Abstract: A curved display integrates in a portable information handling system housing to present visual images to an end user about an arc for improved viewing angle. The portable information handling system rotates the housing from an open position that exposes the display in a curved configuration to a closed position that brings the display against a main housing portion with the display transitioned from the curved to a planar configuration for a low profile storage position. Display curve is managed with a curved support frame that bends to a planar form, a pair of perpendicular-axis hinges that rotate opposing housings about a horizontal axis and manage display curve about a vertical axis, and a dual axis hinge with a sliding bracket that adjusts for greater housing spacing in the curved configuration.

Abstract: A curved display integrates in a portable information handling system housing to present visual images to an end user about an arc for improved viewing angle. The portable information handling system rotates the housing from an open position that exposes the display in a curved configuration to a closed position that brings the display against a main housing portion with the display transitioned from the curved to a planar configuration for a low profile storage position. Display curve is managed with a curved support frame that bends to a planar form, a pair of perpendicular-axis hinges that rotate opposing housings about a horizontal axis and manage display curve about a vertical axis, and a dual axis hinge with a sliding bracket that adjusts for greater housing spacing in the curved configuration.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A method of forming an integrated circuit structure includes forming a first magnetic layer, forming a first conductive line over the first magnetic layer, and coating a photo-sensitive coating on the first magnetic layer. The photo-sensitive coating includes a first portion directly over the first conductive line, and a second portion offset from the first conductive line. The first portion is joined to the second portion. The method further includes performing a first light-exposure on the first portion of the photo-sensitive coating, performing a second light-exposure on both the first portion and the second portion of the photo-sensitive coating, developing the photo-sensitive coating, and forming a second magnetic layer over the photo-sensitive coating.

Abstract: A method of forming an integrated circuit structure includes forming a patterned passivation layer over a metal pad, with a top surface of the metal pad revealed through a first opening in the patterned passivation layer, and applying a polymer layer over the patterned passivation layer. The polymer layer is substantially free from N-Methyl-2-pyrrolidone (NMP), and comprises aliphatic amide as a solvent. The method further includes performing a light-exposure process on the polymer layer, performing a development process on the polymer layer to form a second opening in the polymer layer, wherein the top surface of the metal pad is revealed to the second opening, baking the polymer, and forming a conductive region having a via portion extending into the second opening.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate, and the substrate includes a first region and a second region. The semiconductor device structure includes a first conductive structure formed over the first region of the substrate and a bottom magnetic layer formed over the second region of the substrate. The semiconductor device structure also includes a second conductive structure formed over the bottom magnetic layer and a first insulating layer formed over a sidewall surface of the first conductive structure. The semiconductor device structure further includes a second insulating layer formed over the first insulating layer, and the second insulating layer has a stair-shaped structure.

Abstract: In accordance with embodiments of the present disclosure, a method may include mechanically supporting a cantilever arm of a clickpad between a support bracket and a housing by a compressive force of the plurality of fasteners applied to the support bracket and the housing, and free of any features for receiving any of a plurality of fasteners for coupling the support bracket to the housing, wherein the cantilever arm has a pivot end and a trigger end, and such that the cantilever arm pivots about a pivot axis proximate to the pivot end in response to a force exerted on the surface of the clickpad substantially perpendicular to a surface of the clickpad.

Abstract: In accordance with embodiments of the present disclosure, a method may include mechanically supporting a cantilever arm of a clickpad between a support bracket and a housing by a compressive force of the plurality of fasteners applied to the support bracket and the housing, and free of any features for receiving any of a plurality of fasteners for coupling the support bracket to the housing, wherein the cantilever arm has a pivot end and a trigger end, and such that the cantilever arm pivots about a pivot axis proximate to the pivot end in response to a force exerted on the surface of the clickpad substantially perpendicular to a surface of the clickpad.

Abstract: A media base security device and method of use is disclosed. According to one aspect, a media base security device can include a lock rod mechanism coupled to a portion of a media base housing including a security lock aperture operable to receive a security lock. The media base security device can also include a release lever accessible external to the housing. The release lever can be operable to release the media base housing when coupled to a portable computer system. The release lever can include a lock rod seat operable to engage a lock rod extending from the lock rod mechanism in response to locking the security lock.

Abstract: A media base security device and method of use is disclosed. According to one aspect, a media base security device can include a lock rod mechanism coupled to a portion of a media base housing including a security lock aperture operable to receive a security lock. The media base security device can also include a release lever accessible external to the housing. The release lever can be operable to release the media base housing when coupled to a portable computer system. The release lever can include a lock rod seat operable to engage a lock rod extending from the lock rod mechanism in response to locking the security lock.