Patents by Inventor Chun-An Wei

Chun-An Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11729843
    Abstract: A method and apparatus are disclosed from the perspective of a first device to perform sidelink communication. In one embodiment, the method includes the first device performing sidelink resource selection or reselection procedure for a sidelink transmission to a second device, wherein the sidelink resource selection or reselection procedure is performed to select at least one sidelink resource from candidate sidelink resources within a time duration of selection window. The method further includes the first device selecting a first sidelink resource based on sidelink active time or wake-up time of the second device, wherein the first sidelink resource is within the time duration of selection window. The method also includes the first device performing the sidelink transmission on the first sidelink resource to the second device.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: August 15, 2023
    Assignee: ASUSTek Computer Inc.
    Inventors: Ming-Che Li, Li-Chih Tseng, Yi-Hsuan Kung, Chun-Wei Huang, Li-Te Pan
  • Publication number: 20230248671
    Abstract: The present invention relates to the use of ?-1 adrenergic receptor antagonist to prepare compositions for reducing or preventing damage to normal epithelial cells induced by epidermal growth factor receptor inhibitor (EGFRI) and inhibiting cancer cells, by administering a composition containing a ?-1 adrenergic receptor antagonist to reduce damage to normal epithelial cells induced by the EGFRI. The composition comprising ?-1 adrenergic receptor antagonist is administered to reduce damage to normal epithelial cells induced by the EGFRI. The composition comprising ?-1 adrenergic receptor antagonist can be administered together with an epidermal growth factor receptor inhibitor to synergistically inhibit cancer cells.
    Type: Application
    Filed: July 8, 2021
    Publication date: August 10, 2023
    Inventors: Chun-Wei LU, Jong-Hwei SU PANG, Yu-Shien KO, Wen-Hung CHUNG, Mei-Jun CHEN
  • Publication number: 20230254883
    Abstract: A method and apparatus are disclosed from the perspective of a first device performing sidelink transmission. In one embodiment, the method includes the first device performing sensing on a first sidelink resource pool. The method further includes the first device determining one or more sets of resources based on one or more characteristics or one or more characteristic values associated with the sensing. The method also includes the first device transmitting a signal to at least a second device, wherein the signal indicates the one or more sets of resources and indicates the one or more characteristics or one or more characteristic values for the one or more sets of resources.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Inventors: Ming-Che LI, Chun-Wei Huang
  • Publication number: 20230246376
    Abstract: A module connector comprising a first connecting component and a second connecting component. The first connecting component includes a first base, a plurality of first conductors and a plurality of first clamping parts. The first base includes a first body, a plurality of first cable grooves, a plurality of first through holes and a plurality of third cable grooves. The first body forms the first cable grooves and the third cable grooves to be able to accommodate the cables. The central axes of the first through holes are at a first angle with the first cable grooves and pass through the first body, and one ends of the first through holes communicate with the first cable grooves. The first conductors are disposed in the first cable grooves. The second connecting component can connect with the first connecting component through the cables, so that at least one of signals and power can be transmitted between the second connecting component and the circuit board.
    Type: Application
    Filed: January 20, 2023
    Publication date: August 3, 2023
    Inventors: HSIEN-CHANG LIN, CHUN-WEI CHANG, CHIA-CHEN WEI
  • Publication number: 20230244269
    Abstract: A head-mounted display device, including a front assembly and a wearable assembly, is provided. The wearable assembly is connected to the front assembly and is adapted for wearing the front assembly to a user's face. The wearable assembly includes a cradle, a coupling mechanism, multiple side headbands, a button, and a position returning member. When the button is pressed relative to the cradle, the button drives the coupling mechanism not to be coupled to the side headbands, so that the side headbands can move freely relative to the cradle to adjust the distance between the cradle and the front assembly. When the button is released relative to the cradle, the position returning member drives the coupling mechanism to be coupled to the side headbands, and tighten the side headbands relative to the cradle through the coupling mechanism.
