Abstract: Disclosed are a water-cooling heat dissipating apparatus and its vapor chamber. The vapor chamber includes a first casing, a second casing, a capillary tissue and a working fluid, and the second casing is engaged closely with the first casing and a cavity is formed and enclosed by the first casing and the second casing. The second casing includes a substrate and plural heat dissipating fins integrally formed with the substrate, and the capillary tissue is disposed in the first casing and the second casing, and the working fluid is filled into the cavity. The vapor chamber has a curved section and a first section and a second section extended outwardly and respectively from both ends of the curved section. Therefore, the water-cooling heat dissipating apparatus and its vapor chamber have the features of a quick heat transfer by low thermal resistance and an easy and simple manufacturing process.

Abstract: In a dual material vapor chamber and an upper shell thereof, the dual material vapor chamber includes an upper shell, a copper lower shell, and a working fluid. The upper shell includes an aluminum substrate and plural aluminum fins. The aluminum substrate has an outer surface and an inner wall. The aluminum fins individually extend from the outer surface and are formed integrally. A copper deposition layer is coated on the inner wall. The copper lower shell is sealed to the upper shell correspondingly. A chamber is formed between the upper shell and the copper lower shell. The working fluid is filled in the chamber. Therefore, the weight and material cost of the whole vapor chamber can be reduced, and the packing combination between the upper shell and the copper lower shell can be simplified.

Abstract: A manufacturing method for a transparent fiber is provided. The method includes forming a spinning solution containing a polyimide polymer in an organic solvent. The polydispersity index (PDI) of the polyimide polymer is 1.3˜2.6. The spinning solution is used to perform a dry-jet wet spinning step to form a plurality of fibers. Furthermore, the plurality of fibers are subjected to a thermal drawing step to form a plurality of transparent fibers, wherein the temperature of the thermal drawing step is controlled from 215° C. to 350° C. The manufacturing method for a transparent fiber provided in the present invention makes use of a polyimide polymer material and utilizes a dry-jet wet spinning step and a thermal drawing step, which allows the formation of a transparent and high strength polyimide fiber.

Abstract: A method includes placing an underfill-shaping cover on a package component of a package, with a device die of the package extending into an opening of the underfill-shaping cover. An underfill is dispensed into the opening of the underfill-shaping cover. The underfill fills a gap between the device die and the package component through capillary. The method further includes, with the underfill-shaping cover on the package component, curing the underfill. After the curing the underfill, the underfill-shaping cover is removed from the package.

Abstract: A flexible high-power control device is disclosed for controlling at least one high-power electrical generating/consuming device which has a plurality of electrical terminals and a housing with a non-planar surface and is thermal-conductively connected to an active cooling unit. The flexible high-power control device comprises a flexible thermal-conductive interfacial insulation substrate, at least one circuit layer, and at least one electronic element. The interfacial insulation substrate is attached to the non-planar surface of the electrical generating/consuming device. The circuit layer, which is disposed on the interfacial insulation substrate, includes a plurality of electrical terminals which are electrically connected to the electrical terminals of the electrical generating/consuming device. The electronic element is electrically mounted on the circuit layer to form a control circuit for controlling the electrical generating/consuming device.

Abstract: A heat conduction module structure and a method of manufacturing the same are provided. The structure includes a vapor chamber, a heat pipe, a porous sintered structure, and a working fluid. The vapor chamber includes a lower housing and an upper housing. A cavity is formed between the upper housing and the lower housing. The upper housing includes a through hole and a circular wall. The heat pipe includes a first section and a second section. The first section has a greater inner diameter than that of the second section. The first section includes an opening. The heat pipe is arranged to be perpendicular corresponding to the circular wall and communicates with the through hole by means of the opening. The porous sintered structure is formed from the through hole to the first section. The working fluid is filled in the cavity.

