Abstract: The invention relates to a positive photosensitive resin composition without color off after etching. The invention also provides a method for manufacturing a thin-film transistor array substrate, a thin-film transistor array substrate and a liquid crystal display device.

Abstract: A photo-curing polysiloxane composition for forming a protective film having superior chemical resistance and development resistance is disclosed. The photo-curing polysiloxane composition includes: a polysiloxane component including at least one polysiloxane having at least one alkenyl group; a quinonediazide compound; a fluorene derivative component including at least one fluorene derivative compound having at least one double-bond-containing group; and a solvent.

Abstract: Disclosed is a photo-curing polysiloxane composition including: a polysiloxane; a quinonediazidesulfonic acid ester; and a pyridine derivative of Formula (II) wherein one to three of R1-R5 independently represent a hydroxyl-substituted C1-C6 alkyl group, and the rest of R1-R5 independently represent hydrogen or a C1-C6 alkyl group.

Abstract: A photo-curing polysiloxane composition includes a polysiloxane, a quinonediazidesulfonic acid ester, a fluorene-containing compound, and a solvent. The polysiloxane is obtained by subjecting a silane monomer component to condensation. A protective film formed from the photo-curing polysiloxane composition, and an element containing the protective film, are also discussed.

Abstract: A photo-curing polysiloxane composition includes a polysiloxane, an o-naphthoquinonediazidesulfonate compound, and a solvent. The polysiloxane contains 25 wt % to 60 wt % of a polysiloxane fraction having a molecular weight ranging from 10,000 to 80,000 based on a total weight of the polysiloxane when calculated from an integral molecular weight distribution curve obtained by plotting cumulative weight percentage versus molecular weight falling within a range between 400 and 100,000 measured by gel permeation chromatography. The amount of oligomers in the polysiloxane having a molecular weight less than 800 is from 0 wt % to 10 wt % based on a total weight of the photo-curing polysiloxane composition. A protective film formed from the photo-curing polysiloxane composition and an element containing the protective film are also disclosed.

Abstract: A photosensitive resin composition includes (A) an alkali-soluble resin, (B) a polysiloxane, (C) an ethylenically unsaturated compound, (D) a photo-initiator, (E) a first solvent, and (F) a black pigment dispersion. The alkali-soluble resin (A) includes an unsaturated-group-containing resin (A-1) obtained by subjecting a mixture containing (i) an epoxy compound having at least two epoxy groups and (ii) a compound having at least one carboxyl group and at least one ethylenically unsaturated group to polymerization. A weight ratio of the black pigment dispersion (F) to the polysiloxane (B) ranges from 5 to 35. Application of the photosensitive resin composition is also disclosed.

Abstract: A photo-curing polysiloxane composition includes a polysiloxane, an o-naphthoquinonediazidesulfonate compound, and a solvent. The polysiloxane contains less than 30 wt % of a polysiloxane fraction having a molecular weight above 8,000, and 35 wt % to 60 wt % of a polysiloxane fraction having a molecular weight ranging from 500 to 2,000 when calculated from an integral molecular weight distribution curve obtained by plotting cumulative weight percentage versus molecular weight falling within a range between 500 and 50,000 measured by gel permeation chromatography. A protective film formed from the photo-curing polysiloxane composition and an element containing the protective film are also disclosed.

Abstract: A photosensitive resin composition and a method for forming patterns by using the same are disclosed. The photosensitive resin composition comprises a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B) and a ketol solvent (C). The novolac resin (A) includes a high-ortho novolac resin (A-1) that has ortho-ortho methylene bonding to all methylene bonding in a ratio of 18% to 25%, and a weight ratio (A-1)/(C) of the high-ortho novolac resin (A-1) to the ketol solvent (C) is 0.1 to 2.0, thereby exhibiting excellent temporal stability and further forming patterns with superior film to thickness uniformity and high resolution.

Abstract: A positive photosensitive resin composition and a method for forming patterns by using the same are disclosed. The photosensitive resin composition comprises a novolac resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B), a dye (C) and a solvent (D). The novolac resin (A) includes a high-ortho novolac resin (A-1) that has ortho-ortho methylene bonding to all methylene bonding in a ratio of 18% to 25%, thereby exhibiting excellent temporal stability and forming patterns with high resolution.

Abstract: A photo-curing polysiloxane composition includes a polysiloxane, an o-naphthoquinonediazidesulfonate compound, and a solvent. The polysiloxane contains 25 wt % to 60 wt % of a polysiloxane fraction having a molecular weight ranging from 10,000 to 80,000 based on a total weight of the polysiloxane when calculated from an integral molecular weight distribution curve obtained by plotting cumulative weight percentage versus molecular weight falling within a range between 400 and 100,000 measured by gel permeation chromatography. The amount of oligomers in the polysiloxane having a molecular weight less than 800 is from 0 wt % to 10 wt % based on a total weight of the photo-curing polysiloxane composition. A protective film formed from the photo-curing polysiloxane composition and an element containing the protective film are also disclosed.

Abstract: A photo-curing polysiloxane composition includes a polysiloxane, an o-naphthoquinonediazidesulfonate compound, and a solvent. The polysiloxane contains less than 30 wt % of a polysiloxane fraction having a molecular weight above 8,000, and 35 wt % to 60 wt % of a polysiloxane fraction having a molecular weight ranging from 500 to 2,000 when calculated from an integral molecular weight distribution curve obtained by plotting cumulative weight percentage versus molecular weight falling within a range between 500 and 50,000 measured by gel permeation chromatography. A protective film formed from the photo-curing polysiloxane composition and an element containing the protective film are also disclosed.

Abstract: The present invention relates to a positive photosensitive resin composition and a method for forming a pattern using said composition by the slit coating process, and more particularly, to a positive photosensitive resin composition, which exhibiting excellent coating uniformity, high sensitivity, excellent developing properties and high film residual ratio and a method for forming a pattern using said composition by the slit coating process. The said composition comprises a novolac resin (A), an o-naphthaquinone diazide sulfonic acid ester (B) and a solvent (C).