Patents by Inventor Chun Hung
Chun Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250144150Abstract: The present invention provides a preparation method of pharmaceutical composition for treating chronic stroke, involving injection via brain into the cranium of a patient having chronic stroke for six months or more; the pharmaceutical composition is a suspension at least comprising adipose-derived stem cells treated by cell expansion, an active synergistic component and a growth factor, wherein the expression level of CD34 and CD45 of the adipose-derived stem cells treated by cell expansion is 10% or less, and the expression level of CD90 and CD105 is 90% or more; the active synergistic component is an extracellular vesicle; the growth factor is at least one selected from the group consisting of HGF, G-CSF, Fractalkine, IP-10, EGF, IL-1?, IL-1?, IL-4, IL-5, IL-13, IFN?, TGF? and sCD40L. The present invention overcomes the limitations of previous cell therapy and provides a cell-based preparation that is clinically safe and therapeutically effective for chronic cerebral stroke.Type: ApplicationFiled: January 8, 2025Publication date: May 8, 2025Inventors: Po-Cheng Lin, Pi-Chun Huang, Chia-Hsin Lee, Ming-Hsi Chuang, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang, Yi-Chun Lin, Yu-Chen Tsai, Peggy Leh Jiunn Wong, Ruei-Yue Liang
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Publication number: 20250149348Abstract: A method for reducing warpage occurred to a substrate during a packaging process includes attaching a plurality of dies to an upper surface of the substrate; attaching an adhesive material having a first curing temperature to a lower surface of the substrate; applying a liquid-packaging material having a second curing temperature to surroundings of the dies; heating the substrate, the adhesive material, and the liquid-packaging material to a heating temperature not less than the first curing temperature and the second curing temperature; and cooling the substrate, the adhesive material, and the liquid-packaging material to a room temperature. When being cooled to the room temperature, the liquid-packaging material applies an upper-surface shrinkage stress to the upper surface of the substrate, the adhesive material applies a lower-surface shrinkage stress to the lower surface of the substrate, and the lower-surface shrinkage stress is substantially equal to the upper-surface shrinkage stress.Type: ApplicationFiled: January 5, 2024Publication date: May 8, 2025Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Yu-Hsiang Liu, Li-Chun Hung
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Publication number: 20250147205Abstract: An optical lens assembly includes, from an object side to an image side, at least four optical lens elements. At least one of the at least four optical lens elements includes an anti-reflective coating. The at least one optical lens element including the anti-reflective coating is made of a plastic material. The anti-reflective coating is arranged on an object-side surface or an image-side surface of the at least one optical lens element including the anti-reflective coating. The anti-reflective coating includes at least one coating layer. One of the at least one coating layer at the outer of the anti-reflective coating is made of ceramics. The anti-reflective coating includes a plurality of holes, and sizes of the plurality of holes adjacent to the outer of the anti-reflective coating are larger than sizes of the plurality of holes adjacent to the inner of the anti-reflective coating.Type: ApplicationFiled: January 9, 2025Publication date: May 8, 2025Inventors: Wen-Yu TSAI, Chien-Pang CHANG, Chi-Wei CHI, Wei-Fong HONG, Chun-Hung TENG, Kuo-Chiang CHU
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Publication number: 20250151255Abstract: A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.Type: ApplicationFiled: January 10, 2025Publication date: May 8, 2025Inventors: Yu-Ping HSIAO, Cheol-Soo PARK, Chun-Hung CHENG, Wei-Chieh CHUANG, Wei-Chao CHOU, Yen-Min JUAN
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Patent number: 12292585Abstract: The present application provides an aperture assembly. The aperture assembly is used in an optical lens system. The aperture assembly includes a plate including a hollow portion and a non-hollow portion. The hollow portion is configured to define an aperture of the optical lens system, wherein the contour of the hollow portion has a non-circular shape. The aperture assembly can prevent the size of the aperture from being reduced as the size of the plate is reduced in a case that a circular aperture is applied to the plate. The present application also realizes an aperture adjustment for a non-circular aperture.Type: GrantFiled: October 24, 2021Date of Patent: May 6, 2025Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.Inventors: Chun-Hung Huang, Tsung-tse Chen
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Publication number: 20250135202Abstract: The present disclosure provides a brain stimulation signal control method, includes: performing a stimulation feedback procedure, including: providing sensory stimulation signals to a user based on a stimulation parameter including a frequency parameter, obtaining a feedback signal in response to the sensory stimulation signals, and determining whether the feedback signal indicates a positive feedback state or a negative feedback state, setting the stimulation parameter as a default parameter when the feedback signal indicates the positive feedback state, and adjusting a value of the stimulation parameter and performing the stimulation feedback procedure again when the feedback signal indicates the negative feedback state.Type: ApplicationFiled: October 30, 2023Publication date: May 1, 2025Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventor: Chun-Hung LIEN
