Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw is in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: An information handling system includes keyboard backlights, an embedded controller, and a processor. The embedded controller communicates with the keyboard backlights. In response to an activate keyboard backlights signal, the embedded controller turns on the keyboard backlights. In response to a deactivate keyboard backlights signal, the embedded controller turns off the keyboard backlights. The processor communicates with the embedded controller. The processor determines whether an ultrasonic waveform is received. In response to the ultrasonic waveform being received, the processors provide the deactivate keyboard backlights signal to the embedded controller. In response to the ultrasonic waveform not being received, the processor provides the activate keyboard backlights signal to the embedded controller.

Abstract: A clamp may include two substantially planar plates opposite from and generally parallel to one another, each plate having a mounting hole formed therein for receiving a fastener, two teeth, each tooth extending from a respective one of the two plates, such that each tooth is generally perpendicular to the plates, and such that each tooth extends towards the other from its respective plate, and a tongue opposite from and mechanically interfaced between the two plates, such that the tongue has a concave curved profile between the plates, and such that when a force is applied in a first direction by a fastener engaging with the clamp through the mounting holes, compression of the plates towards one another causes deflection of the tongue in a second direction substantially perpendicular to the first direction.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A speaker module, including: a speaker enclosure, including: a recessed portion; a transducer, including: a top surface; a bottom surface; a perimeter surface positioned between the top surface and the bottom surface; a rubber cap including: a top side; a bottom side; and edges extending between the top side and the bottom side, wherein the edges define an inside perimeter of the rubber cap and include a slot extending along the inside perimeter of the rubber cap, wherein, the transducer is coupled to the rubber cap such that the rubber cap surrounds the transducer and the perimeter surface of the transducer is positioned within the slot of the plurality of edges of the rubber cap, wherein, the transducer is coupled to the speaker enclosure such that the transducer is positioned within the recessed portion of the speaker enclosure and the rubber cap is positioned between the transducer and the speaker.

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: A touch panel device includes a face plate, a bracket, and a PCB. The face plate receives a contact. The bracket includes a permanent magnet affixed to a surface of the bracket. The PCB is positioned proximate to the bracket such that a surface of the PCB is adjacent to the bracket. The PCB includes a Hall sensor collocated proximate to the permanent magnet. The touch panel circuit is coupled to the Hall sensor. When the contact is received at the face plate, the PCB moves closer to the bracket. In response, the touch panel circuit receives a voltage from the Hall sensor, determines a force associated with the contact based upon the voltage, and triggers a haptic feedback response in the bracket.

Abstract: A touch panel device includes a face plate, a force-feedback device, and a touch panel circuit. The face plate receives at a first surface a contact with the face plate. The force-feedback device includes a PCB affixed by a first surface of the PCB to a second surface of the face plate. The PCB includes a first metallic ring on a second surface of the PCB. The piezo disc includes a piezoelectric wafer and a second metallic ring. The piezo disc is adjacent to the second surface of the PCB. The touch panel circuit is coupled to the first metallic ring, the second metallic ring, and the piezoelectric wafer. The touch panel circuit determines a capacitance between the first metallic ring and the second metallic ring, determines a force associated with the contact based upon the capacitance, and triggers a haptic feedback response in the piezoelectric wafer.

Abstract: A touchpad assembly, including an actuator device that provides motion in a first direction; a first structural element coupled to the actuator device; a second structural element coupled to the first structural element; wherein the first structural element, in response to the motion in the first direction provided by the actuator device, exerts a first rotational force in a first rotational direction, wherein the second structural element, in response to the first rotational force by the first structural element, exerts a second rotational force in a second rotational direction opposite to the first rotational direction, wherein the first rotational force and the second rotational force provide a rotational vibration of the touchpad assembly.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A touchpad assembly, including an actuator device that provides motion in a first direction; a first structural element coupled to the actuator device; a second structural element coupled to the first structural element; wherein the first structural element, in response to the motion in the first direction provided by the actuator device, exerts a first rotational force in a first rotational direction, wherein the second structural element, in response to the first rotational force by the first structural element, exerts a second rotational force in a second rotational direction opposite to the first rotational direction, wherein the first rotational force and the second rotational force provide a rotational vibration of the touchpad assembly.

Abstract: A touchpad module including: a touchpad printed circuit board (PCB); a switch coupled to a first side of the touchpad PCB; a touchpad bracket, with at least a portion of the bracket spaced apart from the switch a first distance; a frame, with at least a segment of the frame positioned between the portion of the bracket and the switch, the segment of the frame including a through hole in superimposition with at least a portion of the switch; and a stopper positioned within the through hole and with a first end of the stopper in contact with the switch.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A clamp may include two substantially planar plates opposite from and generally parallel to one another, each plate having a mounting hole formed therein for receiving a fastener, two teeth, each tooth extending from a respective one of the two plates, such that each tooth is generally perpendicular to the plates, and such that each tooth extends towards the other from its respective plate, and a tongue opposite from and mechanically interfaced between the two plates, such that the tongue has a concave curved profile between the plates, and such that when a force is applied in a first direction by a fastener engaging with the clamp through the mounting holes, compression of the plates towards one another causes deflection of the tongue in a second direction substantially perpendicular to the first direction.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate, and the substrate includes a first region and a second region. The semiconductor device structure includes a first conductive structure formed over the first region of the substrate and a bottom magnetic layer formed over the second region of the substrate. The semiconductor device structure also includes a second conductive structure formed over the bottom magnetic layer and a first insulating layer formed over a sidewall surface of the first conductive structure. The semiconductor device structure further includes a second insulating layer formed over the first insulating layer, and the second insulating layer has a stair-shaped structure.