Patents by Inventor Chun-Hsing Li

Chun-Hsing Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150293619
    Abstract: Disclosed are an electronic device and a waterproof touch module of the electronic device. The electronic device includes a casing and the waterproof touch module, and an installing portion is formed on a surface of the casing. The waterproof touch module includes a touch unit, an adhesive and a waterproof plate, and the touch unit is installed at the installing portion, and the waterproof plate is attached onto a surface of the casing through the adhesive and covered onto the touch unit, so that the touch unit is sealed in the installing portion to achieve a good waterproof effect.
    Type: Application
    Filed: August 29, 2014
    Publication date: October 15, 2015
    Inventors: Chun-Hsing LI, Cheng-Hung CHIANG
  • Publication number: 20150123749
    Abstract: A broadband connection structure is disclosed. The broadband connection structure includes a carrier and a chip. The carrier includes a first resonator. The chip includes a second resonator and configured on the carrier using a flip-chip method. The first resonator is connected to the second resonator via a magnetic field and an electric field existing therebetween to transmit a broadband signal between the carrier and the chip. A broadband connection method is also disclosed.
    Type: Application
    Filed: May 30, 2014
    Publication date: May 7, 2015
    Applicant: National Chiao Tung University
    Inventors: Chun-Hsing Li, Chien-Nan Kuo
  • Publication number: 20150068024
    Abstract: An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.
    Type: Application
    Filed: March 11, 2014
    Publication date: March 12, 2015
    Applicant: National Chiao Tung University
    Inventors: Chun-Hsing Li, Chien-Nan Kuo, Chun-Lin Ko
  • Patent number: D635132
    Type: Grant
    Filed: June 3, 2010
    Date of Patent: March 29, 2011
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D635133
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: March 29, 2011
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D635134
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: March 29, 2011
    Assignee: Getac Technology Corporation
    Inventors: Chun-Hsing Li, Kuanpang Chen
  • Patent number: D635135
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: March 29, 2011
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D635564
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: April 5, 2011
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D635565
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: April 5, 2011
    Assignee: Getac Technology Corporation
    Inventors: Chun-Hsing Li, Kuanpang Chen
  • Patent number: D670693
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D670694
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D670695
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: November 13, 2012
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D674385
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: January 15, 2013
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D694752
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: December 3, 2013
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D702679
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: April 15, 2014
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D715293
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: October 14, 2014
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D725116
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: March 24, 2015
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D730905
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: June 2, 2015
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D742953
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: November 10, 2015
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li
  • Patent number: D747322
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: January 12, 2016
    Assignee: Getac Technology Corporation
    Inventor: Chun-Hsing Li