Abstract: A semiconductor package assembly is provided. The semiconductor package assembly includes first semiconductor die, a second semiconductor die and a memory package. The first semiconductor die and the second semiconductor die are stacked on each other. The first semiconductor die includes a first interface and a third interface. The first interface overlaps and is electrically connected to the second interface arranged on the second semiconductor die. The third interface is arranged on a first edge of the first semiconductor die. The memory package is disposed beside the first semiconductor die, wherein the memory package is electrically connected to the first semiconductor die by the third interface.

Abstract: The subject invention pertains to a novel glass-ionomer cement (NGIC) that provides an alternative restorative material for dental amalgams being phased out; has improved mechanical properties compared to conventional glass-ionomer cement (GIC) products; has improved adhesive properties compared to conventional GIC products; provides sufficient biocompatibility; can release ions to promote remineralization of the teeth, which inhibits tooth decay; can inhibit growth of bacteria, which inhibits tooth decay; provides increased retention time and decreased frequency of replacement in the oral cavity. Formulations of the subject invention can include powders and solutions containing silicate glass, poly(vinylphosphonic acid) (PVPA), nanosilver bioactive glass, and polyacrylic acid.

Abstract: A conductive laminated structure includes a conductive layer and a thickening layer. The conductive layer extends in a first direction. The thickening layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breakage when a radius of curvature R is equal to 3 mm, a folding direction is perpendicular or parallel to the first direction, and a folding angle is 180°. A foldable electronic device is also provided herein.

Abstract: A conductive structure having a self-assembled protective layer and a self-assembled coating composition are provided. The self-assembled coating composition includes a resin, a solvent, and a self-assembled additive. The self-assembled additive includes alkylamine, fluoroalkylamine, fluoroaniline, or a derivative thereof. The self-assembled additive has a concentration in a range of from about 0.01 mg/L to about 100 mg/L in the self-assembled coating composition. The conductive structure includes a substrate, a conductive layer, and the self-assembled protective layer. The conductive layer is disposed over the substrate. The self-assembled protective layer covers the conductive layer and has a resin, a solvent, and the above-mentioned self-assembled additive.

Abstract: A silver nanowire (SNW) protection layer structure includes a substrate; a SNW layer, disposed on the substrate and covering only a partial region of a surface of the substrate, the SNW layer including a plurality of SNW channels; and a SNW protection layer, disposed on the SNW layer and covering a region corresponding to the plurality of SNW channels, the SNW protection layer including a light-resistant antioxidant. A manufacturing method for the SNW protection layer structure above is further provided. The SNW protection layer structure and the manufacturing method thereof are applicable in a touch sensor.

Abstract: A touch element includes a polymer phase retardation layer and a touch sensing structure. The polymer phase retardation layer receives the linearly polarized incident light and then produces a phase difference. The touch sensing structure is disposed on the polymer phase retardation layer.

Abstract: A method for preparing stacking structure includes providing a substrate; disposing a metallic layer and a silver nanowire layer on the substrate; applying flexographic printing technology to print an anti-etching layer on a surface of the metallic layer or the silver nanowire layer so that the anti-etching layer partially covers the metallic layer or the silver nanowire layer; applying an etching technology to remove a part of the metallic layer or the silver nanowire layer that is not covered by the anti-etching layer and the metallic layer or the silver nanowire layer disposed therebelow with an etching liquid so that the metallic layer comprises: metallic wires; a metallic grid; and a metallic plate; and removing the anti-etching layer. A stacking structure comprises: the substrate; the metallic layer; and the silver nanowire layer. The method for preparing stacking structure and the stacking structure can be applied to a touch sensor.

Abstract: A method of producing a stacking structure includes providing a substrate; printing, by flexography, a catalyst layer onto the substrate, wherein the catalyst layer includes a grid pattern and a conducting wire pattern connected to the grid pattern; plating, by chemical plating, a metal layer onto the catalyst layer, wherein the metal layer includes a metal grid corresponding in position to the grid pattern of the catalyst layer and a metal conducting wire corresponding in position to the conducting wire pattern of the catalyst layer; and printing, by flexography, a silver nanowire layer onto the metal layer, wherein the silver nanowire layer at least partially overlaps the metal grid. A stacking structure includes a substrate; a catalyst layer; a metal layer; and a silver nanowire layer. The method of producing a stacking structure and the stacking structure are applicable to a touch sensor.

Abstract: A silver nanowire (SNW) protection layer structure includes a substrate; a SNW layer, disposed on the substrate and covering only a partial region of a surface of the substrate, the SNW layer including a plurality of SNW channels; and a SNW protection layer, disposed on the SNW layer and covering a region corresponding to the plurality of SNW channels, the SNW protection layer including a light-resistant antioxidant. A manufacturing method for the SNW protection layer structure above is further provided. The SNW protection layer structure and the manufacturing method thereof are applicable in a touch sensor.

Abstract: An ink component for forming an insulation layer includes an acrylic resin, an acrylate monomer, a fluoro-containing thiol compound, a silane coupling agent, a photoinitiator, and a solvent, where the ink component may be used in an ink-jet processing. The insulation layer, with a thickness of 2 ?m formed of the ink component, has a break down voltage higher than 800 V and a dielectric constant between 2.0 to 4.0 under a frequency of 100 kHz.

