Abstract: A printed circuit board includes a circuit layer and a ground layer disposed above the circuit layer. The ground layer includes ground layer sections each having metal members, arranged in parallel in one direction on a plane. Areas of the metal members of adjacent ground layer sections are different from each other. The areas of the metal members are determined based on respective areas of circuits of the circuit layer corresponding to respective ground layer sections.

Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.

Abstract: Embodiments relate to a heat shrinkable film, which has a heat shrinkage rate in the direction perpendicular to the main shrinkage direction that is not high even at a high temperature and which is printable thereon. The heat shrinkable film comprises a polyester resin, wherein the heat shrinkage characteristics in the direction perpendicular to the main shrinkage direction satisfy the following Relationships 1 and 2: ?15??T70?65?0??[Relationship 1] 0??T100?95?5??[Relationship 2] wherein ?TX-Y is a value obtained by subtracting a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at Y° C. from a heat shrinkage rate of the heat shrinkable film in the direction perpendicular to the main shrinkage direction after the heat shrinkable film is immersed in a water bath for 10 seconds at X° C.

Abstract: A semiconductor package includes a support member having a first surface and a second surface, and having a through-hole, a first metal layer for shielding disposed on an internal sidewall of the through-hole and the first surface and the second surface of the support member, a connection member disposed on the first surface of the support member, and having a redistribution layer, a semiconductor chip disposed in the through-hole, an encapsulant sealing the semiconductor chip located in the through-hole, and covering the second surface of the support member, a second metal layer for shielding disposed on the encapsulant, and connected to the first metal layer for shielding by a connecting trench via passing through the encapsulant, and a reinforcing via disposed in a region, overlapping the trench via for connection, of the support member, and connected to the first metal layer for shielding.

Abstract: A fan-out semiconductor package includes a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface on which connection pads are disposed and an inactive surface disposed to oppose the active surface; a heat radiating member directly bonded to the inactive surface of the semiconductor chip; an encapsulant encapsulating at least a portion of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip.

Abstract: A method of manufacturing an electrode for a solar cell includes printing a conductive paste on a front surface of a substrate using a printing mask having an opening rate of 65% or more, and baking the printed conductive paste. The conductive paste may include a conductive powder, a glass fit, and an organic vehicle, the glass fit may include lithium oxide and tungsten oxide, and, in the glass fit, a weight ratio of lithium oxide to tungsten oxide may be about 0.5 to about 5.5.

Abstract: A composition for solar cell electrodes and a solar cell electrode prepared using the same, the composition including a conductive powder; a glass frit; an organic vehicle; a slip agent; and a thixotropic agent, wherein the composition has an angular velocity of 0.1 rad/sec to 80 rad/sec, as measured for tan ? max under conditions of 23 ° C. and 0.1 rad/sec to 1,000 rad/sec.

Abstract: A coil device comprises a first coil, a second coil, a first conductor, and a first film. The second coil is disposed inside an inner boundary line of the first coil. The first conductor is disposed between the inner boundary line of the first coil and an outer boundary line of the second coil to dissipate heat. The first film is disposed on upper surfaces of the first coil, the second coil, and the first conductor.

Abstract: Discloses is a turbine power generation system having an emergency operation means and an emergency operation method therefor that are capable of controlling excess heat accumulated during emergency operation, and recycling the accumulated heat. A turbine power generation system includes: an inlet sensor part including a thermometer, a pressure gauge, and a flowmeter that are installed between the heater and the inlet valve and; an emergency discharge part including a branch pipe connected to the steam, and a heat control means installed on the branch pipe. Accordingly, the system and the method are capable of reducing a heat overload during an emergency operation by transferring a heat amount exchanged in the heat storage device to the heat consuming facility, minimizing thermal consumption by recycling the same, and preventing various problems caused by stopping an operation of the turbine power generation system.

Abstract: A composition for solar cell electrodes includes a conductive powder, a glass frit, and an organic vehicle. The glass frit contains about 20 mol % to about 40 mol % of an alkali metal, about 20 mol % to about 30 mol % of zinc (Zn), and about 7 mol % to about 20 mol % of magnesium (Mg) in terms of oxide content.

Abstract: An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.

Abstract: An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.

Abstract: Discloses is a turbine power generation system having an emergency operation means and an emergency operation method therefor that are capable of controlling excess heat accumulated during emergency operation, and recycling the accumulated heat. A turbine power generation system includes: an inlet sensor part including a thermometer, a pressure gauge, and a flowmeter that are installed between the heater and the inlet valve and; an emergency discharge part including a branch pipe connected to the steam, and a heat control means installed on the branch pipe. Accordingly, the system and the method are capable of reducing a heat overload during an emergency operation by transferring a heat amount exchanged in the heat storage device to the heat consuming facility, minimizing thermal consumption by recycling the same, and preventing various problems caused by stopping an operation of the turbine power generation system.

Abstract: An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.

Abstract: A method of forming an electrode, an electrode for a solar cell manufactured, and a solar cell, the method including forming a pattern of a finger electrode by: coating a composition for forming a first electrode that includes a conductive powder, an organic vehicle, and a first glass frit that is free of silver and phosphorus, and drying the coated composition for forming a first electrode; forming a pattern of a bus electrode by: coating a composition for forming a second electrode that includes a conductive powder, an organic vehicle, and a second glass fit that includes silver and phosphorus, and drying the coated composition for forming a second electrode; and firing the resultant patterns.

Abstract: A method of forming an electrode, an electrode for a solar cell manufactured, and a solar cell, the method including forming a pattern of a finger electrode by: coating a composition for forming a first electrode that includes a conductive powder, an organic vehicle, and a first glass frit that is free of silver and phosphorus, and drying the coated composition for forming a first electrode; forming a pattern of a bus electrode by: coating a composition for forming a second electrode that includes a conductive powder, an organic vehicle, and a second glass frit that includes silver and phosphorus, and drying the coated composition for forming a second electrode; and firing the resultant patterns.

Abstract: A coil device comprises a first coil, a second coil, a first conductor, and a first film. The second coil is disposed inside an inner boundary line of the first coil. The first conductor is disposed between the inner boundary line of the first coil and an outer boundary line of the second coil to dissipate heat. The first film is disposed on upper surfaces of the first coil, the second coil, and the first conductor.

Abstract: An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.

Abstract: A method for manufacturing an electrode for a display apparatus includes printing and drying a conductive paste on a substrate, and printing a glass paste on the dried conductive paste, followed by patterning.

Abstract: A method for manufacturing an electrode for a display apparatus includes printing and drying a conductive paste on a substrate, and printing a glass paste on the dried conductive paste, followed by patterning.