Patents by Inventor Chun Lin

Chun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11419203
    Abstract: A method and system for generating EUV light includes providing a laser beam having a Gaussian distribution. This laser beam can be then modified from a Gaussian distribution to a ring-like distribution. The modified laser beam is provided through an aperture in a collector and interfaces with a moving droplet target, which generates an extreme ultraviolet (EUV) wavelength light. The generated EUV wavelength light is provided to the collector away from the aperture. In some embodiments, a mask element may also be used to modify the laser beam to a shape.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: August 16, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Lin Louis Chang, Jen-Hao Yeh, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng
  • Patent number: 11415878
    Abstract: A photomask assembly may be formed such that stress relief trenches are formed in a pellicle frame of the photomask assembly. The stress relief trenches may reduce or prevent damage to a pellicle that may otherwise result from deformation of the pellicle. The stress relief trenches may be formed in areas of the pellicle frame to allow the pellicle frame to deform with the pellicle, thereby reducing the amount damage to the pellicle caused by the pellicle frame.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: August 16, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Hao Lee, You-Cheng Jhang, Han-Zong Pan, Jui-Chun Weng, Chiu-Hua Chung, Sheng-Yuan Lin, Hsin-Yu Chen
  • Patent number: 11414775
    Abstract: A power supply system for a vertical continuous electroplating frame, comprising: a power supply rail arranged on the vertical continuous electroplating device; and an electrode case, arranged a case body on the top surface of the electroplating frame, inside the case body having an electrode plate corresponding to the power supply rail, at the bottom of the electrode plate having an elastic unit, the top surface of the case body having a positioning groove corresponding to the electrode plate, when the electrode plate is electrical contacted with the power supply rail, the electroplating current is provided to the object to be plated through the electroplating frame.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: August 16, 2022
    Assignee: U-Pro Machines Co., Ltd.
    Inventors: Hsin-Chi Iou, Huan-Chun Lin, Hsu-Cheng Peng
  • Patent number: 11414658
    Abstract: A tracer particle is provided. The tracer particle includes: a core structure; a nucleic acid molecule immobilized on the core structure; and a shell layer covering the core structure and the nucleic acid molecule; wherein the core structure has a first porosity, the shell layer has a second porosity, and the first porosity is greater than the second porosity.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: August 16, 2022
    Assignee: Industrial Technology Research Institute
    Inventors: Kai-Chun Fan, Yin-Lung Han, Pei-Jyuan Gao, Yong-Yang Lin, Chieh-Lun Cheng, Chien-Chang Huang, Yung-Ho Chang, Chia-Long Lin, I-Son Ng, Bo-Han Chen
  • Patent number: 11417800
    Abstract: A micro semiconductor device and a micro semiconductor display are provided. The micro semiconductor device includes an epitaxial structure, a first electrode, a second electrode and a supporting layer. The epitaxial structure has a bottom surface and a top surface, wherein the bottom surface is defined as a central region and a peripheral region. A first electrode and a second electrode are disposed on the central region of the bottom surface of the epitaxial structure, or the first electrode is disposed on the central region of the bottom surface of the epitaxial structure and the second electrode is disposed on the top surface of the epitaxial structure. The supporting layer is disposed on the peripheral region of the bottom surface of the epitaxial structure.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: August 16, 2022
    Assignee: PLAYNITRIDE DISPLAY CO., LTD.
    Inventors: Ying-Tsang Liu, Pei-Hsin Chen, Yi-Chun Shih, Yi-Ching Chen, Yu-Chu Li, Tzu-Yang Lin, Yu-Hung Lai
  • Patent number: 11412940
    Abstract: The present invention provides a dynamic measurement device with a blood pressure determination function, comprising: a heartbeat sensing module disposed on the chest area of a user wherein the heartbeat sensing module comprising a heart sound sensor for obtaining heartbeat signals; a pulse sensing module disposed on a limb area of the user, the pulse sensing module comprising a pulse wave sensor for obtaining pulse signals; and a data calculating module for calculating a mean arterial pressure and a value of systolic blood pressure and diastolic blood pressure based on the heartbeat signals and pulse signals. In addition to dynamically monitoring the blood pressure of a user for 24 hours, the present invention can dynamically monitor the heart sounds of the user for 24 hours individually in order to monitor user's physical condition. Therefore, the present invention has important medical meanings.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: August 16, 2022
    Assignees: BIV MEDICAL, LTD.
    Inventors: Shiming Lin, Shih-Wei Chiang, Cheng-Yan Guo, Tai-Cun Lin, Wei-Chih Huang, Chun-Nan Chen, Ya-Ting Chang
  • Patent number: 11414638
    Abstract: A portable bioreactor is provided for driving displacement of at least one stirring sleeve relative to at least one tube cassette in a first direction and includes a machine frame unit and a first elevator. The first elevator includes a first linear movement module, a first transmission module, and a first turning module. The first linear movement module includes a first slider which is slidable on the first guide rail in the first direction between a first top position and a first bottom position. The first turning module is coupled to the first slider through the first transmission module so as to permit turning of the first turning module to be translated by the first transmission module into linear sliding movement of the first slider at a varying speed.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: August 16, 2022
    Assignee: GENEREACH BIOTECHNOLOGY CORPORATION
    Inventors: Wen-Shan Yang, Ching-Ko Lin, Fu-Chun Li, Pin-Hsing Chou, Yun-Lung Tsai, Pei-Yu Lee, Hsiao-Fen Chang
  • Publication number: 20220252228
    Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.
