Abstract: An image sensor includes a photosensitive sensor, a floating diffusion node, a reset transistor, and a source follower transistor. The reset transistor comprises a first source/drain coupled to the floating diffusion node and a second source/drain coupled to a first voltage source. The source follower transistor comprises a gate coupled to the floating diffusion node and a first source/drain coupled to the second source/drain of the reset transistor. A first elongated contact contacts the second source/drain of the reset transistor and the first source/drain of the source follower transistor. The first elongated contact has a first dimension in a horizontal cross-section and a second dimension in the horizontal cross-section. The second dimension is perpendicular to the first dimension, and the second dimension is less than the first dimension.

Abstract: A semiconductor device and a method of forming the same, the semiconductor device includes a substrate, a gate structure and an epitaxial structure. The gate structure is disposed on the substrate, and the epitaxial structure is disposed in the substrate, at one side of the gate structure. The epitaxial structure includes a portion being protruded from a top surface of the substrate, and the portion includes a discontinuous sidewall, with a distance between a turning point of the discontinuous sidewalls and the gate structure being a greatest distance between the epitaxial structure and the gate structure.

Abstract: There is provided a vehicle system including a sensing unit, a processing unit, a control unit and a display unit. The sensing unit is configured to capture an image frame containing an eyeball image from a predetermined distance. The processing unit is configured to calculate a pupil position of the eyeball image in the image frame and generate a drive signal corresponding to the pupil position. The control unit is configured to trigger a vehicle device associated with the pupil position according to the drive signal. The display unit is configured to show information of the vehicle device.

Abstract: Methods, systems, and apparatuses are provided for configuring sidelink (SL) configured grant configuration in SL carrier aggregation. A method for a first device in a wireless communication system can comprise receiving a first sidelink configured grant configuration, wherein the first sidelink configured grant configuration indicates and/or includes a first frequency information and one or more first SL resources, and performing one or more first SL transmissions via the one or more first SL resources on a first SL frequency indicated by the first frequency information.

Abstract: A method and apparatus are disclosed. In an example from the perspective of a first device configured with a plurality of carriers/cells for sidelink communication, the first device determines a first sidelink message for transmission to a first destination associated with a first set of carriers/cells of the plurality of carriers/cells. The first device triggers, based on the first sidelink message, a first scheduling request to a network node. The first device transmits a first signaling of the first scheduling request to the network node. The first signaling includes first information associated with the first destination and/or second information associated with the first set of carriers/cells.

Abstract: A method of forming a high electron mobility transistor (HEMT) includes a first III-V compound layer and a second III-V compound layer disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A source feature and a drain feature are disposed on the second III-V compound layer. A p-type layer is disposed on a portion of the second III-V compound layer between the source feature and the drain feature. A gate electrode is disposed on the p-type layer. A capping layer is disposed on the second III-V compound layer.

Abstract: A method and apparatus are disclosed from the perspective of a first device to perform sidelink communication. In one embodiment, the method includes the first device performing sidelink resource selection or reselection procedure for a sidelink transmission to a second device, wherein the sidelink resource selection or reselection procedure is performed to select at least one sidelink resource from candidate sidelink resources within a time duration of selection window. The method further includes the first device selecting a first sidelink resource based on sidelink active time or wake-up time of the second device, wherein the first sidelink resource is within the time duration of selection window. The method also includes the first device performing the sidelink transmission on the first sidelink resource to the second device.

Abstract: In an example, a first User Equipment (UE) receives a sidelink transmission, associated with enabled sidelink Hybrid Automatic Repeat Request (HARQ) feedback, from a second UE in a first timing. The first UE attempts to access a channel for transmission of a sidelink HARQ feedback in a first feedback resource in a second timing. The sidelink HARQ feedback is in response to the sidelink transmission. The attempt to access the channel for the transmission of the sidelink HARQ feedback in the first feedback resource fails. The first UE performs channel access for a second feedback resource. The second feedback resource is within a window and/or within a predefined duration of the first timing or the second timing. In response to successfully performing the channel access, the first UE performs, in the second feedback resource, a sidelink feedback transmission of the sidelink HARQ feedback to the second UE.

Abstract: A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

Abstract: A solvent recycle system minimizes chemical consumption used in various semiconductor processes. The solvent is recycled from a nozzle bath via the addition of buffer tank to connect the bath and circulation pumps. Improvements to the bath design further maintain solvent cleanness by preventing intrusion of particles and overflow conditions in the bath.

