Abstract: A display with multiple light sources sharing a device driver is disclosed. In one embodiment of the present invention a display includes a first device driver, a first light source, a second light source and a first light-source selection circuit which is coupled to the first device driver, the first light source and the second light source. The first light-source selection circuit is configured to pair the first device driver with the first light source during a first time interval and to pair the first device driver with the second light source in a second time interval.

Abstract: The present invention relates to a laser light source optical projection architecture, which comprises a laser light source group, a color control device, a phosphor device and an optical filter group. Accordingly, the laser light source optical projection architecture does not require to synchronize the phosphor device with the color field sequential display system, and the color control (ratios of the color duty) does not need to be determined in advance, i.e. at the time the color control device is manufactured. Various color field ratios can be achieved by adjusting positions of the specific color control device to obtain different red, blue and green color field durations, allowing easy electronic control of the color field duty cycles.

Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.

Abstract: The present invention relates to a laser light source optical projection architecture, which comprises a laser light source group, a color control device, a phosphor device and an optical filter group. Accordingly, the laser light source optical projection architecture does not require to synchronize the phosphor device with the color field sequential display system, and the color control (ratios of the color duty) does not need to be determined in advance, i.e. at the time the color control device is manufactured. Various color field ratios can be achieved by adjusting positions of the specific color control device to obtain different red, blue and green color field durations, allowing easy electronic control of the color field duty cycles.

Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A light modulating Backplane with multi-layer pixel electrodes is disclosed. The light modulating backplane includes a multiple pixel control circuits and multiple pixel electrodes. The pixel electrodes include a first pixel electrode layer coupled to a corresponding pixel control circuit and a second pixel electrode layer. A passivation layer covers the pixel electrodes. The first pixel electrode layer is formed using a first metal such as copper and the second pixel electrode layer is formed using a second metal such as aluminum.

Abstract: A micro LED display module having a light transmissive substrate and a manufacturing method thereof are provided. The light transmissive substrate has good transmissivity with respect to the visible band. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to pixel electrodes and the other is electrically connected to the light transmissive substrate. The trenches define a plurality of micro LED pixels arranged in an array. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed on the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed on the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.

Abstract: A manufacturing method of micro LED display module is provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, and the color layer is disposed on the light transmissive conductive layer.

Abstract: A binocular head-mounted device with interpupillary distance adjustment mechanisms is provided in the present invention, which comprises a visual frame, two display modules and two interpupillary distance adjustment mechanisms. The two display modules are disposed at a left side and a right side of the visual frame respectively. Each of the two interpupillary distance adjustment mechanisms is disposed on one of the display modules and on the visual frame and has a snap-fit portion and a positioning structure corresponding thereto. The positioning structure has a plurality of positioning recesses arranged horizontally in a first direction, and the plurality of positioning recesses can be snap-fitted with the snap-fit portion so that the display module is moved parallel to the first direction and then positioned.

Abstract: A binocular head-mounted device with interpupillary distance adjustment mechanisms is provided in the present invention, which comprises a visual frame, two display modules and two interpupillary distance adjustment mechanisms. The two display modules are disposed at a left side and a right side of the visual frame respectively. Each of the two interpupillary distance adjustment mechanisms is disposed on one of the display modules and on the visual frame and has a snap-fit portion and a positioning structure corresponding thereto. The positioning structure has a plurality of positioning recesses arranged horizontally in a first direction, and the plurality of positioning recesses can be snap-fitted with the snap-fit portion so that the display module is moved parallel to the first direction and then positioned.

Abstract: The present invention provides a method of unit level liquid crystal display device assembly process for liquid crystal on silicon. It starts with sawing silicon wafer and ITO glass substrate. Then good silicon dies and ITO glass dies will be picked and transferred to separate carriers. Alignment layers will respectively be coated on each silicon die and ITO glass die after cleaning. Then there are two options for the following steps. In method one, silicon die and ITO glass die lamination comes after coating frame adhesive. Then frame adhesive is cured. The liquid crystal will fill the cell and then seal the fill port. Die mounting, wire bonding and encapsulation will come along with external ITO connection to call it an end. In method two, frame adhesive precedes internal connection and LC one drop fill. Then silicon die and ITO glass die are laminated before frame adhesive cure. Afterwards die mount, wire bonding and encapsulation come last.

Abstract: The present invention provides a method of unit level liquid crystal display device assembly process for liquid crystal on silicon. It starts with sawing silicon wafer and ITO glass substrate. Then good silicon dies and ITO glass dies will be picked and transferred to separate carriers. Alignment layers will respectively be coated on each silicon die and ITO glass die after cleaning. Then there are two options for the following steps. In method one, silicon die and ITO glass die lamination comes after coating frame adhesive. Then frame adhesive is cured. The liquid crystal will fill the cell and then seal the fill port. Die mounting, wire bonding and encapsulation will come along with external ITO connection to call it an end. In method two, frame adhesive precedes internal connection and LC one drop fill. Then silicon die and ITO glass die are laminated before frame adhesive cure. Afterwards die mount, wire bonding and encapsulation come last.