Abstract: A ubiquitous auto calibration device is provided, which includes microcontroller unit, flex bus, image receiver image processing module, and an image output unit. The microcontroller unit is provided for receiving the electronic signal and performing a self-adjusting process to the electronic signal. The flex bus is connected with the microcontroller unit, and is provided for transmitting the electronic signal to the image processing module after performing the self-adjusting process. The image receiver is provided for receiving the image signal from the image receiving interface. The image processing module is provided for performing an image calibration process to the image signal, so that the image signal can obey the color temperature standard, Gamma value, uniformity and color gamut standards when the panel outputs the image signal.

Abstract: A ubiquitous auto calibration device is provided, which includes microcontroller unit, flex bus, image receiver image processing module, and an image output unit. The microcontroller unit is provided for receiving the electronic signal and performing a self-adjusting process to the electronic signal. The flex bus is connected with the microcontroller unit, and is provided for transmitting the electronic signal to the image processing module after performing the self-adjusting process. The image receiver is provided for receiving the image signal from the image receiving interface. The image processing module is provided for performing an image calibration process to the image signal, so that the image signal can obey the color temperature standard, Gamma value, uniformity and color gamut standards when the panel outputs the image signal.

Abstract: A display correction system applied for an endoscope is provided which includes a color checker, a light-shielding tank, an endoscope has a lens that is sleeved in the light shielding tank and the lens is disposed toward the view window, the lens of the light-shielding tank is sequentially aligned the color block of the color checker through the view window to capture the image of the color block. The monitor has a captured image window which is provided for displaying the image of the color that is captured by the endoscope. The display correction device is provided for correcting the image signal from the color block that is transmitted by the endoscope, such that the image is displayed on the monitor is corresponding to the image of the electrical signal, and the color of the image on the monitor is the same as the true color of the color block.

Abstract: An automatic gamma curve setting method for the display is provided, which can automatically detect the input image as a grayscale image or a color image, and classify the input image as a grayscale image or a color image according to the image value, and automatically perform the corresponding Gamma curve to provide a diagnostic platform for the user to make a correct judgment through the correct image presentation.

Abstract: An automatic gamma curve setting method for the display is provided, which can automatically detect the input image as a grayscale image or a color image, and classify the input image as a grayscale image or a color image according to the image value, and automatically perform the corresponding Gamma curve to provide a diagnostic platform for the user to make a correct judgment through the correct image presentation.

Abstract: An infrared surface light source generating device includes a substrate layer and a carbon material layer formed on a surface of the substrate layer and having a sheet resistance value ranged between 0.01 and 1000?/?. The carbon material layer is able to emit far infrared rays when it is heated by an amount of external low-power energy to a temperature above 36° C. A method of manufacturing the above infrared surface light source generating device is also disclosed. The method includes the steps of (A) providing a substrate layer and (B) forming a carbon material layer that is located on a surface of the substrate layer and has a sheet resistance value ranged between 0.01 and 1000?/?. Since the method involves only a simplified manufacturing process, the infrared surface light source generating device can be manufactured at reduced cost.

Abstract: A manufacturing method a coating layer structure applied to a machine element includes: forming a continuous graphene structure layer on a metal substrate; and forming a coating layer on the continuous graphene structure layer for cooperatively protecting the metal substrate. The continuous graphene structure layer is disposed between the metal substrate and the coating layer to act as a buffer structure between the metal substrate and the coating layer.

Abstract: A hanging support for hanging a panel display on a flat surface includes a mounting structure and a support structure. The support structure fixes the panel display on the mounting structure. The mounting structure is mounted on the flat surface and adjusts an angle between the panel display and the flat surface. The support structure includes a top holder, a bottom holder, and a main holder. The top holder, the bottom holder, and the main holder corporately define a clamping space to clamp two opposite edges of the display panel.

Abstract: A method of fabricating integrated circuit devices is provided. The method includes forming a plurality of spaced integrated circuit dies on a semiconductor wafer and forming a dedicated test die on the semiconductor wafer adjacent the plurality of spaced integrated circuit dies, the dedicated test die including a test structure having a first width when viewed in a top view and being operable to generate wafer evaluation data. Further, the method includes forming a scribe line region interposed between the plurality of spaced integrated circuit dies, the scribe line region having a second width defined by a distance between adjacent integrated circuit dies when viewed in a top view, the second width being smaller than the first width, and the scribe line region being free of test structures.

Abstract: An infrared surface light source generating device includes a substrate layer and a carbon material layer formed on a surface of the substrate layer and having a sheet resistance value ranged between 0.01 and 1000?/?. The carbon material layer is able to emit far infrared rays when it is heated by an amount of external low-power energy to a temperature above 36° C. A method of manufacturing the above infrared surface light source generating device is also disclosed. The method includes the steps of (A) providing a substrate layer and (B) forming a carbon material layer that is located on a surface of the substrate layer and has a sheet resistance value ranged between 0.01 and 1000?/?. Since the method involves only a simplified manufacturing process, the infrared surface light source generating device can be manufactured at reduced cost.

