Patents by Inventor Chun Fan
Chun Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12293034Abstract: A display device includes an in-cell touch display panel, a flexible printed circuit board, and a source driver. The in-cell touch display panel includes touch sensing electrodes, touch sensing pins, pixel electrodes, and source pins. The touch sensing pins are electrically connected to the touch sensing electrodes. The source pins are electrically connected to the pixel electrodes. The flexible circuit board includes dummy pads, touch sensing leads, input pads, output pads, and output signal leads. The touch sensing leads are electrically connected to the dummy pads and the touch sensing pins. The output signal leads are electrically connected to the output pads and the source pins. The source driver includes input terminals and output terminals. The input terminals are electrically connected to the input pads. The output terminals are electrically connected to the output pads. The source driver does not include a touch sensing terminal.Type: GrantFiled: December 15, 2023Date of Patent: May 6, 2025Assignee: AUO CORPORATIONInventors: Chi-Cheng Chen, Chun-Fan Chung
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Patent number: 12274180Abstract: A method for fabricating a semiconductor device includes the steps of forming a magnetic tunneling junction (MTJ) on a MRAM region of a substrate, forming a first inter-metal dielectric (IMD) layer around the MTJ, forming a patterned mask on a logic region of the substrate, performing a nitridation process to transform part of the first IMD layer to a nitride layer, forming a first metal interconnection on the logic region, forming a stop layer on the first IMD layer, forming a second IMD layer on the stop layer, and forming a second metal intercom in the second IMD layer to connect to the MTJ.Type: GrantFiled: March 17, 2023Date of Patent: April 8, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Chen-Yi Weng, Si-Han Tsai, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang, Yu-Ping Wang, Ju-Chun Fan, Ching-Hua Hsu, Yi-Yu Lin, Hung-Yueh Chen
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Publication number: 20250107978Abstract: A method for skin protection by applying a zinc oxide-on-silicate platelet composite (ZnO/NSP composite) is formulated in a cosmetic composition, to the skin of a subject. The ZnO/NSP composite is made of silicate platelet and ZnO particles adsorbed thereon, in which the ZnO particles are created by the dehydration of Zn(OH)2 formed on the silicate platelet. The ZnO particles adhering on the silicate platelet can effectively improve the dispersibility of zinc oxide particles in water, and the average particle size can reach near nanometer size. Moreover, the ZnO/NSP composite exhibits better antimicrobial and UV light-absorbing properties than ZnO itself, and are not toxic or irritating to the skin.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Inventors: Jiang-Jen Lin, Huey-Min Lai, Mu-Tang Hou, Ting-Yueh Hou, Chun-Fan Chen
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Patent number: 12262646Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.Type: GrantFiled: December 25, 2023Date of Patent: March 25, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Ching-Hua Hsu, Yi-Yu Lin, Hung-Yueh Chen
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Patent number: 12232425Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.Type: GrantFiled: November 21, 2023Date of Patent: February 18, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
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Publication number: 20250056327Abstract: Various solutions for reporting aggregated bandwidth capability with respect to an apparatus in mobile communications are described. The apparatus may transmit a plurality of capability signaling of aggregated bandwidth in band combination level to a network node. Each of capability signaling of aggregated bandwidth may indicate a maximum aggregated bandwidth across component carriers. The apparatus may transmit a feature set per component-carrier, which includes channel bandwidths, to the network node for determining a channel bandwidth configuration set according to the plurality of capability signaling of aggregated bandwidth and the feature set per component-carrier. The apparatus may communicate with the network node based on the channel bandwidth configuration set.Type: ApplicationFiled: August 5, 2024Publication date: February 13, 2025Inventors: Mu-Tai Lin, Chun-Fan Tsai, Chia-Chun Hsu
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Patent number: 12219650Abstract: A User Equipment (UE) including a wireless transceiver and a controller is provided. The wireless transceiver performs wireless transmission and reception to and from a first service network utilizing a first RAT or a second service network utilizing a second RAT. The controller sends an indicator of a connection release request to the first service network via the wireless transceiver in response to terminating a first communication service with the first service network or in response to leaving the first service network for the second service network. Also, the controller releases a Radio Resource Control (RRC) connection with the first service network after sending the indicator of the connection release request.Type: GrantFiled: July 31, 2023Date of Patent: February 4, 2025Assignee: MediaTek Inc.Inventors: Chien-Chun Huang-Fu, Chun-Fan Tsai, I-Kang Fu, Chin-Chia Chang
