Abstract: A water-cooled pressurized distributive heat dissipation system used for dissipating heat of servers in the rack is provided. The servers are fixed in the rack in a ranging direction. The system includes a water tank having a distributing duct, branch modules separately corresponding to the servers and a converging duct. Each branch module has a branch pump and a water block in a corresponding one of the servers. The branch pump of each branch module connects between the distributing duct and the water block. The converging duct connects to the water blocks in the ranging direction.

Abstract: A heat dissipating apparatus using phase change heat transfer includes a box, a heat conductive block, a working fluid, and a heat transfer device. The box has a first shell plate and a second plate between both of which a chamber is defined. An opening is formed through the first shell plate. The heat conductive block is disposed corresponding to the opening; a portion of the heat conductive block is formed inside the chamber and the other portion of the heat conductive block is exposed out of the first shell plate. The working fluid is disposed in the chamber and in contact with the heat conductive block. The heat transfer device has an evaporator section installed inside the chamber to absorb the heat generated by the working fluid after phase change. Thus, the heat dissipating efficiency of the whole apparatus can be enhanced.

Abstract: A vapor chamber and a manufacturing method thereof are provided. The vapor chamber includes a housing, a capillary structure, at least two liquid-filling and gas-discharging pipes and a working fluid; the housing has a bottom housing plate and a top housing plate correspondingly engaged and sealed with the bottom housing plate, and a single chamber is formed between the top housing plate and the bottom housing plate; the capillary structure is disposed in the single chamber; each of the liquid-filling and gas-discharging pipes is allowed to penetrate into the housing and communicate with the single chamber; and the working fluid is disposed in the single chamber. Accordingly, the working fluid can be evenly and widely distributed in the single chamber.

Abstract: A poly(amide-imide) is provided. The poly(amide-imide) is represented by formula (1), wherein R is a C6 aryl group, a C7-C8 aralkyl group, a C2-C6 alkoxyalkyl group, or a C3-C18 alkyl group; and 0.02?X?0.5.

Abstract: A poly(amide-imide) is provided. The poly(amide-imide) is represented by formula (1), wherein R is a C6 aryl group, a C7-C8 aralkyl group, a C2-C6 alkoxyalkyl group, or a C3-C18 alkyl group; and 0.02?X?0.5.

Abstract: A meltblown nonwoven fabric is provided. The meltblown nonwoven fabric includes a plurality of meltblown fibers adhered to each other. The material of each of the meltblown fibers includes a polyetherimide and a polyimide, or the material of each of the meltblown fibers includes a polyphenylene sulfide and a polyimide, wherein the glass transition temperature of the polyimide is between 128° C. and 169° C., the 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP.

Abstract: A cooling fan module includes a fan frame, a light emitting part installed in the fan frame, an LED controller installed in the fan frame and electrically connected to the light emitting part, a fan body, and an external connector. The fan body includes a supporting stand detachably connected to the fan frame, a blade set installed on the supporting stand and can rotate with respect to the supporting stand, and a fan connector fixed to the supporting stand and electrically connected to the blade set. The external connector is fixed to the fan frame. The external connector can be electrically plugged in the fan connector to send a first signal; the external connector is electrically connected to the LED controller to send a second signal. Therefore, the cooling fan module has the advantages of easy assembly and reduced incorrect connection.

Abstract: Various multi-die arrangements and methods of manufacturing the same are disclosed. In one aspect, a semiconductor chip device is provided that includes a first molding layer and an interconnect chip at least partially encased in the first molding layer. The interconnect chip has a first side and a second side opposite the first side and a polymer layer on the first side. The polymer layer includes plural conductor traces. A redistribution layer (RDL) structure is positioned on the first molding layer and has plural conductor structures electrically connected to the plural conductor traces. The plural conductor traces provide lateral routing.

Abstract: A method of preparing a thermoplastic composition is provided. The method includes the following steps. A polyetherimide or a polyphenylene sulfide is provided. A polyimide is provided, wherein the glass transition temperature of the polyimide is between 128° C. and 169° C., the 10% thermogravimetric loss temperature of the polyimide is between 490° C. and 534° C., and when the polyimide is dissolved in N-methyl-2-pyrrolidone and the solid content of the polyimide is 30 wt %, the viscosity of the polyimide is between 100 cP and 250 cP. A melt process is performed to mix the polyetherimide and the polyimide or mix the polyphenylene sulfide and the polyimide to form a thermoplastic composition. Further, a thermoplastic composition is also provided.

Abstract: A temperature-responsive material having a structure represented by formula (I): is provided, where in formula (I), X has a structure represented by formula (i) or formula (ii): x and y are in a molar ratio of 9:1 to 1:3, n is an integer of 7 to 120, and m is an integer of 10 to 1,000.

Abstract: Various multi-die arrangements and methods of manufacturing the same are disclosed. In one aspect, a semiconductor chip device is provided that includes a first molding layer and an interconnect chip at least partially encased in the first molding layer. The interconnect chip has a first side and a second side opposite the first side and a polymer layer on the first side. The polymer layer includes plural conductor traces. A redistribution layer (RDL) structure is positioned on the first molding layer and has plural conductor structures electrically connected to the plural conductor traces. The plural conductor traces provide lateral routing.

