toward an inner portion of the conducting bump; and a light shielding layer on the second surface, extending under the upper portion, and partially located in the recess and overlapping a portion of the conducting bump.Type: ApplicationFiled: March 23, 2011Publication date: September 29, 2011Inventors: Hsin-Chih CHIU, Chia-Ming Cheng, Chuan-Jin Shiu, Bai-Yao Lou