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Publication number: 20250138144Abstract: A time division duplexed (TDD) frequency modulation continuous wave (FMCW) radar system includes P transmitter circuit chains and M receiver circuit chains. The P transmitter circuit chains are used to transmit a plurality of FMCW signals. A pth transmitter circuit chain is coupled to a single pole Op throw (SPQPT) radio frequency (RF) switch, the SPOT RF switch is coupled to Op antennas, Qp and P are positive integers, and p is a positive integer not larger than P. The M receiver circuit chains are used to receive a plurality of reflected FMCW signals. An mth receiver circuit chain is coupled to a single pole Nm throw (SPNmT) radio frequency (RF) switch, the SPNmT RF switch is coupled to Nm antennas, Nm and M are positive integers, and m is a positive integer not larger than M.Type: ApplicationFiled: September 26, 2024Publication date: May 1, 2025Applicant: KaiKuTek INC.Inventors: Mike Chun-Hung Wang, Yi-Chu Chen, Tun-Yen Liao, Zi-Hao Fu, Hsiang-Chieh Jhan, Yi-Ting Tseng, Chun-Hsuan Kuo, Wei-Chi Li, Sheng-Tse Tai, Wei-Ming Sun, Pei-Ming Cai
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Patent number: 12289667Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data; and a host device arranged to operably generate and transmit a target control command to the first and second Bluetooth member devices when the first or second Bluetooth member device receives an alert signal, or when a specific ambient sound occurs in the surrounding environment of the first or second Bluetooth member device.Type: GrantFiled: May 3, 2024Date of Patent: April 29, 2025Assignee: REALTEK SEMICONDUCTOR CORP.Inventors: Yi-Cheng Chen, Bi Wei, Yu Hsuan Liu, Chia Chun Hung
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Patent number: 12289666Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; and a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data. When the first or second Bluetooth member device receives an alert signal, or when a specific ambient sound occurs in the surrounding environment of the first or second Bluetooth member device, the audio broadcasting device utilizes a target control command to instruct the first and second Bluetooth member devices to synchronously reduce their volume to be lower than a predetermined threshold.Type: GrantFiled: June 21, 2022Date of Patent: April 29, 2025Assignee: REALTEK SEMICONDUCTOR CORP.Inventors: Yi-Cheng Chen, Bi Wei, Yu Hsuan Liu, Chia Chun Hung
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Patent number: 12289668Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device arranged to operably broadcast BLE (Bluetooth Low Energy) audio packets; a first Bluetooth member device arranged to operably parse the BLE audio packets to acquire a predetermined audio data and to operably control a first audio playback circuit to playback the predetermined audio data; a second Bluetooth member device arranged to operably parse the BLE audio packets to acquire the predetermined audio data and to operably control a second audio playback circuit to playback the predetermined audio data; and a host device arranged to operably generate and transmit a target control command to the first and second Bluetooth member devices when the host device receives an alert signal, or when a specific ambient sound occurs in the surrounding environment of the host device.Type: GrantFiled: May 3, 2024Date of Patent: April 29, 2025Assignee: REALTEK SEMICONDUCTOR CORP.Inventors: Yi-Cheng Chen, Bi Wei, Yu Hsuan Liu, Chia Chun Hung
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Publication number: 20250128967Abstract: This disclosure is related to an ultraviolet fluid sterilization device. A box includes a chamber, a water inlet and a water outlet. A window is defined on the bottom side of the chamber. A light-transmitting plate is combined to the window to seal the bottom side of the chamber. A lamp holder module includes a lamp holder and an ultraviolet LED set. The lamp holder is detachably combined to the box. The ultraviolet LED set is disposed corresponding to the window. An external fluid flows into the chamber from the water inlet. The light emitted from the ultraviolet LED set enters the chamber from the window to irradiate the external fluid, and then the external fluid flows to outside.Type: ApplicationFiled: October 18, 2023Publication date: April 24, 2025Inventors: Chun-Hung LU, Chih-Hsin CHEN
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Publication number: 20250129109Abstract: An agent for an arrest of dental caries is a silver complex fluoride (SCF) of the structure: [Ag(1,3,5-triaza-7-phosphaadamantane)2]F, (Ag(PTA)2F). The agent effectively arrests dental caries and promotes remineralization of carious lesions. The agent results in minimal staining of teeth and tissue inflammation. The therapeutic agent can be applied selectively to a site of caries or other damaged tissue in the oral cavity.Type: ApplicationFiled: August 12, 2022Publication date: April 24, 2025Inventors: Chun Hung CHU, Ying Kei LUNG
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Patent number: 12283568Abstract: Alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices, where the scribe lines progressively increase or decrease in size from a center to an edge of one or more of the substrates to compensate for differences in the thermal expansion rates of the substrates. The devices on the substrates are brought into alignment as the substrates are heated during a bonding operation due to the progressively increased or decreased sizes of the scribe lines. The scribe lines may be arranged in a single direction in a substrate to compensate for thermal expansion along a single axis of the substrate or may be arranged in a plurality of directions to compensate for actinomorphic thermal expansion.Type: GrantFiled: July 5, 2023Date of Patent: April 22, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsi-Cheng Hsu, Jui-Chun Weng, Ching-Hsiang Hu, Ji-Hong Chiang, Kuo-Hao Lee, Chia-Yu Lin, Chia-Chun Hung, Yen-Chieh Tu, Chien-Tai Su, Hsin-Yu Chen
