Abstract: The embodiments of the disclosure provide a method for tracking trackers and a host. The method includes: obtaining a first relative pose between a first tracker and a second tracker; in response to determining that the first relative pose is stable, determining whether a first pose of the first tracker is trackable; and in response to determining that the first pose of the first tracker is untrackable, determining the first pose of the first tracker based on a second pose of the second tracker and the first relative pose.

Abstract: A micro light-emitting diode (LED) includes an epitaxial layered structure including a support layer, a first-type semiconductor element, an active layer, and a second-type semiconductor element that are sequentially disposed on one another in such order. A method for manufacturing a micro LED device including at least one of the micro LED is also disclosed.

Abstract: A thermal conductive structure and an electronic device are provided. The thermal conductive structure includes a thermal conductive metal layer, a first carbon nanotube layer, a first thermal conductive adhesive layer, and a ceramic protective layer. The first carbon nanotube layer is disposed on a first surface of the thermal conductive metal layer and includes a plurality of first carbon nanotubes. The first thermal conductive adhesive layer is disposed at the first carbon nanotube layer, wherein the material of the first thermal conductive adhesive layer fills in the gaps of the first carbon nanotubes. The ceramic protective layer is disposed at one side of the first carbon nanotube layer away from the thermal conductive metal layer. The thermal conductive structure can quickly conduct the heat generated by the heat source to the outside, and improve the heat dissipation performance of the electronic device.

Abstract: A thermal conductive structure and an electronic device are provided. The thermal conductive structure includes a thermal conductive metal layer and a structural layer. The structural layer is disposed on the thermal conductive metal layer. The structural layer is a stacked structure formed by a graphene layer and a ceramic material layer, or the structural layer is a graphene-mixed ceramic material layer. The thermal conductive structure can quickly conduct the heat energy generated by the heat source to the outside, thereby improving the heat dissipation performance of the electronic device.

Abstract: A light emitting diode includes an n-type confinement layer, a quantum well active layer formed on the n-type confinement layer, a p-type confinement layer formed on the quantum well active layer, a gallium phosphide-based quantum dot structure formed in the p-type confinement layer, and a GaP-based current spreading layer formed on the GaP-based quantum dot structure. A method of manufacturing the light emitting diode is also provided.

Abstract: The present invention provides a bionic organ device comprises a porous thermo-responsive layer, a cell culturing layer, a flow channel and a controlling module. The thermo-responsive layer is formed by weaving a fiber made of/from a plurality of thermo-responsive polymers and has a first surface and a second surface opposite to the first surface. The cell culturing layer is formed on the first surface of the thermo-responsive layer. The flow channel has an accommodating space for accommodating the thermo-responsive layer, wherein the flow channel is utilized to allow a flow passing through the second surface inside the flow channel. The controlling module is utilized to allow the flows having different flow temperatures passing through the second surface in the flow channel so as to control a temperature variation of the thermo-responsive layer around critical temperature whereby an expansion and contrast motion of the thermo-responsive layer can be generated.

Abstract: Methods and compositions for treatment and therapy of cancer are provided. Specifically, antagonists specific for interleukin-17 receptor B (IL-17RB) and its ligand IL-17B are provided. Potent neutralizing antibodies specific for IL-17RB and methods for their manufacture and use are disclosed. The invention also relates to antisense, RNAi and shRNA compositions for the prevention and treatment of cancer, in particular breast cancer and pancreatic cancer.

Abstract: Personal protective equipment configured to reduce the discomfort of the protruding joint of the conventional personal protective equipment includes a sleeve, at least one adhesive membrane, and at least one thin film. The sleeve is formed by curving an elastic fabric and joining two opposite joining edges of the elastic fabric in a butting manner. The adhesive membrane has an adhesive side adhesively attached to a surface of the sleeve over an area where the two opposite joining edges of the sleeve extend. The thin film covers and is adhesively attached to another adhesive side of the adhesive membrane. The personal protective equipment, therefore, has a flat joint and is spared those prior art drawbacks attributable to the protuberance of a hemmed border or overlap seam, such as an uncomfortable sensation and a lack of conformity to the contour of the body part being protected.

Abstract: A micro light-emitting diode (LED) includes an epitaxial layered structure including a support layer, a first-type semiconductor element, an active layer, and a second-type semiconductor element that are sequentially disposed on one another in such order. A method for manufacturing a micro LED device including at least one of the micro LED is also disclosed.

Abstract: A method and a system for evaluating a cardiac status, an electronic device and an ultrasonic scanning device are provided. The method includes: obtaining at least first image, wherein each of the first images is a two-dimensional image and includes a first cardiac image; training a depth learning model by the first image; and analyzing at least one second image by using the trained depth learning model to automatically evaluate a cardiac status of a user, wherein each of the second image is the two-dimensional image and includes a second cardiac image.

