Patents by Inventor Chun-Chiang Yen
Chun-Chiang Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9064988Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.Type: GrantFiled: December 20, 2012Date of Patent: June 23, 2015Assignee: Centera Photonics Inc.Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
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Patent number: 9057850Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.Type: GrantFiled: March 22, 2012Date of Patent: June 16, 2015Assignee: Centera Photonics Inc.Inventors: Chia-Chi Chang, Guan-Fu Lu, Chun-Chiang Yen
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Patent number: 8940563Abstract: A method for manufacturing an optoelectronic module is proposed. The method comprises the following steps: providing a top cover with a reflective surface. Then, a light-guiding structure is formed. A mounting device is provided. Next, an optoelectronic device is formed on the mounting device with a first precision. A control chip is formed on the mounting device with a second precision different from the first precision. The top cover combines with the mounting device, wherein the light-guiding structure is between the top cover and the mounting device, and the optoelectronic device faces the reflective surface.Type: GrantFiled: November 15, 2013Date of Patent: January 27, 2015Assignee: Centera Photonics Inc.Inventors: Shang-Jen Yu, Chien-Chen Hsieh, Chun Chiang Yen
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Publication number: 20140068924Abstract: A method for manufacturing an optoelectronic module is proposed. The method comprises the following steps: providing a top cover with a reflective surface. Then, a light-guiding structure is formed. A mounting device is provided. Next, an optoelectronic device is formed on the mounting device with a first precision. A control chip is formed on the mounting device with a second precision different from the first precision. The top cover combines with the mounting device, wherein the light-guiding structure is between the top cover and the mounting device, and the optoelectronic device faces the reflective surface.Type: ApplicationFiled: November 15, 2013Publication date: March 13, 2014Inventors: Shang-Jen YU, Chien-Chen HSIEH, Chun Chiang YEN
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Publication number: 20130309801Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.Type: ApplicationFiled: May 15, 2012Publication date: November 21, 2013Applicant: CENTERA PHOTONICS INC.Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
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Patent number: 8580589Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.Type: GrantFiled: May 15, 2012Date of Patent: November 12, 2013Assignee: Centera Photonics Inc.Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
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Publication number: 20130270427Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.Type: ApplicationFiled: December 20, 2012Publication date: October 17, 2013Applicant: CENTERA PHOTONICS INC.Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
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Publication number: 20120241600Abstract: An optical electrical module includes a first substrate, a second substrate, a bearing portion and at least one optical electrical element. The second substrate is combined with the first substrate and has a reflective surface facing to the first substrate. The bearing portion is disposed between the first substrate and the second substrate to limit at least one light guide element. The optical electrical element is disposed on a surface of the first substrate facing to the reflective surface and faces to the reflective surface. The optical electrical element is configured for providing or receiving light signals. The reflective surface and the light guide element are disposed on an optical path of the light signals.Type: ApplicationFiled: March 18, 2012Publication date: September 27, 2012Applicant: CENTERA PHOTONICS INC.Inventors: Yun-Chih Lee, Chang-Feng Lu, Chun-Chiang Yen, Shang-Jen Yu, Hsu-Liang Hsiao
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Publication number: 20120241795Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.Type: ApplicationFiled: March 22, 2012Publication date: September 27, 2012Applicant: Centera Photonics Inc.Inventors: Chia-Chi CHANG, Guan-Fu Lu, Chun-Chiang Yen
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Patent number: 8138509Abstract: Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.Type: GrantFiled: February 27, 2009Date of Patent: March 20, 2012Assignee: VisEra Technologies Company, LimitedInventors: Tzy-Ying Lin, Chun-Chiang Yen, Wu-Cheng Kuo
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Publication number: 20100219433Abstract: Light emitting devices conformally covered by a luminescent material layer are presented. A light emitting device includes a semiconductor light emitting die attached to a substrate. At least one bond pad is disposed on the semiconductor light emitting die. A luminescent material layer conformally covers the semiconductor light emitting die, wherein the luminescent material layer has at least one opening corresponding to and exposing the at least one bond pad. At least one wirebond is electrically connected to the at least one bond pad and a contact pad on the substrate.Type: ApplicationFiled: February 27, 2009Publication date: September 2, 2010Inventors: Tzy-Ying LIN, Chun-Chiang Yen, Wu-Cheng Kuo