Abstract: The disclosure provides a recycle apparatus. The recycle apparatus is configured to separate a back sheet and a glass sheet assembly of a photovoltaic module. The recycle apparatus includes a conveyor, a flattening device, and a cutting tool. The conveyor includes a first roller and a second roller opposite to each other. The flattening device is located aside the first roller and the second roller. The cutting tool is located aside the flattening device. The flattening device is located between the first roller and the second roller of the conveyor and the cutting tool. The first roller and the second roller is configured to clamp the photovoltaic module and to feed the photovoltaic module to the flattening device configured to flatten the photovoltaic module and to the cutting tool configured to separate the back sheet from the glass sheet assembly.

Abstract: A lens assembly including a first lens, a second lens, a third lens, a fourth lens, and a fifth lens, arranged from the magnification side to the reduction side, is provided. The fourth lens and the fifth lens are combined into a cemented lens having an aspherical surface. The lens assembly includes 5 to 6 lenses with a refractive power. The first lens is a glass lens, and the others are aspherical lenses. R1 is the radius of curvature of the lens surface of the first lens facing the magnification side, R2 is the radius of curvature of the lens surface of the first lens facing the reduction side, T is the thickness, on the optical axis of the lens assembly, of the first lens, wherein the refractive index of the first lens>1.55, the Abbe number of the first lens>55, and R1-R2-T<8.8.

Abstract: An image capturing device includes a circuit board, an image capturing module, a light source module disposed on the circuit board and a connection body disposed above the light source module. The image capturing module has a first lens set and a second lens set disposed on the circuit board. The connection body has a first connection section having a first open end and a second open end. The first open end of the first connection section abuts against the light-emitting component or the upper side of the circuit board in adjacency to the light-emitting component. The first and second open ends together define a first light passage. The light-emitting component is positioned in the first light passage. The image capturing device can effectively avoid light leakage of the image.

Abstract: A method for manufacturing a doped metal oxide film includes following steps. First, a substrate is provided. Second, a metal oxide film is formed on the substrate by using a capacitive pulsed arc plasma technique to control a metal ion film to be doped, and by integrating an arc plasma coating process or a physical vapor deposition process. The invention completes the in-situ doping function of metal oxides and compounds in a single process, and can be used for manufacturing functional components for continuous processes without breaking vacuum condition, and is applied to the thin film process of electrochemical components such as electrochromic devices or lithium batteries.

Abstract: A method for forming a mask substrate is provided. The method includes providing a first base and providing a mask layer on the first base. The method also includes patterning the mask layer to form a pattern, wherein the first base and the pattern form a patterned substrate and providing a first substrate. The method further includes providing an optical layer on the first substrate or on the patterned substrate and assembling the first substrate and the patterned substrate to form the mask substrate.

Abstract: Disclosed are a class of compounds as a caspase inhibitor, and in particular the compound as shown in formula (I) or a pharmaceutically acceptable salt thereof, and the use of the compound in treating caspase-related diseases.

Abstract: A liquid cooled heat dissipation device including a housing, at least two cooling fin modules, an input pipe, and an output pipe is provided. The housing has an accommodation space. The at least two cooling fin modules are disposed in the accommodation space. The input pipe is disposed on the top plate, the front plate, the rear plate, or one of the side plates of the housing and communicates with the accommodation space. The output pipe is disposed on the top plate, the front plate, the rear plate, or the other one of the side plates of the housing and communicates with the accommodation space. The at least two cooling fin modules have different arrangement densities and different fin thicknesses.

Abstract: An apparatus is disclosed for transceiving signals in multiple modes. In example implementations, an apparatus includes a transceiver that includes a first amplifier; a mixer having at least one input node and at least one output node, with the at least one input node coupled to the first amplifier; and a second amplifier coupled to the at least one output node of the mixer. The transceiver also includes a first register coupled to the first amplifier and a second register coupled to the second amplifier. The transceiver further includes at least one memory realizing a lookup table. The at least one memory is coupled to the first register and the second register. The lookup table includes a first portion corresponding to a first mode of the transceiver and a second portion corresponding to a second mode of the transceiver.

Abstract: A responsive mouse click mechanism includes a body comprising a pivotal notch; a switch arranged on the body; a key comprising an extension arm and a pivotal shaft; and an elastic member disposed between the body and the key, wherein the elastic member causes the extension arm to contact the switch without triggering the switch, and wherein the elastic member presses the pivotal shaft into the pivotal notch.