    Type: Application
    Filed: January 28, 2022
    Publication date: August 3, 2023
    Applicant: HTC Corporation
    Inventors: Chou-Wei Wu, Chun-Wei Chang
  • Patent number: 11714454
    Abstract: A head-mounted display device, including a front assembly and a wearable assembly, is provided. The wearable assembly is connected to the front assembly and is adapted for wearing the front assembly to a user's face. The wearable assembly includes a cradle, a coupling mechanism, multiple side headbands, a button, and a position returning member. When the button is pressed relative to the cradle, the button drives the coupling mechanism not to be coupled to the side headbands, so that the side headbands can move freely relative to the cradle to adjust the distance between the cradle and the front assembly. When the button is released relative to the cradle, the position returning member drives the coupling mechanism to be coupled to the side headbands, and tighten the side headbands relative to the cradle through the coupling mechanism.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: August 1, 2023
    Assignee: HTC Corporation
    Inventors: Chou-Wei Wu, Chun-Wei Chang
  • Publication number: 20230238349
    Abstract: A semiconductor package includes a printed circuit board (PCB), a semiconductor device, an interposer, and a conductive adhesive. The PCB has a top surface with at least one ground area formed thereon. The semiconductor device has a bottom surface with at least one first first-type contact formed thereon. The interposer is located between the semiconductor device and the PCB. The bottom surface of the semiconductor device is adhered to a top surface of the interposer by the conductive adhesive. The conductive adhesive overflows from an edge of the top surface of the interposer to have contact with the at least one ground area on the top surface of the PCB.
    Type: Application
    Filed: June 6, 2022
    Publication date: July 27, 2023
    Applicant: Airoha Technology (HK) Limited
    Inventors: Chun-Wei Chen, Yan-Bin Luo, Ming-Yin Ko
  • Publication number: 20230232428
    Abstract: A method and apparatus are disclosed. In an example from the perspective of a first User Equipment (UE), the first UE generates a message requesting inter-UE coordination information, wherein the message includes information associated with a first priority value. The first UE generates a Medium Access Control (MAC) Protocol Data Unit (PDU) including the message. The first UE sets a value of a priority field in a first sidelink control information (SCI) based on a second priority value of the message, wherein the second priority value of the message is a configured value and/or a lowest priority value among a defined set of priority values. The first UE transmits the first SCI to one or more UEs including a second UE, wherein the first SCI schedules a first Physical Sidelink Shared Channel (PSSCH) transmission for transmitting the MAC PDU.
    Type: Application
    Filed: December 27, 2022
    Publication date: July 20, 2023
    Inventors: Ming-Che Li, Chun-Wei Huang, Yi-Hsuan Kung
  • Publication number: 20230230846
    Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.
    Type: Application
    Filed: March 15, 2023
    Publication date: July 20, 2023
    Inventors: Yi-Sheng LIN, Chi-Jen LIU, Chi-Hsiang SHEN, Te-Ming KUNG, Chun-Wei HSU, Chia-Wei HO, Yang-Chun CHENG, William Weilun HONG, Liang-Guang CHEN, Kei-Wei CHEN
  • Publication number: 20230224913
    Abstract: In an example, a User Equipment (UE) operates with shared spectrum channel access on a carrier and/or a cell. The UE receives a configuration for configuring configured grants for uplink transmission in a bandwidth part (BWP). The configured grants include a first configured grant and a second configured grant. The UE configures a first minimum Downlink Feedback Indication (DFI) time delay for the first configured grant according to the configuration. The first minimum DFI time delay is for validation of Hybrid Automatic Repeat Request (HARQ) information in response to one or more first uplink transmissions. The UE configures a second minimum DFI time delay for the second configured grant according to the configuration. The second minimum DFI time delay is for validation of HARQ information in response to one or more second uplink transmissions. The UE does not expect the second minimum DFI time delay to have a different value than the first minimum DFI time delay.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 13, 2023
    Inventors: Chun-Wei Huang, Li-Chih Tseng
  • Publication number: 20230214150
    Abstract: A read voltage level correction method, a memory storage device, and a memory control circuit unit are provided. The method includes: using a first read voltage level as an initial read voltage level to perform a first data read operation on a first physical unit among multiple physical units to obtain a second read voltage level used to successfully read the first physical unit; recording association information between the first read voltage level and the second read voltage level in a transient look-up table; and performing a second data read operation according to a read level tracking table and the association information recorded in the transient look-up table.
