Patents by Inventor Chun-Hung Li

Chun-Hung Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100032943
    Abstract: A quick installed joint assembly includes a fitting body, a sleeve, and an inlet pipe. One end of the chamber of the body communicates with a water supply pipeline, and the other end communicates with an accommodation part and passing through the fitting body. The sleeve is disposed within the accommodation part and has stopper portions. Each stopper portion has a wedge-like portion and a hook portion is extending outwardly from the wedge-like portion. The body has plural openings corresponding to each stopper portion, so that one end of the inlet pipe can pass through the sleeve and be inserted within the chamber. The inlet pipe corresponding to the bottom edge of the stopper portion has a large diameter portion for leaning against on the stopper portion, so the hook portion can be hooked on the openings and the inside wall of the accommodation part can support the wedge-like portion.
    Type: Application
    Filed: August 8, 2008
    Publication date: February 11, 2010
    Applicant: Globe Union Industrial Corp
    Inventors: Chun-Hung LI, Wei-Mien Hsu, Yongjun Wu
  • Publication number: 20090297294
    Abstract: A quick fastening nut includes a first ring member and a second ring member. The first ring member has a bore at a center thereof and fastening portions around the bore. Each of the fastening portions has a threaded section at an inner side thereof. The second ring member has a bore at a center thereof and a plurality of stop portions, each of which has a stop face on a distal end thereof. The fastening portions of the first ring member is inserted into the bore of the second ring member that the second ring member may be moved along the fastening portions of the first ring member, and the second ring member will bend the fastening portions inwards when the second ring member is moved toward distal ends of the fastening portions.
    Type: Application
    Filed: June 2, 2008
    Publication date: December 3, 2009
    Applicant: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Chun-Hung LI, Wei-Mien HSU, Yong-Jun WU
  • Publication number: 20090276953
    Abstract: A diverter assembly includes a main body, a valve device and a movable body. The main body is hollow and has a water inlet tube and two water outlet tubes. One of the two water outlet tubes is communicated through a hose to a shower nozzle. The valve device is disposed on the main body and has a valve capable of linearly moving back and forth for steplessly communicating the water inlet tube with either or both of the water outlet tubes. The movable body is pivotally disposed at one end of the main body, and has a hole for the shower nozzle to be inserted in. Thereby, the diverter assembly can steplessly adjust the valve position for controlling the water to flow out from either or both of the water outlet tubes.
    Type: Application
    Filed: May 9, 2008
    Publication date: November 12, 2009
    Applicant: GLOBE UNION INDUSTRIAL CORP.
    Inventors: Wei-Mien Hsu, Chun-Hung Li
  • Publication number: 20020056903
    Abstract: A semiconductor chip package generally comprises a lead frame, a semiconductor die and a plastic package body. The lead frame includes a plurality of leads and a window pad. The window pad is connected to the lead frame by connecting bars. The inner ends of the plurality of leads defines a central area. The window pad is disposed in the central area and has an opening defined therein. The semiconductor die is disposed in the opening of the window pad and has a plurality of bonding pads formed on the active surface thereof. The inner ends of the leads are interconnected to the bonding pads on the semiconductor die through a plurality of bonding wires. The lead frame, the semiconductor die and the bonding wires are encapsulated in the plastic package body wherein the lower surface of the lead frame and the backside surface of the semiconductor die are exposed through the plastic package body.
    Type: Application
    Filed: December 31, 2001
    Publication date: May 16, 2002
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sai Man Li, Chun Hung Li, Shin Hua Chao, Su Tao