Patents by Inventor Chun-An Cheng

Chun-An Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230013220
    Abstract: A method for retrieving an inventory item based on a handling robot, where the handling robot includes: a storage frame; and a material handling device installed on the storage frame, and including a telescopic arm and a manipulator installed to the telescopic arm; and the method for retrieving an inventory item includes: driving, by the telescopic arm, the manipulator to extend to a preset position of warehouse shelf along a preset horizontal reference line; loading, by the manipulator that is remained on the reference line, the inventory item located in the preset position; driving, by the telescopic arm, the manipulator loaded with the inventory item to move to the storage frame along the reference line; and unloading, by the manipulator that is remained on the reference line, the inventory item to the storage frame.
    Type: Application
    Filed: September 14, 2022
    Publication date: January 19, 2023
    Inventors: Jui-chun CHENG, Shengdong Xu, Yuqi Chen
  • Publication number: 20230017588
    Abstract: A local wearable brain wave cap device for detection is provided to simultaneously detect brainwave and heart rate variability data of a subject and includes a brain wave detection cap, at least one ear electrode and a transmission unit. The brain wave detection cap includes a wearable device and a plurality of electrode units. The wearable device is suitable for arranging the plurality of electrode units on brain wave positions corresponding to head of a subject. Each of the plurality of electrode units includes an accelerator, a storage unit, an input/output unit and a primary amplifier for detecting a brain wave.
    Type: Application
    Filed: October 6, 2021
    Publication date: January 19, 2023
    Inventors: Shu-Chun Kuan, Jason Chun-Cheng Lin, Chung-Tse Shen
  • Patent number: 11548588
    Abstract: The present disclosure related to an effort-saving crank structure (1) of a bicycle (8), which includes: a crank mechanism (10) having a crank (11), a shaft end gear (12) and a treadle end gear (13) disposed on the crank (11); a transmission mechanism (20) disposed in the crank (11) and having a rotation shaft (21) and a first gear (22) and a second gear (23) connected to the rotation shaft (21), the first gear (22) and the shaft end gear (12) are engaged for transmission, and the second gear (23) and the treadle end gear (13) are engaged for transmission; a rotation arm unit (30) having a first rotation arm (31) and a second rotation arm (32), two ends of the second rotation arm (32) are respectively connected to the first rotation arm (31) and the treadle end gear (13).
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: January 10, 2023
    Inventors: Hsuan-Chih Lin, Chun-Cheng Lee
  • Patent number: 11550122
    Abstract: An optical lens includes seven lenses sequentially arranged along an optical axis from an object side to an image side. A fourth lens includes a seventh surface facing the object side and an eighth surface facing the image side. Each of the seventh surface and the eighth surface includes an inflection point. The optical lens satisfies the following conditional formulas: ?0.48<tan(EFL4*log(Slope_L42))<?0.38;??conditional formula 1: 1 mm<Infp_L41_y<1.05 mm;??conditional formula 2: 0.58 mm<Infp_L42_y<0.69 mm;??condition 3: 1<(123{circumflex over (?)}T4)/(456{circumflex over (?)}Slope_L41)<1.67.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: January 10, 2023
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chun-Cheng Ko, Yi-Ting Lin
  • Publication number: 20230005246
    Abstract: The present invention provides a training method of a neural network model, wherein the training method includes the steps of: receiving image data including a plurality of frames, and for first frames in the frames, the image data further includes detection data, and the detection data includes position of at least one person within the corresponding first frame; and for second frames in the frames, the image data further includes person search data, and the person search data includes position and serial number of at least one person within the corresponding second frame; using the neural network model to perform a person recognition operation on the frames to generate a recognition result; and using loss functions to process the recognition result of each frame, the detection result of each first frame and the person search data of each second frame, for adjusting parameters of the neural network model.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 5, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventor: Chia-Chun Cheng