Abstract: A stacking structure preparation method includes the steps of providing a substrate; printing a silver nanowire layer on the substrate using a flexographic printing process; and printing a meal layer on the substrate and the silver nanowire layer also using the flexographic printing process. The metal layer includes a metal mesh that covers at least a part of the substrate and the silver nanowire layer, and a plurality of metal traces that is connected to the metal mesh. A stacking structure formed through the above preparation method is also disclosed. The stacking structure includes, from bottom to top, a substrate, a flexo printed silver nanowire layer, and a flexo printed metal layer partially covering the substrate and the silver nanowire layer. The above preparation method and stacking structure can be applied to the manufacturing of a touch sensor.

Abstract: A sprayable conductive ink includes 0.05 to 1 part by weight of a metal nanowire, 0.1 to 1 part by weight of a resin, 97.9 to 99.5 parts by weight of a solvent, and 0.02 to 0.1 parts by weight of an additive, in which the conductive ink is used for spraying on a substrate.

Abstract: A method for preparing stacking structure includes providing a substrate; disposing a metallic layer and a silver nanowire layer on the substrate; applying flexographic printing technology to print an anti-etching layer on a surface of the metallic layer or the silver nanowire layer so that the anti-etching layer partially covers the metallic layer or the silver nanowire layer; applying an etching technology to remove a part of the metallic layer or the silver nanowire layer that is not covered by the anti-etching layer and the metallic layer or the silver nanowire layer disposed therebelow with an etching liquid so that the metallic layer comprises: metallic wires; a metallic grid; and a metallic plate; and removing the anti-etching layer. A stacking structure comprises: the substrate; the metallic layer; and the silver nanowire layer. The method for preparing stacking structure and the stacking structure can be applied to a touch sensor.

Abstract: A method of producing a stacking structure includes providing a substrate; printing, by flexography, a catalyst layer onto the substrate, wherein the catalyst layer includes a grid pattern and a conducting wire pattern connected to the grid pattern; plating, by chemical plating, a metal layer onto the catalyst layer, wherein the metal layer includes a metal grid corresponding in position to the grid pattern of the catalyst layer and a metal conducting wire corresponding in position to the conducting wire pattern of the catalyst layer; and printing, by flexography, a silver nanowire layer onto the metal layer, wherein the silver nanowire layer at least partially overlaps the metal grid. A stacking structure includes a substrate; a catalyst layer; a metal layer; and a silver nanowire layer. The method of producing a stacking structure and the stacking structure are applicable to a touch sensor.

Abstract: A touch panel is provided, including a substrate, a first wire structure, and a second wire structure. The substrate includes a display area and a peripheral area surrounding the display area. The first wire structure includes a first catalyst layer, a first metal layer, and a first transparent conductive layer. The first catalyst layer is disposed above the peripheral area, the first metal layer is disposed above the first catalyst, and the first transparent conductive layer is disposed above the first metal layer. The first wire structure is divided into at least one first wire area and at least one first ground line area adjacent to the first wire area. The second wire structure is disposed under the peripheral area and includes at least one second ground line area, wherein a projection of the first wire area in a vertical direction is opposite to the second ground line area.

Abstract: A conductive laminated structure includes a conductive layer and a thickening layer. The conductive layer extends in a first direction. The thickening layer is disposed over or under the conductive layer. The conductive laminated structure can withstand more than 40,000 folding times without breakage when a radius of curvature R is equal to 3 mm, a folding direction is perpendicular or parallel to the first direction, and a folding angle is 180°. A foldable electronic device is also provided herein.

Abstract: A touch panel and a manufacturing method thereof are provided. The touch panel includes a substrate, peripheral leads, a touch sensing electrode, and first intermediate layers. The peripheral leads are disposed in a peripheral area of the substrate. The first intermediate layers are disposed between the peripheral leads and the substrate. The touch sensing electrode includes a plurality of modified metal nanowires. The modified metal nanowires have first surfaces in direct contact with each other at an intersection. The modified metal nanowires have second surfaces with covering structures, and the second surfaces are at a non-intersection.

Abstract: A touch panel is provided, including a substrate, a first wire structure, and a second wire structure. The substrate includes a display area and a peripheral area surrounding the display area. The first wire structure includes a first catalyst layer, a first metal layer, and a first transparent conductive layer. The first catalyst layer is disposed above the peripheral area, the first metal layer is disposed above the first catalyst, and the first transparent conductive layer is disposed above the first metal layer. The first wire structure is divided into at least one first wire area and at least one first ground line area adjacent to the first wire area. The second wire structure is disposed under the peripheral area and includes at least one second ground line area, wherein a projection of the first wire area in a vertical direction is opposite to the second ground line area.

Abstract: A corrosion-resistant conductive structure includes: a substrate, a conductive layer, and a protective layer. The conductive layer is disposed on the substrate and includes a metal, a metal alloy, or a metal oxide. The protective layer overlies the conductive layer and includes a resin and a first component; the first component includes a heterocyclic dizane compound or a derivative thereof. A corrosion-resistant coating composition includes: a resin, a first component, and a solvent. The first component includes a heterocyclic dizane compound or a derivative thereof, wherein the concentration of the first component ranges from 0.01 mg/L to 180 mg/L.

Abstract: A method of manufacturing a touch panel including providing a substrate having a display area and a peripheral area is provided. A metal layer and a metal nanowire layer are disposed, wherein a first portion of the metal nanowire layer is disposed in the display area, and a second portion of the metal nanowire layer and the metal layer are disposed in the peripheral area. A patterned layer with a pattern is disposed. A patterning step is performed according to the patterned layer, wherein the patterning step includes forming the metal layer into multiple peripheral wires and simultaneously forming the second portion of the metal nanowire layer into multiple etching layers by using an etching solution configured to etch the metal layer and the metal nanowire layer. A touch panel is further provided.