    Type: Application
    Filed: February 24, 2022
    Publication date: July 6, 2023
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Shih-Jia Zeng, Chun-Wei Tsao, Hsiao-Yi Lin, Wei Lin
  • Publication number: 20230213591
    Abstract: A power detection circuit is provided for detecting current total input power of a resonant circuit. The power detection circuit includes a detection circuit and an estimation circuit. The detection circuit receives a current signal and obtains resonant-slot baseband power according to the current signal to generate the baseband power value. The current signal represents a resonant-slot current generated by the resonant circuit. The estimation circuit receives the baseband power value and estimates the current total input power according to the baseband power value to generate an estimated power value.
    Type: Application
    Filed: April 25, 2022
    Publication date: July 6, 2023
    Inventors: Ming-Shi HUANG, Zheng-Feng LI, Jhih-Cheng HU, Yi-Liang LIN, Yu-Min MENG, Chun-Wei LIN, Chun CHANG, Thiam-Wee TAN
  • Publication number: 20230217551
    Abstract: A heating device includes a resonant circuit, a detection unit and a control unit. The resonant circuit includes an inverter circuit and a resonant tank. The inverter circuit provides a resonant tank current and a resonant tank voltage. The resonant tank includes a heating coil, a resonant tank capacitor, a resonant tank equivalent inductor and a resonant tank equivalent impedance. The detection unit detects the resonant tank current and the resonant tank voltage to acquire associated parameters. The detection unit calculates an inductance of the resonant tank equivalent inductor according to a capacitance of the resonant tank capacitor, a resonant period and a first expression. The detection unit calculates an impedance value of the resonant tank equivalent impedance according to the inductance of the resonant tank equivalent inductor, a time difference, the resonant period, a reference current value, a negative peak current value and a second expression.
    Type: Application
    Filed: March 8, 2022
    Publication date: July 6, 2023
    Inventors: Ming-Shi Huang, Zheng-Feng Li, Jhih-Cheng Hu, Yi-Liang Lin, Yu-Min Meng, Chun-Wei Lin, Chun Chang, Thiam Wee Tan
  • Patent number: 11695516
    Abstract: In an example, a second UE receives a first SCI and a second SCI from a first UE in a first slot. A groupcast sidelink transmission is scheduled by the first SCI and the second SCI. The second SCI indicates a location indication, associated with a location of the first UE, and a communication range. A PSFCH resource is determined based upon the first SCI. The second UE doesn't transmit a NACK indication on the PSFCH resource if location information of the second UE is available, the groupcast sidelink transmission isn't successfully decoded, and the second UE is outside the communication range. The second UE transmits the NACK indication on the PSFCH resource if the location information isn't available and the groupcast sidelink transmission isn't successfully decoded, or if the location information is available, the groupcast sidelink transmission isn't successfully decoded, and the second UE is within the communication range.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: July 4, 2023
    Assignee: ASUSTek Computer Inc.
