Abstract: A biological hair shape change composition including a macromolecular component, a small molecular component and an alkali agent component is provided. The macromolecular component includes a protease belonging to the class of alkaline proteases, and the small molecular component includes a peptide with reduction activity. Both the macromolecular component and the small molecular component are obtained from a fermentation product of Bacillus licheniformis and a keratin and/or keratin polymer-containing medium. Molecular weights of ingredients in the macromolecular component are greater than or equal to 3 kDa and are 3-1000 kDa, and molecular weights of ingredients in the small molecular component are less than 3 kDa and are 0.01-2.99 kDa.

Abstract: A circuit board includes an insulating substrate layer, a ground layer, an insulating layer, insulating through holes, a signal transmission layer and a polymer conductive member. The ground layer is disposed between the insulating layer and the insulating substrate layer. The signal transmission layer is disposed on one side of the insulating layer opposite to the ground layer. The insulating through holes penetrate through the signal transmission layer and the insulation layer to connect to the ground layer. The polymer conductive member is disposed within the insulating through holes, and one part thereof is electrically connected to the ground layer, and another part thereof extends outwards from the signal transmission layer.

Abstract: A device includes a substrate, a first conductive layer on the substrate, a first conductive via, and further conductive layers and conductive vias between the first conductive via and the substrate. The first conductive via is between the substrate and the first conductive layer, and is electrically connected to the first conductive layer. The first conductive via extends through at least two dielectric layers, and has thickness greater than about 8 kilo-Angstroms. An inductor having high quality factor is formed in the first conductive layer and also includes the first conductive via.

Abstract: An immersion cooling system includes a cooling tank and a filtration system. The cooling tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The filtration system includes a pipeline, a pump, a filter and a cooling device. The pipeline is in fluid communication with the cooling tank. The pump is disposed in the pipeline and is configured to drive the liquid coolant to flow through the pipeline. The filter is disposed in the pipeline and is configured to filter the liquid coolant. The cooling device is connected to the pipeline and is configured to cool the liquid coolant. The pipeline has an inlet connected to the cooling tank. The cooling device is located between the pump and the inlet of the pipeline.

Abstract: An LLC resonant converter with variable resonant tank includes a switching circuit for converting a DC voltage into switching signal, a variable resonant tank coupled to the switching circuit for receiving the switching signal to provide a primary current, a transformer circuit having a primary and a secondary side winding, and a rectifying/filtering circuit to rectifying and filtering a secondary current. The variable resonant tank is coupled between the switching circuit and the transformer circuit, which includes a variable resonant inductor, a magnetizing inductance and a resonant capacitor coupled in series for dynamically adjusting the gain curve of the LLC resonant converter according to the demand of the output current.

Abstract: A user equipment (UE) and a method for wireless communication are provided. The method includes: receiving a radio resource control (RRC) configuration from a base station (BS); determining whether a first parameter is configured in the RRC configuration; receiving first downlink control information (DCI) from the BS, the first DCI including a first field indicating a first Hybrid Automatic Repeat Request (HARD) process identifier (ID); determining that a number of bits in the first field is a default number in a case that the first parameter is not configured in the RRC configuration; and determining that the number of bits in the first field is a specific number greater than the default number in a case that the first parameter is configured in the RRC configuration.

Abstract: A method of manufacturing an ECO base cell includes forming first and second active areas on opposite sides of, and having corresponding long axes arranged parallel to, a first axis of symmetry; forming non-overlapping first, second and third conductive structures having long axes in a second direction perpendicular to the first direction and parallel to a second axis of symmetry, each of the first, second and third conductive structures to correspondingly overlap the first and second active areas, the first conductive structure being between the second and third conductive structures; removing material from central regions of the second and third conductive structures; and forming a fourth conductive structure being over the central regions of the second and third conductive structures and occupying an area which substantially overlaps a first segment of the first conductive structure and a first segment of one of the second and third conductive structures.

Abstract: An information handling system may include a circuit board, an integrated circuit package mounted on the circuit board, the integrated circuit package comprising: a plurality of solder balls for electrically coupling the integrated circuit package to the circuit board, the plurality of solder balls comprising a first solder ball and a second solder ball, an internal electrical coupling coupled between the first solder ball and the second solder ball, and a management controller electrically coupled to the internal electrical coupling, the first solder ball, and the second solder ball, and configured to provide out-of-band management facilities for management of the information handling system, the management controller further configured to detect whether an impedance discontinuity has occurred with respect to one or both of the first solder ball and the second solder ball.

Abstract: The invention provides a semiconductor structure, which comprises a middle/high voltage device region and a low voltage device region, a plurality of fin structures disposed in the low voltage device region, and a protruding part located at a boundary Between the middle/high voltage device region and the low voltage device region. A top surface of the protruding part is flat, and the top surface of the protruding part is aligned with a flat top surface of the middle/high voltage device region.

