Abstract: An electromagnetic wave guidance and beam reshaping structure is favorable to incorporate a radiation source antenna into an energy focusing system. The electromagnetic wave guidance and beam reshaping structure includes a substrate, a plurality of metal patterns and a plurality of hollow structures. The substrate includes a central portion and a peripheral portion that surrounds the central portion. The plurality of metal patterns are disposed on the central portion. The plurality of hollow structures are disposed in the peripheral portion. The metal patterns are axisymmetrically arranged with respect to a central axis of the substrate, and the hollow structures are axisymmetrically arranged with respect to the central axis of the substrate.

Abstract: An electromagnetic wave absorber including a substrate and a plurality of magnetic material bodies is provided. The plurality of magnetic material bodies are disposed on the substrate in an array, so that the electromagnetic wave absorber has a plurality of electromagnetic wave absorption frequencies in addition to an electromagnetic wave characteristic frequency of the plurality of magnetic material bodies. A ratio of one of the plurality of electromagnetic wave absorption frequencies to the electromagnetic wave characteristic frequency is greater than 1 and is less than or equal to 6.

Abstract: An electromagnetic wave guidance and beam reshaping structure is favorable to incorporate a radiation source antenna into an energy focusing system. The electromagnetic wave guidance and beam reshaping structure includes a substrate, a plurality of metal patterns and a plurality of hollow structures. The substrate includes a central portion and a peripheral portion that surrounds the central portion. The plurality of metal patterns are disposed on the central portion. The plurality of hollow structures are disposed in the peripheral portion. The metal patterns are axisymmetrically arranged with respect to a central axis of the substrate, and the hollow structures are axisymmetrically arranged with respect to the central axis of the substrate.

Abstract: A method for forming a semiconductor structure is provided. The method for forming the semiconductor structure includes forming a fin structure over a substrate in a first direction, forming a first gate stack, a second gate stack and a third gate stack across the fin structure, removing the first gate stack to form a trench, depositing a cutting structure in the trench, and forming a first contact plug between the cutting structure and the second gate stack and a second contact plug between the second gate stack and the third gate stack. The fin structure is cut into two segments by the trench. A first dimension of the first contact plug in the first direction is greater than a second dimension of the second contact plug in the first direction.

Abstract: A wafer-grade LED detection device and a wafer-grade LED detection method are provided. The wafer-grade LED detection device includes a light-generating module for providing a first light beam that passes through an LED wafer to be converted into a second light beam, a light-filtering module adjacent to the LED wafer for receiving the second light beam that passes through the light-filtering module to be converted into a third light beam, and a light-detecting module adjacent to the light-filtering module for receiving and detecting the third light beam. A wavelength range of the second light beam is restricted by the light-filtering module, so that a wavelength range of the third light beam is smaller than the wavelength range of the second light beam. When the third light beam is received by the light-detecting module, the light-detecting module can detect the third light beam for obtaining relevant information.

Abstract: An LED wafer, an LED wafer detection device and an LED wafer detection method are provided. The LED wafer includes a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts, and a plurality of negative test contacts. Each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer. The positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers. Whereby, when inputting an electric current into the positive test contacts, and then outputting the electric current from the negative test contacts, each LED chip is excited to generate a light source.

Abstract: A chip carrying structure having chip-suction function is provided. The chip carrying structure includes a non-circuit substrate and a plurality of micro heaters. The non-circuit substrate has a plurality of openings and a plurality of air extraction channels respectively communicated with the openings. The micro heaters are disposed on the non-circuit substrate and carried by the non-circuit substrate. Each of the openings of the non-circuit substrate contacts and suctions one of a plurality of chips, and no adhesive layer is disposed between the non-circuit substrate and the chip. When air is exhausted from the air extraction channels, the openings of the non-circuit substrate can be used to respectively suck the chips, so that the chips can be attached to the non-circuit substrate, and the micro heater can heat a solder ball that is contacted by the chip.

Abstract: An LED wafer, an LED wafer detection device and an LED wafer detection method are provided. The LED wafer includes a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts, and a plurality of negative test contacts. Each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer. The positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers. Whereby, when inputting an electric current into the positive test contacts, and then outputting the electric current from the negative test contacts, each LED chip is excited to generate a light source.

Abstract: An LED wafer, an LED wafer detection device and an LED wafer detection method are provided. The LED wafer includes a wafer base, a plurality of LED chips, a plurality of positive test circuit layers, a plurality negative test circuit layers, a plurality of positive test contacts, and a plurality of negative test contacts. Each LED chip has a positive contact and a negative contact respectively electrically connected to the corresponding positive test circuit layer and the corresponding negative test circuit layer. The positive test contacts are respectively electrically connected to the positive test circuit layers, and the negative test contacts are respectively electrically connected to the negative test circuit layers. Whereby, when inputting an electric current into the negative test contacts, and then outputting the electric current from the positive test contacts, each LED chip is excited to generate a light source.

