Abstract: Embodiments relate to a process for regenerating a polyester container and a polyester film to be used therein, which not only solve the environmental problems by improving the recyclability of polyester containers, but also are capable of enhancing the quality, yield, and productivity. The process for regenerating a polyester container comprises providing the polyester container and a heat-shrunken polyester film that wraps at least part of the polyester container; crushing the polyester container and the heat-shrunken film to obtain flakes; and thermally treating the flakes to produce regenerated polyester chips, wherein when the flakes are thermally treated at a temperature of 200° C. to 220° C.

Abstract: A heat shrinkable film shows a heat shrinkage rate in the direction perpendicular to the main shrinkage direction that is not high even at high temperature and is printable thereon. The heat shrinkable film includes a polyester resin, wherein the heat shrinkage characteristics in the direction perpendicular to the main shrinkage direction satisfy the following Relationships 1 and 2: ?15??T70-65?0??Relationship 1 0??T100-95?5??Relationship 2 wherein ?TX-Y is a value obtained by subtracting heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in water bath for 10 seconds at Y° C. from heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in water bath for 10 seconds at X° C.

Abstract: An optical assembly includes: a camera module; at least one actuator configured to move the camera module; and a connection substrate having one end connected to the camera module such that at least a portion of the connection substrate is configured to move along with movement of the camera module. The connection substrate includes a rigidity reduction portion reducing rigidity of the connection substrate in a portion of the substrate in which distortion or warpage occurs according to the movement of the camera module.

Abstract: A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.

Abstract: Embodiments relate to a heat shrinkable film, which has a heat shrinkage rate in the direction perpendicular to the main shrinkage direction that is not high even at a high temperature and which is printable thereon. The heat shrinkable film comprises a polyester resin, wherein the heat shrinkage characteristics in the direction perpendicular to the main shrinkage direction satisfy the following Relationships 1 and 2: ?15??T70?65?0??[Relationship 1] 0??T100?95?5??[Relationship 2] wherein ?TX?Y is a value obtained by subtracting a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at Y° C. from a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at X° C.

Abstract: Embodiments relate to a process for regenerating a polyester container and a polyester film to be used therein, which not only solve the environmental problems by improving the recyclability of polyester containers, but also are capable of enhancing the quality, yield, and productivity. The process for regenerating a polyester container comprises providing the polyester container and a heat-shrunken polyester film that wraps at least part of the polyester container; crushing the polyester container and the heat-shrunken film to obtain flakes; and thermally treating the flakes to produce regenerated polyester chips, wherein when the flakes are thermally treated at a temperature of 200° C. to 220° C.

Abstract: The embodiments relate to a. polyester film and a process for regenerating a polyester container using the same, which not only solve the environmental problems by improving the recyclability of polyester containers, but also are capable of enhancing the yield and productivity. The polyester film comprises a first layer comprising a first resin comprising a diol component and a dicarboxylic acid component; and a second layer laminated on one side of the first layer and comprising a second resin different from the first resin, wherein when the polyester film is cut with a polyethylene terephthalate container to form flakes and the flakes are thermally treated at a temperature of 200° C. to 220° C. for 60 minutes to 120 minutes, the clumping fraction is 8% or less.

Abstract: The embodiments relate to a polyester film, which comprises a copolymerized polyester resin comprising a diol component and a dicarboxylic acid component and has a heat shrinkage rate of 30% or more in the main shrinkage direction upon thermal treatment at a temperature of 80° C. for 10 seconds and a melting point of 170° C. or higher as measured by differential scanning calorimetry, which not only solve the environmental problems by improving the recyclability of the polyester container, but also are capable of enhancing the yield and productivity, and a process for regenerating a polyester container using the same.

Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.

Abstract: A folded module includes a housing having an internal space and including a protruding wall protruding in a direction perpendicular to an optical axis direction; a rotation holder including a reflective member, and supported by an internal wall of the housing with a rotation plate interposed therebetween to be disposed in the internal space; and a stopper coupled to the protruding wall of the housing, and limiting movement of the rotation holder in an optical axis direction, and the stopper includes a separation prevention structure.

Abstract: A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.

Abstract: An antenna module includes an antenna substrate including a core layer, insulating layers disposed on opposite surfaces of the core layer, and wiring layers including antenna patterns. The antenna substrate has first and second recess portions. The antenna module further includes a passive component disposed in the first recess portion, a semiconductor chip disposed in the second recess portion and having an active surface, an encapsulant encapsulating at least portions of the semiconductor chip and the passive component, and a connection portion disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the semiconductor chip. The passive component has a thickness greater than that of the semiconductor chip, and the first recess portion has a depth greater than that of the second recess portion.

Abstract: A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.

Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.

Abstract: A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.

Abstract: A fan-out semiconductor package includes a connection structure including one or more redistribution layers, a first semiconductor chip disposed on a first surface of the connection structure and having a first connection pad, a first encapsulant disposed on a first surface of the connection structure and covering at least a portion of the first semiconductor chip, and a second semiconductor chip disposed on a second surface of the connection structure and having a second connection pad, wherein the first connection pad is electrically connected to the one or more redistribution layers by a connection via of the connection structure, the second connection pad is electrically connected to the one or more redistribution layers by a wire, and the first and second connection pads are electrically connected to each other through the one or more redistribution layers.

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.

Abstract: A composition for solar cell electrodes includes a conductive powder, a glass frit, and an organic vehicle. The glass frit contains about 20 mol % to about 40 mol % of an alkali metal, about 20 mol % to about 30 mol % of zinc (Zn), and about 7 mol % to about 20 mol % of magnesium (Mg) in terms of oxide content.

Abstract: An antenna module includes an antenna substrate including a core layer, insulating layers disposed on opposite surfaces of the core layer, and wiring layers including antenna patterns. The antenna substrate has first and second recess portions. The antenna module further includes a passive component disposed in the first recess portion, a semiconductor chip disposed in the second recess portion and having an active surface, an encapsulant encapsulating at least portions of the semiconductor chip and the passive component, and a connection portion disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the semiconductor chip. The passive component has a thickness greater than that of the semiconductor chip, and the first recess portion has a depth greater than that of the second recess portion.