Abstract: The present disclosure provides a light emitting diode structure. The light emitting diode structure includes a substrate, a first light emitting structure on the substrate, a second light emitting structure on the substrate, and a third light emitting structure on the substrate. The first light emitting structure includes a first light emitting diode and a first focusing optic on the first light emitting diode. The second light emitting structure includes a second light emitting diode and a second focusing optic on the second light emitting diode. The third light emitting structure includes a third light emitting diode and a third focusing optic on the third light emitting diode. The first light emitting structure, the second light emitting structure and the third light emitting structure are arranged along a first direction and are dislocated in a second direction perpendicular to the first direction.

Abstract: Disclosed is a compact electronic device configured to efficiently manage air circulation and prevent overheating. The device features an innovative cooling system comprising a fan module within a uniquely structured housing that includes a base portion, an inner casing, and a removable top cover. The inner casing features strategically placed windows that direct drawn airflow over specific power supply components, enhancing cooling performance. The enhanced cooling is also provided by an air gap formed between the base portion and the top cover, as well as sidewall intake paths of varying widths adjacent the windows. These features work together to draw in and distribute ambient air effectively across heat-generating components, leveraging negative pressure created by a fan module. The result is a highly efficient cooling mechanism for compact devices such as wireless access point configured to plug into electrical outlets.

Abstract: A layout optimization method and a semiconductor wafer are provided. The method includes: generating adjusted patterns corresponding to a first layout pattern; generating a layout optimization test group according to the adjusted patterns, wherein the layout optimization test group includes first and second clusters of test pattern arrays, the first cluster include first test pattern arrays in accordance with one of the adjusted patterns and different from one another in terms of capacity, and the second cluster include second test pattern arrays in accordance with another one of the adjusted patterns and different from one another in terms of capacity; forming the layout optimization test group on a wafer; performing an electrical inspection on the first and second pattern arrays, and determining a best manufacturing solution from the adjusted patterns according to the electrical inspection.

Abstract: A compressed sensing imaging method and a compressed sensing imaging system are provided. In the method, multiple grayscale masks having multiple elements with grayscale values represented by floating-point values or continuous values are generated as sensing matrices based on a compressed sensing theory. A spatial light modulator is controlled to modulate an electromagnetic wave projected on an object under test according to the grayscale value of each element in each grayscale mask, and a physical property of the electromagnetic wave passing through the object under test is detected to obtain multiple measured values. An image reconstruction algorithm is executed to reconstruct an image of the object under test by using the grayscale masks and the measured values obtained from the electromagnetic wave modulated by each grayscale mask.

Abstract: A plasticizer, which is biodegradable, has a molecule including a central structure, at least two connecting structures and at least one side-chain structure. The central structure includes at least one of a benzene derivative and at least one amino acid. The connecting structures are respectively connected to the central structure, wherein the connecting structures include a first connecting structure and a second connecting structure. The first connecting structure is an amine group, and the second connecting structure is a carboxyl group. The side-chain structure is a chain of multiple carbon atoms, and the side-chain structure is connected to at least one of the first connecting structure and the second connecting structure. An amide bond is formed as the side-chain structure connected to the amine group, and an ester bond is formed as the side-chain structure connected to the carboxyl group.

Abstract: The present disclosure provides a method for manufacturing a semiconductor. The method includes: forming a metal oxide layer over a gate structure over a substrate; forming a dielectric layer over the metal oxide layer; forming a metal layer over the metal oxide layer; and performing a chemical mechanical polish (CMP) operation to remove a portion of the dielectric layer and a portion of the metal layer, the CMP operation stopping at the metal oxide layer, wherein a slurry used in the CMP operation includes a ceria compound. The present disclosure also provides a method for planarizing a metal-dielectric surface.

Abstract: A separate capillary vapor chamber structure for dual heat sources is provided for transferring heat between low and high heat sources, and includes lower and upper plates covering each other, an evaporation area having the low and high heat sources, a first condensation area extended from a side of the evaporation area and adjacent to the low heat source, a second condensation area extended from another side of the evaporation area and adjacent to the high heat source. The lower plate has a lower capillary layer extended from the first condensation area to an end of the second condensation area through the evaporation area, and the upper plate has an upper capillary layer extended from an end of the first condensation area into the evaporation area to form a cut edge, such that the upper capillary layer is shorter than the lower capillary layer.

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically coupling the substrate and the sensor chip, a frame fixed on the substrate, and a light-permeable layer that is disposed on the frame. The light-permeable layer has a transparent segment and a ring-shaped segment that surrounds the transparent segment. The ring-shaped segment is disposed on a top end surface of the frame, so that the light-permeable layer, the frame, and the substrate jointly define an enclosed space that accommodates the sensor chip and the metal wires therein. The ring-shaped segment has an inner ring-shaped roughened region that is arranged on an inner surface thereof and that is fixed onto the top end surface of the frame. Moreover, an inner edge of the inner ring-shaped roughened region is arranged in the enclosed space.

Abstract: A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed on the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupled to the sensor chip and the circuit board, and a cover that overcovers the sensor chip and the wires. The cover includes a light-permeable sheet and an opaque frame. The light-permeable sheet has a ring-shaped notch recessed in an edge of an inner surface thereof. The opaque frame is formed on the ring-shaped notch and is disposed on the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other, and the sensor chip and the wires are arranged in a space that is defined by the light-permeable sheet and the opaque frame.