    Type: Application
    Filed: April 19, 2022
    Publication date: August 11, 2022
    Inventors: Chiu-Lin YAO, Min-Hsun HSIEH, Been-Yu LIAW, Wei-Chiang HU, Po-Hung LAI, Chun-Hung LIU, Shih-An LIAO, Yu-His SUNG, Ming-Chi HSU
  • Publication number: 20220251831
    Abstract: Disclosed herein is a building assembly for assembling building panels. The building assembly includes a supporting member, a pair of a first sealing member, an elastically deformable gasket, and a second sealing member. The supporting member has a base, a channel disposed at the center of the base, and a pair of rails independently disposed next to the channel. The pair of a first sealing members independently includes a first base portion and two retention tongues independently extending outwardly from the first base portion. The elastically deformable gasket has a U- or V-shaped space in cross section and two flanges independently extending laterally from one edge of the U- or V-shaped space. The second sealing member has a second base portion and a rib disposed at the center of the second base portion.
    Type: Application
    Filed: February 9, 2021
    Publication date: August 11, 2022
    Applicant: MINIWIZ CO.,LTD.
    Inventors: Chian-Chi HUANG, Tzu-Wei LIU, Jui-Ping CHEN, Yu-Ying YAI, Yu-Tung HSING, Pei-Yi HUANG, Min-Wei LIN, Yi-Chun CHANG, Ling-Hsiang WENG
  • Publication number: 20220254828
    Abstract: The present disclosure relates to a semiconductor structure. The semiconductor structure includes a dielectric layer having a first dielectric surface and a second dielectric surface opposite to the first dielectric surface. The dielectric layer defines a recess in the first dielectric surface, and the recess includes a sidewall of the dielectric layer. A first conductive layer contacts a bottom surface of the dielectric layer. The sidewall of the dielectric layer is directly over the first conductive layer. A second conductive layer contacts the first conductive layer and the dielectric layer. The second conductive layer vertically extends from the first conductive layer to above the dielectric layer. A third conductive layer contacts the second conductive layer. The third conductive layer is laterally separated from a sidewall of the second conductive layer that faces the third conductive layer by a non-zero distance.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 11, 2022
    Inventors: Kai-Chun Hsu, Ching-Chun Wang, Dun-Nian Yaung, Jeng-Shyan Lin, Shyh-Fann Ting
  • Publication number: 20220254739
    Abstract: A semiconductor article which includes a semiconductor substrate, a back end of the line (BEOL) wiring portion on the semiconductor substrate, a through silicon via and a guard ring. The semiconductor substrate is made of a semiconductor material. The BEOL wiring portion includes a plurality of wiring layers having electrically conductive wiring and electrical insulating material. The through silicon via provides a conductive path through the BEOL wiring portion and the semiconductor substrate. The guard ring surrounds the through silicon via in the BEOL wiring portion and in some embodiments in the semiconductor substrate.
    Type: Application
    Filed: September 21, 2021
    Publication date: August 11, 2022
    Inventors: Min-Feng KU, Yao-Chun CHUANG, Ching-Pin LIN, Cheng-Chien LI
  • Publication number: 20220254722
    Abstract: A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 11, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu
  • Publication number: 20220254888
    Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, a source region, a drain region, and a plurality of field plates. The gate structure is disposed on the semiconductor substrate. The source region and the drain region are disposed in the semiconductor substrate and located at two opposite sides of the gate structure in a first direction respectively. The field plates are disposed on the semiconductor substrate. Each of the field plates is partly located above the gate structure and partly located between the gate structure and the drain region. The gate structure is electrically connected with at least one of the field plates, and the source region is electrically connected with at least one of the field plates.
    Type: Application
    Filed: March 15, 2021
    Publication date: August 11, 2022
    Inventors: Yi-Chieh Wang, Po-Chun Lai, Ke-Feng Lin, Chen-An Kuo, Ze-Wei Jhou
  • Publication number: 20220255769
    Abstract: An array controlling system includes a database, a controlling center and an array device. The controlling center reads a plurality of data of the database. The array device includes a processing unit, a main bus and an array unit. The processing unit receives a command of the controlling center and converts the command into a communication data. The main bus is configured to transmit the communication data to the array unit. A plurality of array modules of the array unit are connected in series with each other through a serial bus, and sequentially receive the communication data. The processing unit controls each of the array modules according to the communication data. A plurality of sensing data of the array modules are collected to the processing unit. The processing unit returns the sensing data to the database or the controlling center to update the database.