  • Patent number: 11545605
    Abstract: A display panel including a pixel circuit substrate, a planarization layer, a plurality of bonding pads, a plurality of light-emitting devices, a plurality of auxiliary electrodes, and a reflective structure layer is provided. The pixel circuit substrate has a plurality of signal lines. The planarization layer covers the signal lines. The bonding pads are disposed on the planarization layer and are electrically connected to the signal lines. The light-emitting devices are electrically bonded to the bonding pads. The auxiliary electrodes are disposed between the bonding pads. The reflective structure layer is disposed between the light-emitting devices and overlaps at least part of the auxiliary electrodes and the bonding pads. A method of fabricating the display panel is also provided.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: January 3, 2023
    Assignee: Au Optronics Corporation
    Inventors: Hsun-Yi Wang, Chan-Jui Liu, Chiao-Li Huang, Ching-Liang Huang, Chun-Cheng Cheng
  • Publication number: 20220415003
    Abstract: The present invention provides a SoC including a person recognition circuit, a sound detection circuit and a processing circuit. The person recognition circuit is configured to obtain image data from an image capturing device, and perform a person recognition operation on the image data to generate a recognition result. The sound detection circuit is configured to receive a plurality of sound signals from a plurality of microphones, and determine a sound characteristic value of a main sound. The processing circuit is configured to determine a specific region in the image data according to the recognition result and the sound characteristic value of the main sound, and process the image data to highlight the specific region.
    Type: Application
    Filed: May 23, 2022
    Publication date: December 29, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Ching-Lung Chen, Chia-Chun Cheng
  • Publication number: 20220411183
    Abstract: A method for retrieving an inventory item based on a handling robot, where the handling robot includes: a storage frame; and a material handling device installed on the storage frame, and including a telescopic arm and a manipulator installed to the telescopic arm; and the method for retrieving an inventory item includes: driving, by the telescopic arm, the manipulator to extend to a preset position of warehouse shelf along a preset horizontal reference line; loading, by the manipulator that is remained on the reference line, the inventory item located in the preset position; driving, by the telescopic arm, the manipulator loaded with the inventory item to move to the storage frame along the reference line; and unloading, by the manipulator that is remained on the reference line, the inventory item to the storage frame.
    Type: Application
    Filed: August 30, 2022
    Publication date: December 29, 2022
    Inventors: Jui-chun CHENG, Shengdong XU, Yuqi CHEN
  • Publication number: 20220416661
    Abstract: Provided is a SIMBO buck-boost inverting converter including: a power stage for receiving an input voltage to generate first and positive output voltages and a negative output voltage, the power stage including a plurality of switches and an inductor; a control circuit for generating a plurality of control voltages based on the first and the second positive output voltages, the negative output voltage and a current of the inductor; an energy generation and distribution circuit for generating a plurality of duty cycles based on the control voltages; and a logic control and gate driving circuit for generating a plurality of switch control signals for controlling the switches of the power stage based on the duty cycles; wherein the control circuit and the energy generation and distribution circuit feedback-control and adjust the duty cycles to adjust a balance between an input energy and an output energy.
    Type: Application
    Filed: June 25, 2021
    Publication date: December 29, 2022
    Inventors: Wei-Chun CHENG, William CHEN, Wei-Hsin WEI
  • Patent number: 11530476
    Abstract: The invention provides a device for sputtering comprising a main magnet, two secondary magnets mounted on two sides of the main magnet symmetrically, and a shell. The two secondary magnets face to each other in ends with the same polarity in a line. The shell is cylindrical and contains the main magnet and the secondary magnets.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: December 20, 2022
    Assignee: APPLIED NANO TECHNOLOGY SCIENCE, INC.
