Abstract: A semiconductor device, includes a first metal layer, a second metal layer, and at least one conductive via. The first metal layer has a first conductor that extends in a first direction and a second conductor that extends in the first direction. The second metal layer has a third conductor that extends in a second direction, wherein the second direction is transverse to the first direction. The at least one conductive via connects the first conductor and the second conductor through the third conductor. The semiconductor device further includes at least one of a first gate electrode that extends in the second direction and is connected to the first conductor, or a drain/source contact that extends in the second direction and is connected to the second conductor.

Abstract: A speaker module includes a casing, a speaker unit and a vibration absorber. The speaker unit has a sound cavity. The speaker unit is disposed on the casing, and the speaker unit includes a first diaphragm. The vibration absorber is disposed in the casing, and the vibration absorber has a second diaphragm. When the first diaphragm vibrates, the airflow generated by the first diaphragm drives the second diaphragm to vibrate, and the vibration direction of the second diaphragm is opposite to the vibration direction of the first diaphragm, so as to absorb the vibration generated by the first diaphragm to the casing.

Abstract: A button mechanism is provided, including a frame, a motor disposed on the frame, a rotary member connected to the motor, a protrusion disposed on the rotary member, and a movable member hinged to the frame. When the movable member moves relative to the frame in the first direction, the protrusion contacts the movable member, and the rotary member is driven by the motor to rotate, whereby the movable member is pushed back by the protrusion so that it moves in the second direction, which is the opposite of the first direction.

Abstract: An electrical connector assembly includes an electrical connector having a card slot and plural terminals extending into the card slot; and a heat dissipation module having a fixing plate at one end thereof, the fixing plate having a notch; wherein the electrical connector has a supporting surface for supporting the fixing plate and a fixing member for mating with the notch, the fixing member includes a spherical or hemispherical head portion for guiding the fixing plate at multiple angles.

Abstract: A medical rehabilitation chair includes a main frame, multiple castor devices mounted on the bottom of the main frame, and two armrest boards mounted on two sides of the main frame. A telescopic damping driver, a seat frame assembly, a backrest frame assembly, a leg support assembly, a lifting mechanism, and a foot support assembly are assembled on the main frame. The seat frame assembly has a front section connecting the leg support assembly and a rear section connecting the backrest frame assembly. The telescopic damping driver drives the backrest frame assembly, the seat frame assembly, and the leg support assembly, to produce different swinging angles. The lifting mechanism drives the seat frame assembly to lift or lower. The foot support assembly is movable in a horizontal direction to protrude from the front section of the main frame.

Abstract: A display panel includes a substrate, first, second, and third data lines, scan lines, a first active device, a second active device, and pixel electrodes. The first and the third data lines have a first polarity. The second data line has a second polarity. The first polarity is different from the second polarity. A source electrode of the first active device disposed between the first data line and the second data line is electrically connected to the first data line. An extension region of the semiconductor pattern of the first active device extends toward and overlaps the second data line. A source electrode of the second active device disposed between the second data line and the third data line is electrically connected to the second data line. An extension region of the semiconductor pattern of the second active device extends toward and overlaps the third data line.

Abstract: An electronic device is provided. The electronic device includes a frame, a working panel, a case, and an adhesive material. The frame includes a side wall and a back plate. The working panel is disposed on the back plate. The case is disposed on the frame and adjacent to the working panel. The adhesive material is disposed on the case. The side wall has an outer surface facing away from the working panel. In a cross-section view of the electronic device, a portion of the adhesive material is in contact with the outer surface of the side wall of the frame, and a length of the adhesive material is greater than or equal to 50% of a length of the side wall of the frame along an extension direction.

Abstract: A micro light emitting device display apparatus including a substrate, a plurality of micro light emitting devices, an isolation layer, and at least one first air gap is provided. The substrate has a plurality of connection pads. The micro light emitting devices are discretely disposed on the substrate. The isolation layer is disposed between the substrate and each of the micro light emitting devices. The at least one first air gap is disposed between the substrate and a surface of the isolation layer facing the substrate.

Abstract: A method of fabricating a contact structure includes the following steps. An opening is formed in a dielectric layer. A conductive material layer is formed within the opening and on the dielectric layer, wherein the conductive material layer includes a bottom section having a first thickness and a top section having a second thickness, the second thickness is greater than the first thickness. A first treatment is performed on the conductive material layer to form a first oxide layer on the bottom section and on the top section of the conductive material layer. A second treatment is performed to remove at least portions of the first oxide layer and at least portions of the conductive material layer, wherein after performing the second treatment, the bottom section and the top section of the conductive material layer have substantially equal thickness.