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Patent number: 12194137Abstract: A biological hair shape change composition including a macromolecular component, a small molecular component and an alkali agent component is provided. The macromolecular component includes a protease belonging to the class of alkaline proteases, and the small molecular component includes a peptide with reduction activity. Both the macromolecular component and the small molecular component are obtained from a fermentation product of Bacillus licheniformis and a keratin and/or keratin polymer-containing medium. Molecular weights of ingredients in the macromolecular component are greater than or equal to 3 kDa and are 3-1000 kDa, and molecular weights of ingredients in the small molecular component are less than 3 kDa and are 0.01-2.99 kDa.Type: GrantFiled: October 28, 2021Date of Patent: January 14, 2025Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yin-Lung Han, Chieh-Lun Cheng, Kai-Chun Fan, Pei-Jyuan Gao, Bo-Han Chen
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Publication number: 20240353941Abstract: A display device includes an in-cell touch display panel, a flexible printed circuit board, and a source driver. The in-cell touch display panel includes touch sensing electrodes, touch sensing pins, pixel electrodes, and source pins. The touch sensing pins are electrically connected to the touch sensing electrodes. The source pins are electrically connected to the pixel electrodes. The flexible circuit board includes dummy pads, touch sensing leads, input pads, output pads, and output signal leads. The touch sensing leads are electrically connected to the dummy pads and the touch sensing pins. The output signal leads are electrically connected to the output pads and the source pins. The source driver includes input terminals and output terminals. The input terminals are electrically connected to the input pads. The output terminals are electrically connected to the output pads. The source driver does not include a touch sensing terminal.Type: ApplicationFiled: December 15, 2023Publication date: October 24, 2024Inventors: Chi-Cheng CHEN, Chun-Fan CHUNG
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Patent number: 12110374Abstract: A recyclable crosslinked polymeric foam includes a reaction product of 0.1 to 10 parts by weight of a crosslinking agent and 0.1 to 5 parts by weight of a radical initiator, based on 100 parts by weight of a polymeric material. The crosslinking agent is represented by the following formula: wherein R is an alkylene group having 2 to 10 carbon atoms, an arylene group having 6 to 18 carbon atoms, or a cycloalkylene group having 6 to 18 carbon atoms.Type: GrantFiled: January 24, 2022Date of Patent: October 8, 2024Assignee: USI CorporationInventors: Yung-Shen Chang, Chun-Fan Hsieh, Yu-Hsiang Lin
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Publication number: 20240319904Abstract: A method of managing access to a first memory via a second memory includes autonomously copying data from one or more of the data blocks in the first plurality of data blocks in the first memory to corresponding one or more of the data blocks in the second plurality of data blocks in the second memory sequentially. Access to the first memory with a first plurality of data blocks is at a first speed and access to the second memory with a second plurality of data blocks is at a second speed. A command is received for reading from the second memory. Responsive to receiving the command, a pointer is obtained indicating an address of a data block in the second memory that contains data copied from the first memory and that is first available for access. The data is obtained from the data block based on the pointer.Type: ApplicationFiled: January 9, 2024Publication date: September 26, 2024Applicant: MediaTek Inc.Inventors: Pao-Hung Kuo, Po-Chun Fan, Sheng-Yen Yang
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Publication number: 20240267806Abstract: Methods and apparatus are provided for UE-triggered handover and early preparation with coexistence of the network-triggered handover. In one novel aspect, the UE is configured early measurement report configuration, receives an early handover command from the serving base station with a handover candidate cell list, monitors handover triggering conditions for each candidate cell on the handover candidate cell list based on a UE-triggered handover configuration and performs the UE-triggered handover to a candidate cell when the corresponding triggering condition is met for the candidate cell. In one embodiment, the UE receives a network-triggered handover command to a target cell, suspends the UE-triggered handover configuration and performs the network-triggered handover to the target cell. The UE discards the UE-triggered handover configuration upon success of the network-triggered handover and resumes the UE-triggered handover configuration upon failure of the network-triggered handover.Type: ApplicationFiled: April 17, 2024Publication date: August 8, 2024Inventors: Li-Chuan TSENG, Yuanyuan ZHANG, Yung-Hsiang LIU, Chun-Fan TSAI, Chia-Chun HSU
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Publication number: 20240172456Abstract: A method of manufacturing a hybrid random access memory in a system-on-chip, including steps of providing a semiconductor substrate with a magnetoresistive random access memory (MRAM) region and a resistive random-access memory (ReRAM) region, forming multiple ReRAM cells in the ReRAM region on the semiconductor substrate, forming a first dielectric layer on the semiconductor substrate, wherein the ReRAM cells are in the first dielectric layer, forming multiple MRAM cells in the MRAM region on the first dielectric layer, and forming a second dielectric layer on the first dielectric layer, wherein the MRAM cells are in the second dielectric layer.Type: ApplicationFiled: January 23, 2024Publication date: May 23, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Po-Kai Hsu, Hui-Lin Wang, Ching-Hua Hsu, Yi-Yu Lin, Ju-Chun Fan, Hung-Yueh Chen