Abstract: A method of translating network addresses includes defining a service address including a first IP address for a server. The server actually uses a service address including a second IP address. A packet originating from a client is received, the target address of the packet being the first IP address. The destination address of the packet is changed from the first IP address to a third IP address. The destination address of the packet is then changed from the third IP address to the second IP address. The first packet is then sent to the server. The present disclosure also provides a system for implementing the method of translating network address. The security of data transmission is improved while resolving IP network segment conflicts.

Abstract: A preparation method of separation membrane is provided. First, a polyimide composition including a dissolvable polyimide, a crosslinking agent, and a solvent is provided. The dissolvable polyimide is represented by formula 1: wherein B is a tetravalent organic group derived from a tetracarboxylic dianhydride containing aromatic group, A is a divalent organic group derived from a diamine containing aromatic group, A? is a divalent organic group derived from a diamine containing aromatic group and carboxylic acid group, and 0.1?X?0.9. The crosslinking agent is an aziridine crosslinking agent, an isocyanate crosslinking agent, an epoxy crosslinking agent, a diamine crosslinking agent, or a triamine crosslinking agent. A crosslinking process is performed on the polyimide composition. The polyimide composition which has been subjected to the crosslinking process is coated on a substrate to form a polyimide membrane. A dry phase inversion process is performed on the polyimide membrane.

Abstract: A method of translating network addresses includes defining a service address including a first IP address for a server. The server actually uses a service address including a second IP address. A packet originating from a client is received, the target address of the packet being the first IP address. The destination address of the packet is changed from the first IP address to a third IP address. The destination address of the packet is then changed from the third IP address to the second IP address. The first packet is then sent to the server. The present disclosure also provides a system for implementing the method of translating network address. The security of data transmission is improved while resolving IP network segment conflicts.

Abstract: A non-volatile memory includes a memory cell array, an amplifying circuit and a first multiplexer. The memory cell array includes m×n memory cells. The memory cell array is connected with a control line, m word lines and n local bit lines, wherein m and n are positive integers. The amplifying circuit includes n sensing elements. The n sensing elements are respectively connected between the n local bit lines and n read bit lines. The first multiplexer is connected with the n local bit lines and the n read bit lines. According to a first select signal, the first multiplexer selects one of the n local bit lines to be connected with a first main bit line and selects one of the n read bit lines to be connected with a first main read bit line.

Abstract: Disclosed are an integrated vapor chamber and its manufacturing method, the vapor chamber includes a casing base, a fin, a sealed portion and a working fluid, and the casing base is formed by an evacuation method and includes a bottom plate, a top plate, a side plate, and a cavity formed and enclosed by the bottom plate, the top plate and the side plate. Each fin is formed and extended from a surface of the top plate with its back facing the bottom plate, and each sealed portion is formed at the front and rear ends of the cavity separately, and the working fluid is filled into the cavity. The vapor chamber not just features easy manufacturing only, but also provides good heat dissipation effect.

Abstract: A wire bonding structure and a method of manufacturing the same are provided. The wire bonding structure includes a bonding pad structure, a protection layer and a bonding wire. The bonding pad structure includes a bonding pad and a conductive layer. The bonding pad has an opening. The conductive layer is electrically connected to the bonding pad. At least a portion of the conductive layer is located in the opening of the bonding pad and laterally surrounded by the bonding pad. The protection layer at least covers a portion of a surface of the bonding pad structure. The bonding wire is bonded to the conductive layer of the bonding pad structure.

Abstract: A heat dissipating module includes a lower vapor chamber, an upper vapor chamber, a heat pipe and fins. The lower and upper vapor chambers have a first chamber and a second chamber, respectively. The upper vapor chamber is disposed over the upper vapor chamber. The heat pipe is connected between the lower vapor chamber and the upper vapor chamber and has a third chamber. The first chamber, the second chamber and the third chamber communicate with each other. The fins are parallelly upright connected between the lower vapor chamber and the upper vapor chamber. Upper ends and lower ends of the fins connect to the upper vapor chamber and the lower vapor chamber, respectively.

Abstract: A preparation method of separation membrane is provided. First, a polyimide composition including a dissolvable polyimide, a crosslinking agent, and a solvent is provided. The dissolvable polyimide is represented by formula 1: wherein B is a tetravalent organic group derived from a tetracarboxylic dianhydride containing aromatic group, A is a divalent organic group derived from a diamine containing aromatic group, A? is a divalent organic group derived from a diamine containing aromatic group and carboxylic acid group, and 0.1?X?0.9. The crosslinking agent is an aziridine crosslinking agent, an isocyanate crosslinking agent, an epoxy crosslinking agent, a diamine crosslinking agent, or a triamine crosslinking agent. A crosslinking process is performed on the polyimide composition. The polyimide composition which has been subjected to the crosslinking process is coated on a substrate to form a polyimide membrane. A dry phase inversion process is performed on the polyimide membrane.

Abstract: A chip includes a semiconductor substrate, an electrical connector over the semiconductor substrate, and a molding compound molding a lower part of the electrical connector therein. A top surface of the molding compound is lower than a top end of the electrical connector. A recess extends from the top surface of the molding compound into the molding compound.