Abstract: An optical lens includes, in order along a direction, an aperture stop and a lens group with a positive refractive power. The aperture stop is disposed at an outermost side of all lenses of the optical lens, and the lens group has at least four lenses. At least one of the four lenses is an aspheric lens, and each of the four lenses has a clear aperture of smaller than 14 mm.

Abstract: An oral screening device having a replaceable screening head is provided that comprises a screening head provided with a camera module and a handle from which the screening head is detachable. The camera module is disposed in the screening head. The handle is provided with a control unit disposed in the handle. The control unit is provided with a controller electrically coupled with the camera module. Through this design of the present invention, easy replacement of the screening head is achieved.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

Abstract: An extreme ultraviolet lithography method is disclosed. In an example, the EUVL method includes forming a resist layer on a substrate; performing a first exposure process to image a first pattern of a first sub-region of a first mask to the resist layer; performing a second exposure process to image a second pattern of a second sub-region of the first mask to the resist layer; and performing a third exposure process to image a third pattern of a first sub-region of a second mask to the resist layer. The second and third patterns are identical to the first pattern. The first, second and third exposure processes collectively form a latent image of the first pattern on the resist layer.

Abstract: A projection lens includes a first lens, a second lens, an aperture stop, a third lens, a fourth lens, a fifth lens, a sixth, and a concave mirror sequentially arranged from a minified side to a magnified side. An outer diameter of the second lens is less than an outer diameter of the first lens. An outer diameter of the fifth lens is greater than that of the fourth lens. An outer diameter of the sixth lens is less than that of the fifth lens. The first lens, the second lens, the aperture stop, and the third lens are fixed relative to the concave mirror and the fourth lens is capable of moving along an optical axis relative to the concave mirror when the projection lens is in focusing. The projection lens includes 9 to 30 lenses with refractive power. A projector using said projection lens is also provided.

Abstract: The present invention discloses a thin film transistor array substrate, a manufacturing method thereof, and a display panel. In the present invention, a width of the channel is increased by cooperation of an electrically connection between the interdigital gate and the interdigital light-shielding layer with design of the interdigital gate. When a width/length ratio (W/L) of the channels in a single thin film crystal device is maintained constant, an increase in the channel width allows the width of the channel layer occupied by the channels to be reduced while maintaining the total width of the channels in the single thin film transistor constant, thereby reducing the area occupied by the single thin film transistor device.

Abstract: A substrate assembly and a method of bonding substrates are disclosed. The method includes steps of: providing two substrate; subjecting a connecting surface of each of the substrates to surface-modifying treatment to form surface-modified region respectively on each of the connecting surfaces; contacting the substrates in such a manner that the substrates are connected with each other through a physical interaction between the surface-modified regions; and laser irradiating and melting a portion of each of the connecting surfaces to form a respective bonding region, and solidifying the melted bonding regions of the substrates to bond the substrates together.

Abstract: A projection lens includes a first lens, a second lens, an aperture stop, a third lens, a fourth lens, a fifth lens, a sixth, and a concave mirror sequentially arranged from a minified side to a magnified side. An outer diameter of the second lens is less than an outer diameter of the first lens. An outer diameter of the fifth lens is greater than that of the fourth lens. An outer diameter of the sixth lens is less than that of the fifth lens. The first lens, the second lens, the aperture stop, and the third lens are fixed relative to the concave mirror and the fourth lens is capable of moving along an optical axis relative to the concave mirror when the projection lens is in focusing. The projection lens includes 9 to 30 lenses with refractive power. A projector using said projection lens is also provided.

Abstract: A face identification camera module includes a circuit board, a camera device, at least one infrared LED light-emitting unit, an image processor and a connector. The respective units are disposed on a first side of the circuit board and electrically connected with the circuit board. The infrared LED light-emitting unit is disposed on left and right sides of the camera device. The infrared LED light-emitting unit serves to enhance the brightness, uniformity and contrast of the image so that a higher identification ratio can be achieved and a higher-definition face feature identification effect can be obtained by the camera device.

Abstract: A power chip package module and a manufacturing method thereof are provided. In the manufacturing method, a temporary carrier having an alignment pattern is provided, in which the temporary carrier includes a base and a peelable adhesive material disposed on the base. Thereafter, a circuit board having an accommodating space passing therethrough is disposed on the temporary carrier according to the alignment pattern. Furthermore, a chip is disposed in the accommodating space with an active surface thereof facing the temporary carrier according to the alignment pattern, in which the chip is fixed on the temporary carrier by the peelable adhesive material. The accommodating space is filled with a molding material to form an initial package structure. The initial package structure is separated from the temporary carrier, and then an electrically and thermally conductive layer is formed on a bottom surface of the chip and is in contact therewith.

Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.