Abstract: A method includes followings operations. A substrate including a first surface and a second surface is provided. The substrate and a transparent film are heated to attach the transparent film on the first surface. A first coefficient of a thermal expansion (CTE) mismatch is between the substrate and the transparent film. The substrate and the transparent film are cooled. A polymeric material is disposed on the second surface. A second CTE mismatch is between the substrate and the polymeric material. The second CTE mismatch is counteracted by the first CTE mismatch.

Abstract: A heat dissipating structure and a water-cooling heat dissipating apparatus including the structure are disclosed. The heat dissipating structure includes a vapor chamber, plural heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity. Each heat pipe is vertically installed to the vapor chamber and communicated with the cavity. The heat dissipating member includes a substrate and plural fins integrally extended from the substrate and seals the hollow slot by a substrate, so as to improve the thermal conduction and dissipation of the heat dissipating structure and the water-cooling heat dissipating apparatus.

Abstract: An assembly structure of a heat pipe and a vapor chamber and an assembly method thereof are provided. The structure includes a vapor chamber, a heat pipe, a porous sintered structure, and a working fluid. The vapor chamber includes a lower housing and an upper housing, a cavity is formed between the upper housing and the lower housing, and the upper housing includes a through hole and a circular wall. The heat pipe includes an opening. The open end of the heat pipe is disposed perpendicularly corresponding to the circular wall and communicates with the through hole. A block portion is formed on the heat pipe close to the opening. The porous sintered structure is formed between the through hole and the block portion. The working fluid is filled into the cavity.

Abstract: A self-timed reset pulse generator includes a flip-flop, a tracking block, and a tracking circuit. The flip-flop receives an input signal and a feedback signal and outputting a reset signal. The tracking block has replicating cells coupled in series and replicates a structure in an external device. The tracking block has a first terminal and a second terminal. The first terminal and the second terminal are taking from the tracking block at a same location or two different locations. The tracking circuit unit receives the reset signal and receives the first terminal and the second terminal for respectively discharging the tracking block at the first terminal and sensing a voltage level at the second terminal as triggered by the reset signal. A track-out signal serving as the feed back signal is output to the flip-flop when the voltage level is less than or equal to a threshold.

Abstract: A preparation method of separation membrane is provided. First, a polyimide composition including a dissolvable polyimide, a crosslinking agent, and a solvent is provided. The dissolvable polyimide is represented by formula 1: wherein B is a tetravalent organic group derived from a tetracarboxylic dianhydride containing aromatic group, A is a divalent organic group derived from a diamine containing aromatic group, A? is a divalent organic group derived from a diamine containing aromatic group and carboxylic acid group, and 0.1?X?0.9. The crosslinking agent is an aziridine crosslinking agent, an isocyanate crosslinking agent, an epoxy crosslinking agent, a diamine crosslinking agent, or a triamine crosslinking agent. A crosslinking process is performed on the polyimide composition. The polyimide composition which has been subjected to the crosslinking process is coated on a substrate to form a polyimide membrane. A dry phase inversion process is performed on the polyimide membrane.

Abstract: A preparation method of separation membrane is provided. First, a polyimide composition including a dissolvable polyimide, a crosslinking agent and a solvent is provided. The dissolvable polyimide is represented by formula 1: wherein B is a tetravalent organic group derived from a tetracarboxylic dianhydride containing aromatic group, A is a divalent organic group derived from a diamine containing aromatic group, A? is a divalent organic group derived from a diamine containing aromatic group and carboxylic acid group, and 0.1?X?0.9. The crosslinking agent is an aziridine crosslinking agent, an isocyanate crosslinking agent, an epoxy crosslinking agent, a diamine crosslinking agent, or a triamine crosslinking agent. A crosslinking process is performed on the polyimide composition. The polyimide composition which has been subjected to the crosslinking process is coated on a substrate to form a polyimide membrane. A wet phase inversion process is performed on the polyimide membrane.

Abstract: A method of heating/cooling one or more substrates includes placing the one or more substrates on a rotatable hot-cold plate, wherein each substrate of the one or more substrates is placed on a corresponding sub-plate of a plurality of sub-plates of the rotatable hot-cold plate. The method further includes rotating the one or more substrates, wherein rotating the one or more substrates comprises rotating each substrate of the one or more substrates independently. The method further includes heating or cooling the one or more substrates using a heating-cooling element, wherein rotating the one or more substrates comprises rotating the one or more substrates relative to the heating-cooling element.

