Abstract: The disclosure provides a method for tree-based machine learning model reduction and an electronic device using the same. A boosting tree model including multiple subtrees is obtained. Subtree importance of each of the subtrees is determined according to feature importance information respectively corresponding to multiple model features of the boosting tree model. At least one continuous tree subset is extracted from the subtrees according to the subtree importance of each of the subtrees. The at least one continuous tree subset includes at least one of the subtrees. At least one reduced boosting tree model of the boosting tree model is obtained according to the at least one continuous tree subset.

Abstract: An electro-acoustical transducer device is disclosed, which includes: a hollow disk body that generally defines an axis of propagation, the hollow disk body comprising: a pair of plate members extending substantially perpendicular to the axis of propagation, each provided with a central transmitting port arranged about the axis of propagation, and a peripheral enclosure jointing the pair of plate members at the respective outer edge portions thereof, thereby defining a chamber of resonance between the pair of plate members; wherein a ring-opening about the axis of propagation that enables access to the chamber of resonance is formed between the central transmitting ports of the plate members.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: A multi-phase coupled inductor includes a first iron core, a second iron core, and a plurality of coil windings. The first iron core includes a first body and a plurality of first core posts. The plurality of first core posts are connected to the first body. The second iron core is opposite to the first iron core. The second iron core and the first body are spaced apart from each other by a gap. The plurality of coil windings wrap around the plurality of first core posts, respectively. Each of the coil windings has at least two coils.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.

Abstract: An intelligent early screening model for Alzheimer's disease and a construction method thereof are provided. The construction method includes: retrieving keywords by means of a database to obtain influence factors of the Alzheimer's disease; extracting common feature data of Alzheimer's disease patients from big data in healthcare of a sample region; combining the influence factors and the common feature data, and then inputting into a machine learning model for learning; and verifying and evaluating performance of the machine learning model. The intelligent early screening model for the Alzheimer's disease is constructed through the construction method. The intelligent early screening model can capture Alzheimer's disease high-risk elderly population in common elderly population in advance, realizing early prevention and achieving a goal of eliminating the disease and treating the disease.

Abstract: Disclosed are TRPM8 modulators as defined by formula (I) for achieving a cooling effect on skin and mucousa.

Abstract: The present specification describes examples of position-based switching of display devices. An example augmented reality (AR) device includes an AR display device to render display data. The example AR device also includes a wireless communication device to transmit and receive wireless signals. The example AR device further includes a processor to: 1) determine a position of the AR device relative to a computing device based on wireless signals communicated with the computing device; and 2) switch an activity state of the AR display device based on the determined position of the AR device relative to the computing device.

Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

Abstract: A display controller includes a first chip and a second chip. The first chip is configured to control a display device. The second chip is externally coupled to the first chip, and configured to be a random access memory and. The first chip is further configured to provide a first supply power to the second chip and to access the second chip during the controlling of the display device.

Abstract: The present invention relates to a platform door control apparatus based on a double 2-vote-2 architecture, including a security communication and logic processing module, a driver collection module, and a maintenance module, the security communication and logic processing module is separately connected to the driver collection module and the maintenance module, and both the security communication and logic processing module and the driver collection module are devices using the double 2-vote-2 architecture. Compared with the prior art, the present invention has the following advantages of effectively improving linkage efficiency of a signal system and a platform door system, and the like.

Abstract: The present invention relates to a coral composite extract, a composition including the same and a method of producing the same. The coral composite extract includes at least two briarane-type diterpenoid compounds from corals of Briareum violaceum, B. excavatum and B. stechei, thereby being applied as an effective ingredient of a skin external use composition, a cosmetic composition and a medicinal composition.

Abstract: In a 3D imaging method using scanning-type coherent diffraction, a 2D photodetector detects diffraction of a coherent beam emitted from a light source that moves in a scanning manner toward a sample object to obtain multiple 2D diffraction data distributions; and a processor converts the 2D diffraction data distributions into multiple 3D intensity distributions in a reciprocal space, performs one or more iterations based on a sample function, a light source function and the 3D intensity distributions to obtain a phase-retrieval sample function, and generates a 3D reconstruction image of the sample object based on the phase-retrieval sample function.

Abstract: A recycling apparatus for a solar cell module includes a platform for supporting and positioning the solar cell module, and at least one milling device disposed on the platform and having a milling member configured to contact a back plate of the solar cell module, and a casing defining a chip-receiving space and having an air inlet and a suction port communicating with the chip-receiving space. A drive device is connected to the at least one milling device for driving the at least one milling device to move around and mill the solar cell module through the milling member.

Abstract: A liquid crystal polymer, composition, liquid crystal polymer film, laminated material and method of forming liquid crystal polymer film are provided. The liquid crystal polymer includes a first repeating unit, a second repeating unit, a third repeating unit, and a fourth repeating unit. The first repeating unit has a structure of Formula (I), the second repeating unit has a structure of Formula (II), the third repeating unit has a structure of Formula (III), and the fourth repeating unit has a structure of Formula (IV), a structure of Formula (V) or a structure of Formula (VI) wherein A1, A2, A3, Z1, R1, R2, R3 and Q are as defined in the specification.

Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.

Abstract: The disclosure is directed to compounds of Formula I Pharmaceutical compositions comprising compounds of Formula I, as well as methods of their use and preparation, are also described.

Abstract: A wearable device includes a frame element and a dielectric substrate. The frame element includes a first metal element, a second metal element, and a third metal element. A first gap is provided between the first metal element and the second metal element. A second gap is provided between the second metal element and the third metal element. A third gap is provided between the third metal element and the first metal element. The dielectric substrate is surrounded by the first metal element, the second metal element, and the third metal element. A first antenna element is formed by the first metal element. A second antenna element is formed by the second metal element. A third antenna element is formed by the third metal element.

Abstract: An exposure device and method for semiconductor manufacturing, focusing on the creation of exposure patterns with High Dynamic Range (HDR) capabilities, is disclosed. The exposure device includes a laser source, a first spatial light modulator (SLM), specifically a Liquid Crystal on Silicon (LCOS) device, and a second SLM, specifically a Digital Micromirror Device (DMD). The LCOS is positioned upstream in the optical path and is optimized for modulating the phase of the laser. It also directs the laser light towards specific areas on the DMD, crucial for enhancing detail and contrast in exposure patterns. The DMD, placed downstream, is composed of micromirrors that modulate the amplitude of the reflected laser, essential for achieving HDR in exposure patterns. This cooperative interaction between the LCOS and DMD allows for the creation of exposure patterns with a wide range of light intensities, from very bright to very dark, thereby achieving high dynamic range.

Abstract: A package structure includes a bonding substrate, an integrated circuit, and a heat sink metal. The integrated circuit includes an active region facing the bonding substrate. The heat sink metal is located between the bonding substrate and the active region of the integrated circuit. The heat sink metal is electrically insulated with the integrated circuit.