Abstract: A water-based thermal-insulation coating material includes a water-based resin, a film forming auxiliary agent, and a thermal insulation agent. The water-based resin is at least one material selected from a group consisting of: acrylic resins, polyurethane resins, epoxy resins, and combinations thereof. The water-based resin has a minimum film-forming temperature of not less than 5° C. The film forming auxiliary agent is at least one material selected from a group consisting of: plasticizers, alcohol-ether solvents, alcohol-ester solvents, a mixed solvent of ethylene glycol mono-butyl ether and di-propylene glycol butyl ether, aprotic solvents, and combinations thereof. The thermal insulation agent is hydrated silicon dioxide.

Abstract: A superabsorbent polymers and a method of forming the same are provided. The method is processed by adding calcined shell powders to a free radical polymerization. The superabsorbent polymers with more micropores can be obtained. Therefore, absorptivity and permeability for the liquid of the superabsorbent polymers are increased, and diffusibility and liquid conductivity of the superabsorbent polymers are also improved.

Abstract: A vertical-cavity surface-emitting laser array includes a substrate. The VCSEL array also includes an active layer formed between a lower mirror and an upper mirror. The VCSEL array also includes a contact layer formed between the active layer and the substrate. The VCSEL array also includes an isolation trench between the first VCSEL and the second VCSEL of the VCSEL array. The isolation trench extending through the contact layer is filled with a filler.

Abstract: Semiconductor devices and methods of fabrication are provided. A method includes providing a semiconductor structure with a first sidewall distanced from a second sidewall, fins located between the first sidewall and the second sidewall, and isolation regions located between the first sidewall and the second sidewall, wherein adjacent fins are separated by a respective isolation region. The method further includes performing a plasma etching process to etch the fins and the isolation regions, wherein the plasma etching process chemically etches the fins, wherein the plasma etching process physically etches the isolation regions to recesses defining a crown-shaped depth profile.

Abstract: A transistor structure includes a semiconductor body, a source region, a drain region and a gate region. The semiconductor body has a convex structure and the convex structure has at least four conductive channels extending upward. The source region contacts with a first end of the convex structure. The drain region contacts with a second end of the convex structure. The gate region has a gate conductive layer, wherein the gate conductive layer is across over the convex structure. Two or four conductive channels are not parallel to each other, and there is no shallow trench isolation region among the at least four conductive channels.

Abstract: In accordance with an example embodiment of the present invention, a method comprises allocating a control channel resource in a wireless relay transmission frame on a wireless relay link; generating a control signaling based on at least one of a resource allocation scheme, a status of the wireless relay link and a traffic condition of the wireless relay link; mapping the control signaling to the allocated control channel resource via at least one of a time-first mapping, a frequency-first mapping, and a multiplexing mapping; and transmitting the control signaling in the allocated control channel resource on the wireless relay link to at least one associated relay node.

Abstract: A signal control method suitable for a touch screen is provided. The signal control method comprises: switching a plurality of scan lines to an enabling voltage level sequentially in a display stage; turning on a plurality of switches sequentially to transmit a plurality of display data to a plurality of data lines when a first scan line of the plurality of scan lines is in an enabled voltage level, wherein a first switch of the plurality of switches is coupled to a first data line of the plurality of data lines, and the first data line corresponds to one of a plurality of dummy lines in a vertical direction, when the first scan line is in the enabled voltage level, the first switch is turned on after other switches are turned on; and setting the plurality of dummy lines to a touch voltage in a touch stage.

Abstract: A package structure includes a mounting pad having a mounting surface; a semiconductor chip having a magnetic device, a first magnetic field shielding, and a molding. The semiconductor chip comprises a first surface perpendicular to a thickness direction of the semiconductor chip, a second surface opposite to the first surface, wherein the second surface is attached to the mounting surface of the mounting pad, and a third surface connecting the first surface and the second surface. The first magnetic field shielding including a plurality of segments laterally at least partially surrounding the semiconductor chip, wherein a bottom surface of the first magnetic field shielding is attached to the mounting surface of the mounting pad, wherein the mounting surface comprises first portion free from overlapping with the first magnetic field shielding from a top view perspective. The molding surrounding the mounting pad and in direct contact with the mounting surface.

Abstract: A method includes forming a mask layer above a substrate. The substrate is patterned by using the mask layer as a mask to form a trench in the substrate. An isolation structure is formed in the trench, including feeding first precursors to the substrate. A bias is applied to the substrate after feeding the first precursors. With the bias turned on, second precursors are fed to the substrate. Feeding the first precursors, applying the bias, and feeding the second precursors are repeated.

Abstract: An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.