Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: A touch panel device includes a face plate, a bracket, and a PCB. The face plate receives a contact. The bracket includes a permanent magnet affixed to a surface of the bracket. The PCB is positioned proximate to the bracket such that a surface of the PCB is adjacent to the bracket. The PCB includes a Hall sensor collocated proximate to the permanent magnet. The touch panel circuit is coupled to the Hall sensor. When the contact is received at the face plate, the PCB moves closer to the bracket. In response, the touch panel circuit receives a voltage from the Hall sensor, determines a force associated with the contact based upon the voltage, and triggers a haptic feedback response in the bracket.

Abstract: A touch panel device includes a face plate, a force-feedback device, and a touch panel circuit. The face plate receives at a first surface a contact with the face plate. The force-feedback device includes a PCB affixed by a first surface of the PCB to a second surface of the face plate. The PCB includes a first metallic ring on a second surface of the PCB. The piezo disc includes a piezoelectric wafer and a second metallic ring. The piezo disc is adjacent to the second surface of the PCB. The touch panel circuit is coupled to the first metallic ring, the second metallic ring, and the piezoelectric wafer. The touch panel circuit determines a capacitance between the first metallic ring and the second metallic ring, determines a force associated with the contact based upon the capacitance, and triggers a haptic feedback response in the piezoelectric wafer.

Abstract: A touchpad assembly, including an actuator device that provides motion in a first direction; a first structural element coupled to the actuator device; a second structural element coupled to the first structural element; wherein the first structural element, in response to the motion in the first direction provided by the actuator device, exerts a first rotational force in a first rotational direction, wherein the second structural element, in response to the first rotational force by the first structural element, exerts a second rotational force in a second rotational direction opposite to the first rotational direction, wherein the first rotational force and the second rotational force provide a rotational vibration of the touchpad assembly.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A touchpad assembly, including an actuator device that provides motion in a first direction; a first structural element coupled to the actuator device; a second structural element coupled to the first structural element; wherein the first structural element, in response to the motion in the first direction provided by the actuator device, exerts a first rotational force in a first rotational direction, wherein the second structural element, in response to the first rotational force by the first structural element, exerts a second rotational force in a second rotational direction opposite to the first rotational direction, wherein the first rotational force and the second rotational force provide a rotational vibration of the touchpad assembly.

Abstract: A touchpad module including: a touchpad printed circuit board (PCB); a switch coupled to a first side of the touchpad PCB; a touchpad bracket, with at least a portion of the bracket spaced apart from the switch a first distance; a frame, with at least a segment of the frame positioned between the portion of the bracket and the switch, the segment of the frame including a through hole in superimposition with at least a portion of the switch; and a stopper positioned within the through hole and with a first end of the stopper in contact with the switch.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A clamp may include two substantially planar plates opposite from and generally parallel to one another, each plate having a mounting hole formed therein for receiving a fastener, two teeth, each tooth extending from a respective one of the two plates, such that each tooth is generally perpendicular to the plates, and such that each tooth extends towards the other from its respective plate, and a tongue opposite from and mechanically interfaced between the two plates, such that the tongue has a concave curved profile between the plates, and such that when a force is applied in a first direction by a fastener engaging with the clamp through the mounting holes, compression of the plates towards one another causes deflection of the tongue in a second direction substantially perpendicular to the first direction.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate, and the substrate includes a first region and a second region. The semiconductor device structure includes a first conductive structure formed over the first region of the substrate and a bottom magnetic layer formed over the second region of the substrate. The semiconductor device structure also includes a second conductive structure formed over the bottom magnetic layer and a first insulating layer formed over a sidewall surface of the first conductive structure. The semiconductor device structure further includes a second insulating layer formed over the first insulating layer, and the second insulating layer has a stair-shaped structure.

Abstract: A curved display integrates in a portable information handling system housing to present visual images to an end user about an arc for improved viewing angle. The portable information handling system rotates the housing from an open position that exposes the display in a curved configuration to a closed position that brings the display against a main housing portion with the display transitioned from the curved to a planar configuration for a low profile storage position. Display curve is managed with a curved support frame that bends to a planar form, a pair of perpendicular-axis hinges that rotate opposing housings about a horizontal axis and manage display curve about a vertical axis, and a dual axis hinge with a sliding bracket that adjusts for greater housing spacing in the curved configuration.

Abstract: A curved display integrates in a portable information handling system housing to present visual images to an end user about an arc for improved viewing angle. The portable information handling system rotates the housing from an open position that exposes the display in a curved configuration to a closed position that brings the display against a main housing portion with the display transitioned from the curved to a planar configuration for a low profile storage position. Display curve is managed with a curved support frame that bends to a planar form, a pair of perpendicular-axis hinges that rotate opposing housings about a horizontal axis and manage display curve about a vertical axis, and a dual axis hinge with a sliding bracket that adjusts for greater housing spacing in the curved configuration.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate, and the substrate includes a first region and a second region. The semiconductor device structure includes a first conductive structure formed over the first region of the substrate and a bottom magnetic layer formed over the second region of the substrate. The semiconductor device structure also includes a second conductive structure formed over the bottom magnetic layer and a first insulating layer formed over a sidewall surface of the first conductive structure. The semiconductor device structure further includes a second insulating layer formed over the first insulating layer, and the second insulating layer has a stair-shaped structure.

Abstract: In accordance with embodiments of the present disclosure, a method may include mechanically supporting a cantilever arm of a clickpad between a support bracket and a housing by a compressive force of the plurality of fasteners applied to the support bracket and the housing, and free of any features for receiving any of a plurality of fasteners for coupling the support bracket to the housing, wherein the cantilever arm has a pivot end and a trigger end, and such that the cantilever arm pivots about a pivot axis proximate to the pivot end in response to a force exerted on the surface of the clickpad substantially perpendicular to a surface of the clickpad.