Abstract: A transceiver includes: a radio-frequency (RF) front-end circuit; a dedicated RF front-end circuit; and a switchable matching circuit, integrated in a chip. The RF front-end circuit deals with communications of a first wireless standard, and the dedicated RF front-end circuit deals with communications of a second wireless standard. The switchable matching circuit provides impedance matching between the signal port and the RF front-end circuit when the RF front-end circuit is in operation, and provides impedance matching between the signal port and the dedicated RF front-end circuit when the dedicated RF front-end circuit is in operation, and includes: a first capacitive circuit coupled to the signal port; a first switch circuit coupled between the first capacitive circuit and the dedicated RF front-end circuit; a second capacitive circuit coupled to the dedicated RF front-end circuit; and a second switch circuit coupled to a second terminal of the second capacitive circuit.

Abstract: An air mover is provided. The air mover includes a housing, a spacer, a co-axial motor, a first fan and a second fan. The housing includes a first housing member and a second housing member. A first inlet, a second inlet and an outlet are formed on the housing. The first inlet is formed on the first housing member and the second inlet is formed on the second housing member. The spacer is disposed between the first housing member and the second housing member. The co-axial motor includes a shaft, wherein the co-axial motor is disposed on the spacer. The shaft includes a first free end and a second free end. The first free end extends in a first direction, and the second free end extends in a second direction.

Abstract: An electromigration (EM) sign-off methodology that utilizes a system for analyzing an integrated circuit design layout to identify heat sensitive structures, self-heating effects, heat generating structures, and heat dissipating structures. The EM sign-off methodology includes a memory and a processor configured for calculating adjustments of an evaluation temperature for a heat sensitive structure by calculating the effects of self-heating within the temperature sensitive structure as well as additional heating and/or cooling as a function of thermal coupling to surrounding heat generating structures and/or heat dissipating elements located within a defined thermal coupling volume or range of the heat sensitive structures.

Abstract: A power detection circuit is provided for detecting current total input power of a resonant circuit. The power detection circuit includes a detection circuit and an estimation circuit. The detection circuit receives a current signal and obtains resonant-slot baseband power according to the current signal to generate the baseband power value. The current signal represents a resonant-slot current generated by the resonant circuit. The estimation circuit receives the baseband power value and estimates the current total input power according to the baseband power value to generate an estimated power value.

Abstract: The technology described herein is directed to a DC input power supply unit with an auxiliary boost control circuit (or controller) that facilitates continuous supply of power to a standby output load of the power supply unit in a bootloader mode. More specifically, the auxiliary boost circuit (or controller) is configured to assume control of a primary power boost stage from a primary controller in a bootloader mode so that the power supply unit can continue to supply power to the standby output with a protection function regardless of the state of the power supply unit or primary controller.

Abstract: A vice jaw deflecting structure, comprising a vice main body, a lead screw positioning seat, a lead screw, a first flexible jaw set and a second flexible jaw set; the guide slot of the vice main body has a bottom surface, a first side wall surface, and a second side wall surface; the first flexible jaw set and the second flexible jaw set have a slide, a jaw and a limiting component; the slide is configured with a limiting block protruding toward the jaw, the limiting block protrudes toward the lead screw positioning seat and is formed with a -shaped stop block having a curved top view; the jaw bottom surface has a first convex wall surface and a second convex wall surface matching and contacting the first side wall surface and the second side wall surface.

Abstract: A semiconductor device includes a first wafer and a second wafer. The semiconductor device includes a seal ring structure comprising a first metal structure in a body of the first wafer, a second metal structure in the body of the first wafer, a third metal structure in a body of the second wafer, and a metal bonding structure including a first set of metal elements coupling the first metal structure and the third metal structure through an interface between the first wafer and the second wafer, and a second set of metal elements coupling the second metal structure and the third metal structure through the interface between the first wafer and the second wafer.

Abstract: A head-mounted display device assembly and an external adjustment module are provided. The head-mounted display device assembly includes a head-mounted display device and the external adjustment module. The head-mounted display device has a first lens and a second lens corresponding to both eyes, and also has a driven mechanism. The first lens and the second lens are respectively coupled to the driven mechanism. The external adjustment module is used for assembling and electrically connecting to the head-mounted display device, and includes a driving element and a transmission element. In a coupling state, the transmission element is coupled to the driving element and the driven mechanism, and the driving element drives the driven mechanism via the transmission element to adjust a distance between the first lens and the second lens. In a separation state, at least one of the driving element and the driven mechanism is separated from the transmission element.

Abstract: Systems and methods reduce a locking time of a type-II all-digital phase-locked loop (ADPLL) circuit by performing steps that comprise receiving a reference signal having a reference frequency and setting a digitally controlled oscillator (DCO) to a target frequency greater than the reference frequency. The DCO generates an output signal that is used to generate a feedback signal. A time-to-digital converter is used to determine an initial phase difference between the reference signal and the feedback signal, and a digital initial phase compensation circuit adjusts the initial phase difference to a substantially zero phase difference to reduce the locking time of the ADPLL circuit such that the ADPLL circuit reaches a steady-state condition in ten or fewer cycles of the reference signal.