Abstract: A liquid-cooling heat dissipating apparatus includes a heat dissipating structure and a cover. The heat dissipating structure includes a vapor chamber, a heat exchanger and a heat dissipating component. The vapor chamber has a hollow slot. The heat exchanger is installed to the vapor chamber and has plural heat exchange plates and a through hole. The through holes of the upper and lower heat exchange plates communicate with each other to form a fluid channel. The heat dissipating component includes a substrate and plural fins, and the heat dissipating component seals the hollow slot by the substrate. The cover covers the vapor chamber and forms a liquid cavity, and the heat exchanger and each fin are formed in the liquid cavity, and the cover has a water inlet and a water outlet communicating with the liquid cavity.

Abstract: In a dual material vapor chamber and an upper shell thereof, the dual material vapor chamber includes an upper shell, a copper lower shell, and a working fluid. The upper shell includes an aluminum substrate and plural aluminum fins. The aluminum substrate has an outer surface and an inner wall. The aluminum fins individually extend from the outer surface and are formed integrally. A copper deposition layer is coated on the inner wall. The copper lower shell is sealed to the upper shell correspondingly. A chamber is formed between the upper shell and the copper lower shell. The working fluid is filled in the chamber. Therefore, the weight and material cost of the whole vapor chamber can be reduced, and the packing combination between the upper shell and the copper lower shell can be simplified.

Abstract: Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, an interconnect structure includes a first post-passivation interconnect (PPI) layer. The first PPI layer includes a landing pad and a shadow pad material proximate the landing pad. A polymer layer is over the first PPI layer, and a second PPI layer is over the polymer layer. The second PPI layer includes a PPI pad. The PPI pad is coupled to the landing pad by a via in the polymer layer. The shadow pad material is proximate the PPI pad and comprises a greater dimension than a dimension of the PPI pad. The shadow pad material is disposed laterally around the PPI pad.

Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a pellicle frame attached to the pellicle membrane. The pellicle frame has a surface that defines at least one groove. The apparatus further includes a substrate that is in contact with the surface of the pellicle frame such that the grove is positioned between the pellicle frame and the substrate.

Abstract: A method includes followings operations. A substrate including a first surface and a second surface is provided. The substrate and a transparent film are heated to attach the transparent film on the first surface. A first coefficient of a thermal expansion (CTE) mismatch is between the substrate and the transparent film. The substrate and the transparent film are cooled. A polymeric material is disposed on the second surface. A second CTE mismatch is between the substrate and the polymeric material. The second CTE mismatch is counteracted by the first CTE mismatch.

Abstract: A power-up sequence protection circuit includes a first transistor, a second transistor, a third transistor, and a fourth transistor. First terminals of the first transistor, the second transistor, and the fourth transistor are coupled for receiving a program voltage. A control terminal of the third transistor is used for receiving a device voltage. A second terminal of the fourth transistor is used for outputting the program voltage when the fourth transistor is turned on. When the program voltage is unexpectedly powered up while the device voltage is not powered up, the first transistor is turned on, the second transistor is turned off, and the fourth transistor is turned off so as to block the program voltage outputted from the second terminal of the fourth transistor.

Abstract: A self-timed reset pulse generator includes a flip-flop, a tracking block, and a tracking circuit. The flip-flop receives an input signal and a feedback signal and outputting a reset signal. The tracking block has replicating cells coupled in series and replicates a structure in an external device. The tracking block has a first terminal and a second terminal. The first terminal and the second terminal are taking from the tracking block at a same location or two different locations. The tracking circuit unit receives the reset signal and receives the first terminal and the second terminal for respectively discharging the tracking block at the first terminal and sensing a voltage level at the second terminal as triggered by the reset signal. A track-out signal serving as the feed back signal is output to the flip-flop when the voltage level is less than or equal to a threshold.