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Patent number: 12276461Abstract: A vapor chamber includes a shell body, a wick structure, a single-piece support structure and a working fluid. The shell body includes a first shell and a second shell. A chamber is formed between the first shell and the second shell. The wick structure is disposed in the chamber and attached on the shell body. The single-piece support structure is disposed in the chamber and between the first shell and the second shell, and includes support bodies and ribs. Each support body includes a hollow rod and an annular seat. Any adjacent two of the annular seats are connected by one of the ribs. The support body are arranged at an interval. The ribs are arranged along the support bodies to form hollow portions between each support body and each rib. The working fluid is disposed in the chamber.Type: GrantFiled: April 4, 2023Date of Patent: April 15, 2025Assignee: TAIWAN MICROLOOPS CORP.Inventor: Chun-Hung Lin
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Publication number: 20250120203Abstract: An image sensing module is provided. The image sensing module includes an image sensor chip, a support member, a transparent layer, and a shielding layer. The support member is arranged on upper surface of the image sensor chip and surrounds an image sensing region of the image sensor chip. The transparent layer is arranged on upper surface of the support member. Lower surface of the transparent layer faces the image sensor chip, and includes a transparent region and a shielding region surrounding the transparent region. The transparent region corresponds to the image sensing region. Projection of the shielding region in normal direction of the lower surface of the transparent layer does not overlap with the image sensing region. The shielding layer is formed on the shielding region, and includes a frame portion and a plurality of reinforcing portions. The reinforcing portions are individually located at corners of the frame portion.Type: ApplicationFiled: December 1, 2023Publication date: April 10, 2025Applicant: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Jui-Hung Hsu, Li-Chun Hung
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Patent number: 12271654Abstract: An audio dose monitoring circuit includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.Type: GrantFiled: March 10, 2022Date of Patent: April 8, 2025Assignee: REALTEK SEMICONDUCTOR CORP.Inventors: Yu Wei Liu, Chi Wu, Chia Chun Hung
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Patent number: 12269141Abstract: A method disclosed herein includes forming a polishing pad configured for a chemical-mechanical polishing (CMP) process and polishing a workpiece using the polishing pad and a CMP slurry. Forming the polishing pad includes forming an interpenetrating polymer network having a first phase and a second phase embedded in the first phase, removing the second phase from the interpenetrating polymer network, thereby forming a porous top pad that includes a network of pores embedded in the first phase, and adhering the porous top pad to a sub pad, thereby forming the polishing pad. The second phase is different from the first phase in composition, and the interpenetrating polymer network has a substantially periodic pattern. Surface roughness of the porous top pad is consistent during the polishing of the workpiece.Type: GrantFiled: July 10, 2023Date of Patent: April 8, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: An-Hsuan Lee, Ming-Shiuan She, Chen-Hao Wu, Chun-Hung Liao, Shen-Nan Lee, Teng-Chun Tsai
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Patent number: 12271006Abstract: Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction, and wherein the conductive layer is formed over at least one of the following: the first surface of the first dielectric layer and a portion of sidewalls of each of the plurality of via holes, and wherein the conductive layer is configured so as to allow the optical collimator to filter light in a range of wavelengths.Type: GrantFiled: August 8, 2023Date of Patent: April 8, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hsin-Yu Chen, Yen-Chiang Liu, Jiun-Jie Chiou, Jia-Syuan Li, You-Cheng Jhang, Shin-Hua Chen, Lavanya Sanagavarapu, Han-Zong Pan, Chun-Peng Li, Chia-Chun Hung, Ching-Hsiang Hu, Wei-Ding Wu, Jui-Chun Weng, Ji-Hong Chiang, Hsi-Cheng Hsu
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Publication number: 20250109870Abstract: The present disclosure is at least directed to utilizing air curtain devices to form air curtains to separate and isolate areas in which respective workpieces are stored from a transfer compartment within a workpiece processing apparatus. The transfer compartment of the workpiece processing apparatus includes a robot configured to transfer or transport ones of the workpieces to and from these respective storage areas through the transfer compartment and to and from a tool compartment. A tool is present in the tool compartment for processing and refining the respective workpieces. Clean dry air (CDA) may be circulated through the respective storage areas. The air curtains formed by the air curtain devices and the circulation of CDA through the respective storage areas reduces the likelihood of the generation of defects, damages, and degradation of the workpieces when present within the workpiece processing apparatus.Type: ApplicationFiled: December 12, 2024Publication date: April 3, 2025Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chia-Wei WU, Hao YANG, Hsiao-Chieh CHOU, Chun-Hung CHAO, Jao Sheng HUANG, Neng-Jye YANG, Kuo-Bin HUANG
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Patent number: D1070648Type: GrantFiled: June 20, 2023Date of Patent: April 15, 2025Assignee: ATT Southern Inc.Inventors: Chun Hung, Brian Leahy, Patrick Guillory, Phillip Lemke, John Carpenter