Abstract: An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.

Abstract: A broadband connection structure is disclosed. The broadband connection structure includes a carrier and a chip. The carrier includes a first resonator. The chip includes a second resonator and configured on the carrier using a flip-chip method. The first resonator is connected to the second resonator via a magnetic field and an electric field existing therebetween to transmit a broadband signal between the carrier and the chip. A broadband connection method is also disclosed.

Abstract: Disclosed are an electronic device and a waterproof touch module of the electronic device. The electronic device includes a casing and the waterproof touch module, and an installing portion is formed on a surface of the casing. The waterproof touch module includes a touch unit, an adhesive and a waterproof plate, and the touch unit is installed at the installing portion, and the waterproof plate is attached onto a surface of the casing through the adhesive and covered onto the touch unit, so that the touch unit is sealed in the installing portion to achieve a good waterproof effect.