    Type: Application
    Filed: May 26, 2021
    Publication date: August 11, 2022
    Inventors: Hsuan-Yu HUANG, Shun-Han KO, Yu-Hung LIN, Po-Chun CHIU, Hsien-Tang JAO
  • Publication number: 20220254381
    Abstract: A semiconductor connection structure and its manufacturing method are provided. The semiconductor connection structure includes a substrate with an array area, a first trench, a metal line, a work function layer and a contact structure. The array area includes a central region and an edge region surrounding the central region. The first trench is formed in the substrate and extends from the central region to the edge region along a first direction. The first trench has a first portion in the central region and a wider second portion in the edge region. The metal line and the work function layer are formed in the first trench. The contact structure is formed in the first trench within the edge region. The contact structure is located on the metal line and in direct contact with the metal line. The bottom portion of the contact structure is surrounded by the work function layer.
    Type: Application
    Filed: February 5, 2021
    Publication date: August 11, 2022
    Inventor: Chun-Lin LI
  • Patent number: 11410991
    Abstract: Some embodiments relate to an integrated circuit. The integrated circuit includes a ring-shaped drain region having an inner edge and an outer edge. A channel region surrounds the ring-shaped drain region. A source region surrounds the channel region. The channel region separates the drain region from the source region. A gate electrode is arranged over the channel region and is separated from the channel region by a gate dielectric. An inner edge of the gate electrode is proximate to the drain region. A resistor structure is arranged over and spaced apart from an upper surface of the substrate. The resistor structure has a first end and a second end which are connected by a curved or polygonal path of resistive material. The first end is coupled to the ring-shaped drain. The resistor has an outer perimeter that is surrounded by the inner edge of the ring-shaped drain region.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ker Hsiao Huo, Fu-Chih Yang, Chun Lin Tsai, Yi-Min Chen, Chih-Yuan Chan
  • Patent number: 11407112
    Abstract: A method for predicting collision of a machining path includes: a step of reading an NC program; a step of translating a plurality of block information in the NC program; a step of, prior to perform interpolation upon each of the plurality of block information, calculating a safety distance of a next block information with respect to a block information to be interpolated; a step of searching a number of individual block information having an accumulated distance greater than or equal to the safety distance; and a step of performing an anti-collision detection upon each of the individual block information contributing the accumulated distance. In addition, a system for predicting collision of a machining path is also provided.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: August 9, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shu-Yu Lin, Ming-Chun Ho, Chu-Kai Huang, Chao-Chuang Mai
  • Patent number: 11407636
    Abstract: The present disclosure, in some embodiments, relates to a method of forming a micro-electromechanical system (MEMS) package. The method includes forming one or more depressions within a capping substrate. A back-side of a MEMS substrate is bonded to the capping substrate after forming the one or more depressions, so that the one or more depressions define one or more cavities between the capping substrate and the MEMS substrate. A front-side of the MEMS substrate is selectively etched to form one or more trenches extending through the MEMS substrate, and one or more polysilicon vias are formed within the one or more trenches. A conductive bonding structure is formed on the front-side of the MEMS substrate at a location contacting the one or more polysilicon vias. The MEMS substrate is bonded to a CMOS substrate having one or more semiconductor devices by way of the conductive bonding structure.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shyh-Wei Cheng, Chih-Yu Wang, Hsi-Cheng Hsu, Ji-Hong Chiang, Jui-Chun Weng, Shiuan-Jeng Lin, Wei-Ding Wu, Ching-Hsiang Hu
  • Patent number: 11406160
    Abstract: An apparatus for buffing a shoe part includes a housing adapted to be articulated around at least a portion of the footwear part. A rotating spindle is positioned in the housing and has a buffing surface for engagement with the footwear part. A carriage is slideably connected to the housing and holds the spindle such that the buffing surface can be moved closer to and further away from the footwear part. An actuator is in the housing and in contact with the carriage. The actuator applies force to the carriage to increase the force of the buffing surface onto the footwear part. A biasing member is in the housing and in contact with the carriage. The biasing member exerts force onto the carriage in a direction opposite the force exerted by the actuator.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: August 9, 2022
    Assignee: NIKE, Inc.
    Inventors: Dragan Jurkovic, Shih-Yuan Wu, Chia-Wei Chang, Wen-Ruei Chang, Chien-Chun Chen, Chang-Chu Liao, Chia-Hung Lin
  • Patent number: 11410972
    Abstract: A method for manufacturing three-dimensional (3D) integrated circuit (IC) is provided. In some embodiments, a second IC die is formed and bonded to a first IC die by a first bonding structure. A third IC die is formed and bonded to the second IC die by a second bonding structure. The second bonding structure is formed between back sides of the second IC die and the third IC die opposite to corresponding interconnect structures and comprises a first TSV (through substrate via) disposed through a second substrate of the second IC die and a second TSV disposed through a third substrate of the third IC die. In some further embodiments, the second bonding structure is formed by forming conductive features with oppositely titled sidewalls disposed between the first TSV and the second TSV.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu, Min-Feng Kao, Yung-Lung Lin, Shih-Han Huang, I-Nan Chen