Patents by Inventor Chun-Chiang Yen

Chun-Chiang Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190272048
    Abstract: A mouse device includes a main body, an air cushion and a first hidden key. The first hidden key is located at a first side of the main body. The air cushion is located under the main body, and contactable with a working surface. The first hidden key is arranged between the main body and the air cushion. The first hidden key is not exposed outside. When the main body is leaned in a first direction and pressed down, the first hidden key is triggered to generate a first leaning signal. The first hidden key can be used to replace the key of the conventional keyboard. Due to the structure of the mouse device, the mouse device can be operated more intuitively.
    Type: Application
    Filed: September 27, 2018
    Publication date: September 5, 2019
    Inventors: Yu-Chiang Lin, Chun-Nan Su, Pei-Luan Yen, Hsin-Ju Teng, Ting-Yu Liu, Cheng-Chih Hsieh
  • Publication number: 20190148280
    Abstract: A semiconductor substrate and a manufacturing method thereof are provided. The semiconductor substrate includes a dielectric layer, a circuit layer, a first protection layer and a plurality of conductive posts. The dielectric layer has a first surface and a second surface that are opposite to each other. The circuit layer is embedded in the dielectric layer and is exposed from the first surface. The first protection layer covers a portion of the first circuit layer and defines a plurality of holes that expose a remaining portion of the first circuit layer. The conductive posts are formed in the holes.
    Type: Application
    Filed: January 14, 2019
    Publication date: May 16, 2019
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chun-Che Lee, Ming-Chiang Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen
  • Patent number: 9923103
    Abstract: A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: March 20, 2018
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Publication number: 20170123156
    Abstract: A method for manufacturing an optical electrical module includes steps as follow. Forming first patterns on a first substrate by a first mask, wherein an angle between a primary flat of the first substrate and an arrangement direction having a maximum number of first pattern units of the first mask is (?+90°*n), wherein ? is between 22° to 39°, and n is an integer. Subjecting the first substrate to a first patterning process using the first patterns as a mask to form accommodating grooves and a reflective groove connected with the accommodating grooves in the first substrate, wherein an extension direction of each of the accommodating grooves is perpendicular to an extension direction of the reflective groove.
    Type: Application
    Filed: January 6, 2017
    Publication date: May 4, 2017
    Applicant: Centera Photonics Inc.
    Inventors: Shang-Jen Yu, Chun-Chiang Yen
  • Patent number: 9488791
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: November 8, 2016
    Assignee: Centera Photonics Inc.
    Inventors: Chia-Chi Chang, Guan-Fu Lu, Chun-Chiang Yen
  • Publication number: 20150316734
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Application
    Filed: April 28, 2015
    Publication date: November 5, 2015
    Inventors: Chia-Chi Chang, Guan-Fu Lu, Chun-Chiang Yen
  • Publication number: 20150255635
    Abstract: A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.
    Type: Application
    Filed: May 20, 2015
    Publication date: September 10, 2015
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 9064988
    Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: June 23, 2015
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 9057850
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: June 16, 2015
    Assignee: Centera Photonics Inc.
    Inventors: Chia-Chi Chang, Guan-Fu Lu, Chun-Chiang Yen
  • Patent number: 8940563
    Abstract: A method for manufacturing an optoelectronic module is proposed. The method comprises the following steps: providing a top cover with a reflective surface. Then, a light-guiding structure is formed. A mounting device is provided. Next, an optoelectronic device is formed on the mounting device with a first precision. A control chip is formed on the mounting device with a second precision different from the first precision. The top cover combines with the mounting device, wherein the light-guiding structure is between the top cover and the mounting device, and the optoelectronic device faces the reflective surface.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: January 27, 2015
    Assignee: Centera Photonics Inc.
    Inventors: Shang-Jen Yu, Chien-Chen Hsieh, Chun Chiang Yen
  • Publication number: 20140068924
    Abstract: A method for manufacturing an optoelectronic module is proposed. The method comprises the following steps: providing a top cover with a reflective surface. Then, a light-guiding structure is formed. A mounting device is provided. Next, an optoelectronic device is formed on the mounting device with a first precision. A control chip is formed on the mounting device with a second precision different from the first precision. The top cover combines with the mounting device, wherein the light-guiding structure is between the top cover and the mounting device, and the optoelectronic device faces the reflective surface.
    Type: Application
    Filed: November 15, 2013
    Publication date: March 13, 2014
    Inventors: Shang-Jen YU, Chien-Chen HSIEH, Chun Chiang YEN
  • Publication number: 20130309801
    Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 21, 2013
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
  • Patent number: 8580589
    Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: November 12, 2013
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
  • Publication number: 20130270427
    Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.
    Type: Application
    Filed: December 20, 2012
    Publication date: October 17, 2013
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Publication number: 20120241795
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Applicant: Centera Photonics Inc.
    Inventors: Chia-Chi CHANG, Guan-Fu Lu, Chun-Chiang Yen
  • Publication number: 20120241600
    Abstract: An optical electrical module includes a first substrate, a second substrate, a bearing portion and at least one optical electrical element. The second substrate is combined with the first substrate and has a reflective surface facing to the first substrate. The bearing portion is disposed between the first substrate and the second substrate to limit at least one light guide element. The optical electrical element is disposed on a surface of the first substrate facing to the reflective surface and faces to the reflective surface. The optical electrical element is configured for providing or receiving light signals. The reflective surface and the light guide element are disposed on an optical path of the light signals.
    Type: Application
    Filed: March 18, 2012
    Publication date: September 27, 2012
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Yun-Chih Lee, Chang-Feng Lu, Chun-Chiang Yen, Shang-Jen Yu, Hsu-Liang Hsiao
  • Patent number: 8138509
    Abstract: Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: March 20, 2012
    Assignee: VisEra Technologies Company, Limited
    Inventors: Tzy-Ying Lin, Chun-Chiang Yen, Wu-Cheng Kuo
  • Publication number: 20100219433
    Abstract: Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.
    Type: Application
    Filed: February 27, 2009
    Publication date: September 2, 2010
    Inventors: Tzy-Ying LIN, Chun-Chiang Yen, Wu-Cheng Kuo