Abstract: An integrated circuit is provided and includes first and second gates arranged in first and second layers, wherein the first and second gates extend in a first direction; a first insulating layer interposed between the first and second gates, wherein the first insulating layer, a first portion of the first gate, and a first portion of the second gate overlap with each other in a layout view; a cut layer, different from the first insulating layer, disposed on a second portion of the first gate; a first via passing through the cut layer and coupled to the second portion of the first gate; and a second via overlapping the first portion of the first gate and the first portion of the second gate, and coupled to the second gate. The first and second vias are configured to transmit different control signals to the first and second gates.

Abstract: A controller includes a body and a surrounding part. The body has a control area for sending a control signal according to a movement of a thumb of a user. The surrounding part is connected to the body and used to surround and be fixed to a proximal phalange of an index finger of the user. The body is away from a joint between the proximal phalange and a metacarpal bone of the user.

Abstract: Disclosed in the present application are a rotating disk device and a curing machine. The rotating disk device comprises a mounting plate, a bearing plate, an active rotating disk, and a driving member. The bearing plate is rotatably mounted on one side of the mounting plate and in a detachable manner, and the bearing plate is provided with a first magnetic member. The active rotating disk is arranged on the other side of the mounting plate, and a second magnetic member, which is arranged corresponding to the first magnetic member, is arranged on the active rotating disk. The driving member is connected to the mounting plate and cooperates with the active rotating disk, and the driving member is used for driving the active rotating disk to rotate.

Abstract: A method for forming a semiconductor device structure includes forming nanostructures over a substrate. The method also includes forming a gate structure wrapped around the nanostructures. The method also includes forming source/drain epitaxial structures over opposite sides of the nanostructures. The method also includes forming a first interlayer dielectric structure over the source/drain epitaxial structures. The method also includes removing the first interlayer dielectric structure. The method also includes forming a recess in the source/drain epitaxial structures. The method also includes forming a silicide structure in the recess. The method also includes forming a second interlayer dielectric structure over the silicide structure.

Abstract: An antifuse-type one time programming memory includes a first memory cell. The first memory cell includes an antifuse transistor. The antifuse transistor includes a first nanowire, a first gate structure, a first drain/source structure and a second drain/source structure. The first nanowire is surrounded by the first gate structure. The first gate structure includes a first spacer, a second spacer, a first gate dielectric layer and a first gate layer. The first drain/source structure is electrically contacted with the first terminal of the first nanowire. The second drain/source structure is electrically contacted with the second terminal of the first nanowire.

Abstract: A multifunctional expansion bolt assembly includes a sleeve, a screw rod, and a connecting member. The sleeve includes a hollow body formed between first and second ends of the sleeve. The second end has at least one open groove. The screw rod includes a threaded portion. At least a portion of the threaded portion protrudes beyond the first end of the sleeve. A second end of the screw rod includes a conic portion having gradually increasing diameters towards the second end of the screw rod. The conic portion has a maximal diameter greater than an inner diameter of the second end of the sleeve. The screw rod includes at least one engaging portion having non-circular cross section and engaging with the at least one open groove. The connecting member includes an inner threading in threading connection with a portion of the threaded portion of the screw rod.

Abstract: A processor decompresses a compressed data vector into an original data vector. The processor includes an execution circuit, which receives a decompress instruction that includes two input operands and an output operand. The input operands indicate an address of the compressed data vector in a memory, and the output operand indicates the vector register for storing the original data vector after decompression. The execution circuit executes the decompress instruction to decompress the compressed data vector. When executing the decompress instruction, the execution circuit performs the following operations: read a mask value from the mask register, the mask value being a binary sequence indicating zero positions in the original data vector; generate a selection signal based on the mask value; and generate the original data vector by applying the selection signal to a selection switch that receives the compressed data vector as input.

Abstract: A silicon interconnect die includes through-substrate via (TSV) structures extending through a silicon substrate; an insulating spacer layer including a horizontally-extending portion overlying a top surface of the silicon substrate and a plurality of tubular insulating material portions laterally surrounding a respective one of the TSV structures; and a front metallic shield layer including a horizontally-extending metallic shield portion and at least one tubular metallic shield portion laterally surrounding a respective one of the tubular insulating material portions.