Abstract: A method of producing reduced graphene oxide includes the steps of selecting a substrate; forming a carbon layer on a top of the substrate through sputter deposition or vapor deposition; subjecting the substrate and the carbon layer to an oxidation process at the same time for the carbon layer to form a graphene oxide layer; and subjecting the substrate and the graphene oxide layer to a reduction process at the same time to form a reduced graphene oxide layer on the substrate. With the method, low-cost, high-quality and large-area reduced graphene oxide sheet can be directly produced on different types of substrate, including metal and non-metal substrates.

Abstract: A method for manufacturing the image sensor device is provided. The method includes depositing a first dielectric layer over a back surface of a substrate, forming a ridge over the first dielectric layer, depositing a second dielectric layer over the first dielectric layer, including filling in a space between two adjacent ridges. The method also includes removing the ridge to form a trench in the second dielectric layer and forming a metal grid in the trench.

Abstract: A method for manufacturing the image sensor device is provided. The method includes depositing a first dielectric layer over a back surface of a substrate, forming a ridge over the first dielectric layer, depositing a second dielectric layer over the first dielectric layer, including filling in a space between two adjacent ridges. The method also includes removing the ridge to form a trench in the second dielectric layer and forming a metal grid in the trench.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate having two different topography areas adjacent to each other. A step-forming material (SFM) is deposited over the substrate. A patterned SFM is formed in the low topography area of the two areas. The formation of the patterned SFM provides a fairly planar surface across over the substrate.

Abstract: A method of fabricating integrated circuit devices is provided. The method includes forming a plurality of spaced integrated circuit dies on a semiconductor wafer and forming a dedicated test die on the semiconductor wafer adjacent the plurality of spaced integrated circuit dies, the dedicated test die including a test structure having a first width when viewed in a top view and being operable to generate wafer evaluation data. Further, the method includes forming a scribe line region interposed between the plurality of spaced integrated circuit dies, the scribe line region having a second width defined by a distance between adjacent integrated circuit dies when viewed in a top view, the second width being smaller than the first width, and the scribe line region being free of test structures.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate having two different topography areas adjacent to each other. A step-forming material (SFM) is deposited over the substrate. A patterned SFM is formed in the low topography area of the two areas. The formation of the patterned SFM provides a fairly planar surface across over the substrate.

Abstract: A method of manufacturing plastic metallized 3D circuit includes the steps of providing a 3D plastic main body; performing a surface pretreatment on the plastic main body; performing a metallization process on the plastic main body to deposit a thin metal film thereon; performing a photoresist coating process to form a photoresist protective layer on the thin metal film; performing an exposure and development process on the photoresist protective layer to form a patterned photoresist protective layer; performing an etching process on the exposed thin metal film to form a patterned metal circuit layer; stripping the patterned photoresist protective layer; and performing a surface treatment on the patterned metal circuit layer to form a metal protective layer. With the method, a 3D circuit pattern can be directly formed on a 3D plastic main body without providing additional circuit carrier to thereby meet the requirement for miniaturized and compact electronic devices.

Abstract: A spoke of a bicycle rim has a spoke body having a connecting end and a threaded segment formed on the connecting end. The threaded segment has multiple first thread sections and at least one second thread section. The first thread sections have a major radius, a minor radius and a pitch. The at least one second thread section is formed between the first thread sections to form at least one loosen-proofing section between the first thread sections and has a major radius, a minor radius and a pitch. The major radius of the second thread section is smaller than the major radius of the first thread sections. The minor radius of the second thread section is larger than the minor radius of the first thread sections. The pitch of the second thread section is the same as that of the first thread sections.

Abstract: A method is described including forming a first photoresist feature and a second photoresist feature on a semiconductor substrate. A chemical material coating is formed on the semiconductor substrate. The chemical material coating interposes the first and second photoresist features. The semiconductor substrate is then rinsed; the rinsing removes the chemical material coating from the semiconductor substrate. The chemical material may mix with a residue disposed on the substrate between the first and second photoresist features. Removing the chemical material coating from the substrate may also remove the residue.

Abstract: A method of manufacturing plastic metallized 3D circuit includes the steps of providing a 3D plastic main body; performing a surface pretreatment on the plastic main body; performing a metallization process on the plastic main body to deposit a thin metal film thereon; performing a photoresist coating process to form a photoresist protective layer on the thin metal film; performing an exposure and development process on the photoresist protective layer to form a patterned photoresist protective layer; performing an etching process on the exposed thin metal film to form a patterned metal circuit layer; stripping the patterned photoresist protective layer; and performing a surface treatment on the patterned metal circuit layer to form a metal protective layer. With the method, a 3D circuit pattern can be directly formed on a 3D plastic main body without providing additional circuit carrier to thereby meet the requirement for miniaturized and compact electronic devices.