Abstract: A wafer-grade LED detection device and a wafer-grade LED detection method are provided. The wafer-grade LED detection device includes a light-generating module for providing a first light beam that passes through an LED wafer to be converted into a second light beam, a light-filtering module adjacent to the LED wafer for receiving the second light beam that passes through the light-filtering module to be converted into a third light beam, and a light-detecting module adjacent to the light-filtering module for receiving and detecting the third light beam. A wavelength range of the second light beam is restricted by the light-filtering module, so that a wavelength range of the third light beam is smaller than the wavelength range of the second light beam. When the third light beam is received by the light-detecting module, the light-detecting module can detect the third light beam for obtaining relevant information.

Abstract: A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin.

Abstract: An antenna array module is provided, which includes a circuit layer, an antenna dielectric layer, a metal plate and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material; the ground layer includes a coupling slot, and the signal line is connected to the chip. The antenna dielectric layer is disposed on the circuit layer and the antenna dielectric layer includes a second dielectric material; the thermal conductivity coefficient of the second dielectric material is lower than the thermal conductivity coefficient of the first dielectric material. The metal plate is disposed on the antenna dielectric layer; the signal line is coupled to the metal plate via the coupling slot.

Abstract: A capacitor is provided. The capacitor includes a first electrode layer and a second electrode layer; and a first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the second dielectric layer are disposed between the first electrode layer and the second electrode layer. The first dielectric layer includes a first dielectric powder and a first organic resin, and the second dielectric layer includes a second dielectric powder and a second organic resin. In particular, the weight ratio of the first dielectric powder to the first organic resin is greater than the weight ratio of the second dielectric powder to the second organic resin.

Abstract: An antenna array module is provided, which includes a circuit layer, an antenna dielectric layer, a metal plate and a chip. The circuit layer includes a signal line, a ground layer and a first dielectric material; the ground layer includes a coupling slot, and the signal line is connected to the chip. The antenna dielectric layer is disposed on the circuit layer and the antenna dielectric layer includes a second dielectric material; the thermal conductivity coefficient of the second dielectric material is lower than the thermal conductivity coefficient of the first dielectric material. The metal plate is disposed on the antenna dielectric layer; the signal line is coupled to the metal plate via the coupling slot.

Abstract: A dielectric ceramic composition includes a first inorganic component having a trigonal ditrigonal pyramidal crystal structure, a second inorganic component having a hexoctahedral crystal structure, and a solid solution portion of the trigonal ditrigonal pyramidal crystal structure and the hexoctahedral crystal structure is formed between the first inorganic component and the second inorganic component.

Abstract: A solar cell module includes a substrate; an absorber layer formed over the substrate; a porous alumina passivation layer formed on an upper surface of the absorber layer; a buffer layer conformably formed over the passivation layer; and a transparent conducting oxide layer conformably formed over the buffer layer.

Abstract: A dielectric ceramic composition includes a first inorganic component having a trigonal ditrigonal pyramidal crystal structure, a second inorganic component having a hexoctahedral crystal structure, and a solid solution portion of the trigonal ditrigonal pyramidal crystal structure and the hexoctahedral crystal structure is formed between the first inorganic component and the second inorganic component.

Abstract: An apparatus for producing an inorganic powder and an apparatus for producing and classifying an inorganic powder are provided, wherein the apparatus for producing an inorganic powder includes an insulating tube, at least one pair of annular RF electrodes, and a gas supply apparatus. The pair of annular RF electrodes surrounds the outer circumference of the insulating tube to generate a first electric field region outside the insulating tube and generate a second electric field region having a plasma torch in the insulating tube after being turned on. The gas supply apparatus supplies a reaction mist and an inert gas into the insulating tube to thermally degrade and oxidize the reaction mist into an inorganic powder via the plasma torch.

Abstract: A flexible substrate embedded with wires includes a flexible substrate constituted by a polymer material, and a continuous wire pattern containing a plurality of pores embedded in the flexible substrate, wherein the polymer material fills the pores. A method for fabricating a flexible substrate embedded with wires providing a carrier; forming a continuous wire pattern on the carrier, the continuous wire pattern containing a plurality of pores; covering a polymer material over the continuous wire pattern and the carrier and to fill into the pores; and separating the polymer material and the carrier to form a flexible substrate embedded with the continuous wire pattern” where the only change is the addition of wires.

Abstract: A coating device is provided, and includes a coater and an electrical field generator. The coater contains a slurry or ink and has an outlet. The slurry or ink is coated on a substrate through the outlet. The substrate is disposed adjacent to the outlet, and loads the slurry or ink from the outlet of the coater to form a wet film. The electrical field generator is disposed under the substrate and provides the electrical field, and thus the wet film stacks tightly on the substrate due to the attraction of the electrical field.