Abstract: A light emitting diode includes an n-type confinement layer, a quantum well active layer formed on the n-type confinement layer, a p-type confinement layer formed on the quantum well active layer, a gallium phosphide-based quantum dot structure formed in the p-type confinement layer, and a GaP-based current spreading layer formed on the GaP-based quantum dot structure. A method of manufacturing the light emitting diode is also provided.

Abstract: An invisible-light light-emitting diode includes an N-type ohmic contact semiconductor layer, an N-type current spreading layer, an N—GaAs visible-light absorption layer, an N-type cladding layer, a light-emitting layer, a P-type cladding layer and a P-type ohmic contact semiconductor layer. In the invisible-light light-emitting diode, the absorption layer is GaAs, which can effectively remove all visible light when current density is >1 A/mm2, and essentially all visible light when current density is below 3 A/mm2. This effectively solves the red dot effect of invisible-light light-emitting diodes.

Abstract: A semiconductor manufacturing system includes an operating terminal, a first controller, and a plurality of second controllers. The operating terminal controls a main controller. Each of the plurality of second controllers is electrically connected to the first controller. In an initial or default state, the operating terminal controls the first controller as a main controller, and when the first controller fails, the operating terminal controls one of the plurality of the second controllers as a main controller, the others of the plurality of second controllers being controlled by the main controller.

Abstract: A front opening unified pod (FOUP) loading and air filling system comprises a FOUP loading device and an air filling device. The FOUP loading device is configured to load and unload a FOUP, and comprises a substrate and a controller. The substrate comprises a frame, a bearing platform installed on the frame, and a cavity under the bearing platform. The bearing platform is configured to support the FOUP. The controller and the air filling device are accommodated in the cavity. The air filling device is connected to the FOUP.

Abstract: An infrared light-emitting diode includes, from up to bottom, a P-type ohmic electrode, a contact layer, a P-type cladding layer, an active layer, an N-type cladding layer, a buffer layer, a GaAs substrate and an N-type ohmic electrode. The N-type cladding layer and the P-type cladding layer or either of them is InxGa1-xAs. The cladding layer of InxGa1-xAs, due to low resistance, can improve current expansion, reduce voltage and improve light-emitting efficiency.

Abstract: A wafer supporting system includes a supporting pedestal. The supporting pedestal includes a main supporting body and a hollow frame surrounding the supporting pedestal. The main supporting body includes a top surface and a bottom surface opposite to the top surface, the top surface defined a plurality of vent grooves and a plurality of holding grooves. The main supporting body includes a plurality of holding channels extending through from the bottom surface to the holding grooves and a plurality of first through holes pass through from the top surface to the bottom surface, each holding groove is surrounded by a plurality of first through holes; an inner side surface of the hollow frame and a side wall of the supporting pedestal form a gap, and a plurality of exhaust cylinders are arranged in the annular gap and each exhaust cylinder is communicated with each vent groove.

Abstract: A reflective exposure apparatus includes a platform, an illuminating system, a photomask, a chip, and a reflecting convex mirror. The photomask is formed on the platform and faces the illuminating system. The chip is formed on the platform. The illuminating system and the reflecting curved mirror are formed on opposite sides of the platform. The platform can be moved relative to the illuminating system and the reflecting curved mirror.

Abstract: An air purifying device for an FOUP includes an air supply assembly. The air supply assembly includes an air supply tube and an airtight connecting unit connecting the tube to the FOUP in an airtight manner. The air tight connecting unit includes an elastic absorbing portion, a nozzle, and a driver. An initial position of the elastic absorbing portion is lower than a supporting surface of a load port before the FOUP is placed on the supporting surface. One end of the nozzle is fixedly inserted to the elastic absorbing portion, and another end of the nozzle is movably inserted to the air supply tube. The driver can drive the nozzle and the elastic absorbing portion to move upward to press against the FOUP when the FOUP is placed on the supporting surface, causing the elastic absorbing portion to be vertically deformed to maintain an airtight connection.

Abstract: An air purifying device for a front opening unified pod (FOUP) carrying silicon wafers includes an air supply assembly and an air discharging assembly. The air supply assembly can be triggered by a signal to supply purified air to the FOUP. The air discharging assembly discharges air from the FOUP when the air supply assembly begins to supply the FOUP with purified air and detects a humidity and a temperature of the discharged air. The detected humidity and the detected temperature correspond to a relative humidity of the discharged air. When the relative humidity is equal to a preset relative humidity, the air supply assembly is stopped and the air discharging assembly is stopped.

Abstract: Methods and apparatuses pertaining to flexible information mapping and modification of data packets are described. A method may involve receiving a data packet, modifying one or more attributes of the data packet, and outputting the modified data packet. In modifying the one or more attributes of the data packet, the method may involve extracting information from the data packet, the information including one or more user-defined fields (UDFs) in a header of the data packet. The method may also involve defining one or more source user-defined fields (SUDFs) according to at least one UDF of the one or more UDFs. The method may further involve performing one or more actions with respect to at least one SUDF of the one or more SUDFs.