    Inventors: Tien-Chun Cheng, Wen-Pin Lai, Hsin-Hsuan Huang, Yu-Ching Huang, Ta-Jung Su
  • Patent number: 11524406
    Abstract: A calibration method for a robotic arm system is provided. The method includes: capturing an image of a calibration object fixed to a front end of the robotic arm by a visual device, wherein a pedestal of the robotic arm has a pedestal coordinate system, and the front end of the robotic arm has a first relative relationship with the pedestal, the front end of the robotic arm has a second relative relationship with the calibration object; receiving the image and obtaining three-dimensional feature data of the calibration object according to the image by a computing device; and computing a third relative relationship between the visual device and the pedestal according to the three-dimensional feature data, the first relative relationship, and the second relative relationship to calibrate a position error between a physical location of the calibration object and a predictive positioning-location generated by the visual device.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: December 13, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jay Huang, Yu-Chun Cheng, Hian-Kun Tenn, Tsai-Ling Kao
  • Patent number: 11521939
    Abstract: Semiconductor device structures and methods for manufacturing the same are provided. The semiconductor device structure includes a substrate, a die and a stiffener. The substrate has an upper surface. The die is disposed on the upper surface of the substrate. The stiffener is disposed on the upper surface of the substrate and surrounds the die. The stiffener has a first upper surface adjacent to the die, a second upper surface far from the die and a lateral surface extending from the first upper surface to the second upper surface. A first distance between the first upper surface of the stiffener and the upper surface of the substrate is less than a second distance between the second upper surface of the stiffener and the upper surface of the substrate.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: December 6, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jui-Tzu Chen, Yu-Hsing Lin, Chia-Chieh Hu, Chun-Cheng Kuo, Yu-Hsiang Chao
  • Publication number: 20220384245
    Abstract: Methods of forming a slurry and methods of performing a chemical mechanical polishing (CMP) process utilized in manufacturing semiconductor devices, as described herein, may be performed on semiconductor devices including integrated contact structures with ruthenium (Ru) plug contacts down to a semiconductor substrate. The slurry may be formed by mixing a first abrasive, a second abrasive, and a reactant with a solvent. The first abrasive may include a first particulate including titanium dioxide (TiO2) particles and the second abrasive may include a second particulate that is different from the first particulate. The slurry may be used in a CMP process for removing ruthenium (Ru) materials and dielectric materials from a surface of a workpiece resulting in better WiD loading and planarization of the surface for a flat profile.
    Type: Application
    Filed: August 5, 2022
    Publication date: December 1, 2022
    Inventors: Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu, Jian-Ci Lin, Chi-Jen Liu, Yi-Sheng Lin, Yang-Chun Cheng, Liang-Guang Chen, Kuo-Hsiu Wei, Kei-Wei Chen
  • Publication number: 20220386329
    Abstract: A method for a UE for performing a HARQ feedback operation for an SPS transmission is disclosed.
    Type: Application
    Filed: August 14, 2020
    Publication date: December 1, 2022
    Inventors: CHIA-HAO YU, CHIEN-CHUN CHENG, CHIA-HUNG WEI, CHIE-MING CHOU
  • Publication number: 20220384288
    Abstract: A semiconductor package including a circuit substrate, an interposer structure, a plurality of dies, and an insulating encapsulant is provided. The interposer structure is disposed on the circuit substrate. The plurality of dies is disposed on the interposer structure, wherein the plurality of dies is electrically connected to the circuit substrate through the interposer structure. The insulating encapsulant is disposed on the circuit substrate, wherein the insulating encapsulant surrounds the plurality of dies and the interposer structure and encapsulates at least the interposer structure, the insulating encapsulant has a groove that surrounds the interposer structure and the plurality of dies, and the interposer structure and the plurality of dies are confined to be located within the groove.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin
  • Publication number: 20220376079
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a fin spacer alongside a fin structure, a source/drain structure over the fin structure, and a salicide layer along a surface of the source/drain structure. A bottom portion of the salicide layer is in contact with the fin spacer. The semiconductor device structure also includes a capping layer over the salicide layer. A portion of the capping layer directly below the bottom portion of the salicide layer is in contact with the fin spacer. The semiconductor device structure also includes a dielectric layer over the capping layer. The dielectric layer is made of a different material than the capping layer.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 24, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiang-Ku SHEN, Jin-Mu YIN, Tsung-Chieh HSIAO, Chia-Lin CHUANG, Li-Zhen YU, Dian-Hau CHEN, Shih-Wei WANG, De-Wei YU, Chien-Hao CHEN, Bo-Cyuan LU, Jr-Hung LI, Chi-On CHUI, Min-Hsiu HUNG, Hung-Yi HUANG, Chun-Cheng CHOU, Ying-Liang CHUANG, Yen-Chun HUANG, Chih-Tang PENG, Cheng-Po CHAU, Yen-Ming CHEN
  • Publication number: 20220376150
    Abstract: A display panel including a pixel circuit substrate, a planarization layer, a plurality of bonding pads, a plurality of light-emitting devices, a plurality of auxiliary electrodes, and a reflective structure layer is provided. The pixel circuit substrate has a plurality of signal lines. The planarization layer covers the signal lines. The bonding pads are disposed on the planarization layer and are electrically connected to the signal lines. The light-emitting devices are electrically bonded to the bonding pads. The auxiliary electrodes are disposed between the bonding pads. The reflective structure layer is disposed between the light-emitting devices and overlaps at least part of the auxiliary electrodes and the bonding pads. A method of fabricating the display panel is also provided.
    Type: Application
    Filed: November 4, 2021
    Publication date: November 24, 2022
    Applicant: Au Optronics Corporation
    Inventors: Hsun-Yi Wang, Chan-Jui Liu, Chiao-Li Huang, Ching-Liang Huang, Chun-Cheng Cheng
  • Publication number: 20220371821
    Abstract: A method for retrieving an inventory item based on a handling robot, where the handling robot includes: a storage frame; and a material handling device installed on the storage frame, and including a telescopic arm and a manipulator installed to the telescopic arm; and the method for retrieving an inventory item includes: driving, by the telescopic arm, the manipulator to extend to a preset position of warehouse shelf along a preset horizontal reference line; loading, by the manipulator that is remained on the reference line, the inventory item located in the preset position; driving, by the telescopic arm, the manipulator loaded with the inventory item to move to the storage frame along the reference line; and unloading, by the manipulator that is remained on the reference line, the inventory item to the storage frame.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 24, 2022
    Inventors: Jui-chun CHENG, Shengdong Xu, Yuqi Chen
  • Publication number: 20220376836
    Abstract: A method performed by a UE is provided. The method includes receiving DCI on a PDCCH from a BS, the DCI indicating a PDSCH; receiving a MAC CE command on the PDSCH; determining, according to the DCI, whether a HARQ ACK feedback for a data reception on the PDSCH is needed to be transmitted; and applying, after determining that the HARQ ACK feedback is needed to be transmitted, the MAC CE command after a first slot identified by a first value of n+K0+K1+Np+M, where n is an index of a slot in which the DCI is received, K0 and K1 are slot offsets, Np indicates an approximated delay determined by a TA value, and M indicates a processing delay.
    Type: Application
    Filed: October 16, 2020
    Publication date: November 24, 2022
    Inventors: CHIEN-CHUN CHENG, CHIA-HAO YU, HUNG-CHEN CHEN
  • Patent number: 11508060
    Abstract: A computer aided method for analyzing fibrosis is provided. First, a segmentation algorithm is performed on a medical image to obtain a segmentation image. Circular fibrosis is detected according to the segmentation image to determine a score. In some cases, it is also necessary to determine a number of fibrosis bridges and the condition of fiber expansion.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: November 22, 2022
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Pau-Choo Chung Chan, Nan-Haw Chow, Hung-Wen Tsai, Kuo-Sheng Cheng, Chun-Cheng Huang