    Inventors: Chun-Wei Huang, Ming-Che Li, Li-Chih Tseng
  • Publication number: 20230205008
    Abstract: A display apparatus including a backlight module, first and second electrically-controlled elements, electrically-controlled first and second polarizers, a half-wave plate, and a display panel is provided. An included angle between first and second alignment directions of first and second alignment layers of the first electrically-controlled element is between 75 degrees and 105 degrees. An included angle between third and fourth alignment directions of third and fourth alignment layers of the second electrically-controlled element is between 165 degrees and 195 degrees. The half-wave plate is disposed between the second polarizer and the second electrically-controlled element. The display panel is disposed on the second electrically-controlled element. An included angle between an extending direction of prism structures of each of two optical brightness enhancement films of the backlight module and a viewing angle control direction of the display apparatus is less than 45 degrees.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 29, 2023
    Applicant: Coretronic Corporation
    Inventors: Ping-Yen Chen, Chung-Yang Fang, Chun-Wei Lee, Jung-Wei Chang
  • Publication number: 20230209563
    Abstract: A method and apparatus are disclosed from the perspective of a User Equipment (UE). In one embodiment, the method includes the UE being configured with a first DL (Downlink) BWP (Bandwidth Part) and a second DL BWP. The method also includes the UE receiving and/or monitoring a DCI (Downlink Control Information) in a scheduling CORESET (Control Resource Set) in the first DL BWP, and for determining size of the DCI for decoding, the UE determines whether a TCI (Transmission Configuration Indication) field is present in the DCI or not based on a parameter of the scheduling CORESET before the UE decodes the DCI successfully. The method further includes the UE truncates or pads zero-bits to at least one field (other than the TCI field) in the DCI based on configuration of the second DL BWP after the UE decodes successfully the DCI, wherein a BWP indicator field in the DCI indicates the second DL BWP different from the first DL BWP.
    Type: Application
    Filed: February 20, 2023
    Publication date: June 29, 2023
    Inventors: Chun-Wei Huang, Jia-Hong Liou
  • Publication number: 20230206813
    Abstract: A display driving integrated circuit (IC) and a driving parameter adjustment method thereof are provided. The display driving IC includes a control circuit and a driving parameter determination circuit. The control circuit controls a current driving circuit and a scanning circuit according to a driving parameter, wherein the current driving circuit is suitable for driving multiple driving lines of a light emitting diode (LED) array, and the scanning circuit is suitable for driving multiple scanning lines of the LED array. The driving parameter determination circuit is coupled to the control circuit to provide the driving parameter. The driving parameter determination circuit dynamically adjusts the driving parameter for a target LED in the LED array according to a grayscale value of the target LED.
    Type: Application
    Filed: August 11, 2022
    Publication date: June 29, 2023
    Applicant: Novatek Microelectronics Corp.
    Inventors: Chun-Wei Kang, Yi-Yang Tsai, Siao-Siang Liu, Shih-Hsuan Huang
  • Patent number: 11687698
    Abstract: An electromigration (EM) sign-off methodology that analyzes an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat sink elements located within a defined thermal coupling volume or range.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: June 27, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien Yu Tseng, Amit Kundu, Chun-Wei Chang, Szu-Lin Liu, Sheng-Feng Liu
  • Patent number: 11683791
    Abstract: A method and apparatus are disclosed from the perspective of a UE (User Equipment). In one embodiment, the method includes the UE being configured with a control resource set (CORESET). The method further includes the UE receiving a Downlink Control Information (DCI) on the CORESET, wherein an index is included in the DCI and the index indicates a time domain resource allocation pattern. The method also includes the UE receiving data in Orthogonal Frequency Division Multiplexing (OFDM) symbols determined according to the time domain resource allocation pattern, wherein a range of the time domain resource allocation pattern starts from the first OFDM symbol of the CORESET or after an offset from the first OFDM symbol of the CORESET, and the range of the time domain resource allocation pattern may end across a slot boundary.
    Type: Grant
    Filed: April 18, 2021
    Date of Patent: June 20, 2023
    Assignee: ASUSTek Computer Inc.
    Inventors: Chun-Wei Huang, Richard Lee-Chee Kuo
  • Patent number: D993199
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: July 25, 2023
    Assignees: EPISTAR CORPORATION, YENRICH TECHNOLOGY CORPORATION
    Inventors: Min-Hsun Hsieh, Jen-Chieh Yu, Chun-Wei Chen, Chun-Hung Liu