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Patent number: 11991572Abstract: Methods and apparatus are provided for UE-triggered handover and early preparation with coexistence of the network-triggered handover. In one novel aspect, the UE is configured early measurement report configuration, receives an early handover command from the serving base station with a handover candidate cell list, monitors handover triggering conditions for each candidate cell on the handover candidate cell list based on a UE-triggered handover configuration and performs the UE-triggered handover to a candidate cell when the corresponding triggering condition is met for the candidate cell. In one embodiment, the UE receives a network-triggered handover command to a target cell, suspends the UE-triggered handover configuration and performs the network-triggered handover to the target cell. The UE discards the UE-triggered handover configuration upon success of the network-triggered handover and resumes the UE-triggered handover configuration upon failure of the network-triggered handover.Type: GrantFiled: September 30, 2019Date of Patent: May 21, 2024Assignee: MEDIATEK INC.Inventors: Li-Chuan Tseng, Yuanyuan Zhang, Yung-Hsiang Liu, Chun-Fan Tsai, Chia-Chun Hsu
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Publication number: 20240130246Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.Type: ApplicationFiled: December 25, 2023Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Ching-Hua Hsu, Yi-Yu Lin, Hung-Yueh Chen
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Patent number: 11957061Abstract: A semiconductor device includes a substrate, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer is disposed on the substrate, around a first metal interconnection. The second dielectric layer is disposed on the first dielectric layer, around a via and a second metal interconnection. The second metal interconnection directly contacts the first metal interconnection. The third dielectric layer is disposed on the second dielectric layer, around a first magnetic tunneling junction (MTJ) structure and a third metal interconnection. The third metal interconnection directly contacts top surfaces of the first MTJ structure and the second metal interconnection, and the first MTJ structure directly contacts the via.Type: GrantFiled: May 23, 2023Date of Patent: April 9, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Yi-Yu Lin, Ching-Hua Hsu, Hung-Yueh Chen
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Publication number: 20240114419Abstract: Examples pertaining to secure transmission in mobile communications are described. A UE receives an RRC reconfiguration message from a master network node. The RRC reconfiguration message comprises information regarding candidate cells and predefined reconfigurations, and each candidate cell is associated with one predefined reconfiguration. The UE evaluates a triggering condition for at least one candidate cell to determine whether to trigger a conditional cell change procedure and performs the conditional cell change procedure to switch a PSCell associated with the apparatus to a target cell in an event that the triggering condition for the target cell is met. The UE derives a security key according to a counter value and a key of the master network node. The counter value is obtained from a sequence of distinct counter values of the target cell or of a target secondary node stored by the processor or is generated by the processor.Type: ApplicationFiled: September 22, 2023Publication date: April 4, 2024Inventor: Chun-Fan Tsai
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Publication number: 20240107608Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. In certain configurations, the UE enters a first radio resource control (RRC) connection with a first base station of a first network. The UE receives, from the first base station, an indication that enables the UE to send a first request for deactivating or releasing resources used for communications with the first base station. In response to a determination to enter a second RRC connection with a second base station of a second network, the UE sends, to the first base station, the first request for deactivating or releasing the resources. The UE enters the second RRC connection with the second base station while maintaining the first RRC connection with the first base station.Type: ApplicationFiled: September 15, 2023Publication date: March 28, 2024Inventors: Chun-Fan Tsai, Kun-Lin Wu, Mu-Tai Lin
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Publication number: 20240099154Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.Type: ApplicationFiled: November 21, 2023Publication date: March 21, 2024Applicant: UNITED MICROELECTRONICS CORPInventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
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Patent number: 11925035Abstract: A hybrid random access memory for a system-on-chip (SOC), including a semiconductor substrate with a MRAM region and a ReRAM region, a first dielectric layer on the semiconductor substrate, multiple ReRAM cells in the first dielectric layer on the ReRAM region, a second dielectric layer above the first dielectric layer, and multiple MRAM cells in the second dielectric layer on the MRAM region.Type: GrantFiled: October 26, 2022Date of Patent: March 5, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Po-Kai Hsu, Hui-Lin Wang, Ching-Hua Hsu, Yi-Yu Lin, Ju-Chun Fan, Hung-Yueh Chen