Abstract: An embodiment provides systems and techniques for determining a process model. During operation, the system may receive a first optical model which models a first optical system of a photolithography process. Next, the system may use the first optical model to determine a second optical model that models a second latent image that is formed by the first optical system at a second distance. The system may also use the first optical model to determine a third optical model that models a third latent image that is formed by the first optical system at a third distance. Next, the system may receive process data which is obtained by subjecting a test layout to the photolithography process. The system may then determine a process model using the first optical model, the second optical model, the third optical model, the test layout, and the process data.

Abstract: An embodiment provides systems and techniques for determining an improved process model which models mask corner rounding (MCR) effects. During operation, the system may receive a mask layout and process data which was generated by applying a photolithography process to the mask layout. The system may also receive an uncalibrated process model which may contain a set of MCR components. Next, the system may identify a set of corners in the mask layout. The system may then determine a set of mask layers, wherein at least some of the mask layers correspond to the MCR components. Next, the system may determine an improved process model by calibrating the uncalibrated process model using the set of mask layers, and the process data.

Abstract: An embodiment provides systems and techniques for determining an improved process model which models mask corner rounding (MCR) effects. During operation, the system may receive a mask layout and process data which was generated by applying a photolithography process to the mask layout. The system may also receive an uncalibrated process model which may contain a set of MCR components. Next, the system may identify a set of corners in the mask layout. The system may then modify the mask layout in proximity to the set of corners to obtain a modified mask layout. Alternatively, the system may determine a set of mask layers. Next, the system may determine an improved process model by calibrating the uncalibrated process model using the modified mask layout and/or the set of mask layers, and the process data.

Abstract: An embodiment provides systems and techniques for determining an improved process model which models mask corner rounding (MCR) effects. During operation, the system may receive a mask layout and process data which was generated by applying a photolithography process to the mask layout. The system may also receive an uncalibrated process model which may contain a set of MCR components. Next, the system may identify a set of corners in the mask layout. The system may then modify the mask layout in proximity to the set of corners to obtain a modified mask layout. Alternatively, the system may determine a set of mask layers. Next, the system may determine an improved process model by calibrating the uncalibrated process model using the modified mask layout and/or the set of mask layers, and the process data.

Abstract: One embodiment of the present invention provides a system that determines an accurate process model. During operation, the system receives process data. Next, the system receives an optical model which models an optical system of a photolithography process. The system then determines a stack model using the optical model, wherein the stack model models the effects of the photolithography process on the stack layers. Finally, the system determines a process model using the optical model, the stack model, and the process data.

Abstract: One embodiment of the present invention provides a system that determines an accurate process model. During operation, the system receives process data. Next, the system receives an optical model which models an optical system of a photolithography process. The system then determines a stack model using the optical model, wherein the stack model models the effects of the photolithography process on the stack layers. Finally, the system determines a process model using the optical model, the stack model, and the process data.

Abstract: An embodiment provides systems and techniques for determining a process model. During operation, the system may receive a first optical model which models a first optical system of a photolithography process. Next, the system may use the first optical model to determine a second optical model that models a second latent image that is formed by the first optical system at a second distance. The system may also use the first optical model to determine a third optical model that models a third latent image that is formed by the first optical system at a third distance. Next, the system may receive process data which is obtained by subjecting a test layout to the photolithography process. The system may then determine a process model using the first optical model, the second optical model, the third optical model, the test layout, and the process data.

Abstract: A transparent touch panel according to this aspect of the present invention comprises a transparent substrate, a capacitive touch device positioned on the transparent substrate, an interfacial structure positioned on the capacitive touch device, and a display device positioned on the interfacial structure. The capacitive touch device includes a plurality of first sensing blocks positioned on the transparent substrate, a dielectric layer covering the first sensing blocks, a plurality of second sensing blocks positioned on the dielectric layer, a plurality of first wires positioned on the transparent substrate, and a plurality of second wires positioned on the dielectric layer. Preferably, the first sensing blocks and the second sensing blocks are interlaced, each first wire connects the first sensing blocks on the same column, and each second wire connects the second sensing blocks on the same row.

Abstract: A light transmission touch panel comprises a transparent substrate, a first transparent conductive layer, an insulation layer and a second transparent conductive layer, wherein the first transparent conductive layer, the insulation layer and the second transparent conductive layer are patterned and overlaid on a surface of the substrate. The first transparent conductive layer and the second transparent conductive layer are either on a surface or respectively on two opposite surfaces of the insulation layer. An electrical field having a component along the surface of the substrate occurs between two adjacent portions of the first transparent conductive layer and the second transparent conductive layer once they are electrically charged. When an article touches the touch panel, the intensity of the electrical lines is accordingly changed so that the touch panel can detect where the touch position is.