Abstract: An air flow redirection system for redirecting exhaust air flow away from an external surface upon which the device is positioned, the device may include a housing including a first side, a second side opposite the first side, at least one sidewall extending between the first side and second side, a vent, the vent defining an opening extending through the at least one sidewall placing an interior chamber of the device in fluid communication with an exterior region, at least one rib defining slots in the vent, and an arc. Air flow produced by a fan located in the interior chamber is directed towards the vent in a first direction, and the arc acts in combination with the at least one rib and raises a direction of the air flow upward in a second direction towards a plane of the first side as the air flow exits the vent.

Abstract: A bonding device includes a first carrying module for a tape assembly to be disposed thereon and reeling a carrier tape and a cover tape, a driving module disposed to drive an up-down movement and a rotation of the first carrying module, a second carrying module movably disposed on the first carrying module, and a bonding module disposed on the second carrying module. The bonding module includes a bending member on and through which a carrier tape is reeled and bent to be divided into an input section and an output section. The bending member is moved together with a roller, during rolling of the roller, to indirectly scrape an adhering component from the carrier tape so as to facilitate attachment of the adhering component to the base component.

Abstract: A resin composition includes 100 parts by weight of a prepolymer and 150 to 200 parts by weight of a ceramic filler, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes a maleimide resin and a diamine compound in a molar ratio of between 1:2 and 2:1; the ceramic filler has a thermal conductivity of greater than 30 W/(m·K); and the diamine compound includes a compound of Formula (1), a compound of Formula (2), a compound of Formula (3) or a combination thereof. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more properties can be improved.

Abstract: A bonding method for using a bonding apparatus includes: transporting and reeling a carrier tape which is packaged with an adhering component, on a pressing assembly, and bending the carrier tape through a bending member to be divided into an input section and an output section; driving a roller to indirectly press and abut a front end of the adhering component to bring the adhering component into contact with a bonding start point a base component; and rolling the roller over the carrier tape to attach the adhering component to the bonding area while moving the bending member to indirectly scrape the adhering component from the carrier tape so as to firmly attach the adhering component to the base component without generation of air bubbles.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for training a memory-based prediction system configured to receive an input observation characterizing a state of an environment interacted with by an agent and to process the input observation and data read from a memory to update data stored in the memory and to generate a latent representation of the state of the environment. The method comprises: for each of a plurality of time steps: processing an observation for the time step and data read from the memory to: (i) update the data stored in the memory, and (ii) generate a latent representation of the current state of the environment as of the time step; and generating a predicted return that will be received by the agent as a result of interactions with the environment after the observation for the time step is received.

Abstract: A method includes: receiving a composite substrate including a first region and a second region, the composite substrate comprising a semiconductor substrate and an insulator layer over the semiconductor substrate; bonding a silicon layer to the composite substrate; depositing a capping layer over the silicon layer; forming a trench through the capping layer, the silicon layer and the insulator layer, the trench exposing a surface of the semiconductor substrate in the first region; growing an initial epitaxial layer in the trench; removing the capping layer to form an epitaxial layer from the silicon layer and the initial epitaxial layer; forming a transistor layer over the epitaxial layer, the transistor layer including a first transistor and a second transistor in the first region and the second region, respectively; and forming an interconnect layer over the transistor layer and electrically coupling the first transistor to the second transistor.

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a sensing chip, a light-permeable element, a photoresist layer, and a die-bonding film layer. The sensing chip is disposed on the substrate, and an upper surface of the sensing chip has a sensing region. The light-permeable element is disposed above the sensing chip. The photoresist layer is disposed on a first surface of the light-permeable element. The die-bonding film layer is adhered between the sensing chip and the light-permeable element and surrounds the sensing region.

Abstract: A hard disk tray conducive to automated productions includes a loading frame, a base frame, an abutment member disposed within the base frame, a handle and a buckle. The loading frame includes a first frame body for loading a hard disk device therein. The base frame includes a base body connected to the first frame body, and an abutting elastic arm integrated to the base body. The handle includes a bracket pivoted to the base body, a first elastic arm integrated to the bracket to abut against the abutting elastic arm, and a first fastening portion disposed on the bracket. The buckle includes a buckle body pivoted to the base body, a second elastic arm integrated to the buckle body to abut against the abutment member, and a second fastening portion disposed on the buckle body for fastening to the first fastening portion.

Abstract: The invention provides a system and a method thereof for establishing an extubation prediction using a machine learning model capable of obtaining an extubation prediction model and key features used by the extubation prediction model through training and/or verification of a machine learning model, and analyzing key feature data of a patient in real time through the extubation prediction model in order to obtain a possibility of extubation of the patient and its related explanation. Accordingly, the system and the method thereof for establishing the extubation prediction using the machine learning model disclosed in the invention are used as a tool for clinical caregivers to evaluate extubation in order to reduce a possibility of reintubation due to inability to breathe spontaneously after extubation.

Abstract: An auto focus method for an image capturing device with a PD image sensor, comprising: (a) receiving pixel values of a sensing image sensed by the PD image sensor; (b) dividing the sensing image into a plurality of image blocks; (c) computing first cost values of each of the image blocks; (d) determining disparities of each of the image blocks according to the first cost values with in a specific range of each of the image blocks; (e) finding at least one object in the sensing image according to the disparities; and (f) setting a focus location of the image capturing device according at least one object location of the object.

Abstract: A method for shallow trench isolation structures in a semiconductor device and a semiconductor device including the shallow trench isolation structures are disclosed. In an embodiment, the method may include forming a trench in a substrate; depositing a first dielectric liner in the trench; depositing a first shallow trench isolation (STI) material over the first dielectric liner, the first STI material being deposited as a conformal layer; etching the first STI material; depositing a second STI material over the first STI material, the second STI material being deposited as a flowable material; and planarizing the second STI material such that top surfaces of the second STI material are co-planar with top surfaces of the substrate.