Patents by Inventor Chun Lin

Chun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250213062
    Abstract: A brewing device includes a container, a filter net assembly, a gas guide tube, a cover assembly, and a lift grip. The cover assembly includes a cover and a connecting member. The gas guide tube is combinable with the connecting member so as to combine the cover and the filter net assembly together. The lift grip is connected to the cover assembly to allow hand-holding of the lift grip for moving the cover assembly and the filter net assembly. The filter net assembly is retained in a retaining portion of a container opening portion of the container. An annular gap is formed between the cover and an inside surface of the container opening portion. A water filling trough is formed, as being downward recessed, between the cover and the container opening of the container. The gas guide tube is in communication with a liquid storage space of the container.
    Type: Application
    Filed: December 28, 2023
    Publication date: July 3, 2025
    Inventor: Han-Chun Lin
  • Patent number: 12349589
    Abstract: A compound comprising a ligand LA comprising a moiety L having a structure of Formula I is provided. In Formula I, LA coordinated to a metal M; A1 is selected from B, N, P, P?O, P?S, Al, Ga, SiR?, GeR?, and SnR?; where rings A, B, and C are 5- or 6-membered rings; Y1, Y2, and Y3 are selected from direct bonds, the metal M, and a variety of linkers; a+b+c=2 or 3; and one of a number of specific conditions is met. OLED devices, consumer products, and formulations including the compound are also provided.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: July 1, 2025
    Assignee: UNIVERSAL DISPLAY CORPORATION
    Inventors: Morgan C. Macinnis, Hsiao-Fan Chen, Tyler Fleetham, Peter Wolohan, Jerald Feldman, Jui-Yi Tsai, Pierre-Luc T. Boudreault, Alexey Borisovich Dyatkin, Zhiqiang Ji, Sean Michael Ryno, Rasha Hamze, Chun Lin, Elena Sheina
  • Patent number: 12347997
    Abstract: The present disclosure provides a method for aligning a master oscillator power amplifier (MOPA) system. The method includes ramping up a pumping power input into a laser amplifier chain of the MOPA system until the pumping power input reaches an operational pumping power input level; adjusting a seed laser power output of a seed laser of the MOPA system until the seed laser power output is at a first level below an operational seed laser power output level; and performing a first optical alignment process to the MOPA system while the pumping power input is at the operational pumping power input level, the seed laser power output is at the first level, and the MOPA system reaches a steady operational thermal state.
    Type: Grant
    Filed: April 26, 2024
    Date of Patent: July 1, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Lin Louis Chang, Henry Tong Yee Shian, Alan Tu, Han-Lung Chang, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng
  • Publication number: 20250209336
    Abstract: Disclosed are methods and devices of processing cytometric data. The present disclosure provides a method of processing cytometric data. The method comprises: dividing a first data matrix into a first plurality of first submatrices; encoding each of the first submatrices into one corresponding vector representation to acquire a first plurality of vector representations; and aggregating the first plurality of vector representations into a first ensemble representation. The first data matrix is indicative of a first plurality of properties of a first set of cells.
    Type: Application
    Filed: March 29, 2023
    Publication date: June 26, 2025
    Applicants: AHEAD MEDICINE CORP, AHEAD INTELLIGENCE LTD.
    Inventors: Chi-Chun Lee, Bor-Sheng Ko, Yu-Fen Wang, Jeng-Lin Li, Yun-Chun Lin
  • Publication number: 20250207019
    Abstract: Novel Iridium complexes having three different bidentate ligands useful for phosphorescent emitters in OLEDs are disclosed. At least one of the three different bidentate ligands is a carbene ligand.
    Type: Application
    Filed: February 7, 2025
    Publication date: June 26, 2025
    Applicant: Universal Display Corporation
    Inventors: Jui-Yi TSAI, Chuanjun XIA, Chun LIN, Adrian U. PALACIOS, Enrique OÑATE, Miguel A. ESTERUELAS, Pierre-Luc T. BOUDREAULT, Sonia BAJO, Montserrat OLIVAN
  • Publication number: 20250212484
    Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a first source contact, a drain contact, and a first gate structure disposed over a substrate. The first gate structure is between the first source contact and the drain contact along a first direction. The first gate structure surrounds the first source contact. An isolation region is disposed within the substrate and surrounds an active area. A second gate structure surrounds a second source contact. The second gate structure is separated from the first gate structure by the drain contact. Both the first gate structure and the second gate structure are at least partially within the active area.
    Type: Application
    Filed: March 13, 2025
    Publication date: June 26, 2025
    Inventors: Aurelien Gauthier Brun, Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen, Yun-Hsiang Wang
  • Patent number: 12341439
    Abstract: A configurational structure of a unidirectional/bidirectional AC/DC power supply includes: a case, having a first lateral wall and a second lateral wall at two transverse sides thereof and defining a front wall and a back wall at two longitudinal sides thereof; a first bus unit, being installed in the case and against the first lateral wall; a power factor correction (PFC) unit, being installed in the case and close to the front wall; three power module units, being installed abreast in the case, the power module units and located between the PFC unit and the back wall; a second bus unit, being installed on the back wall; and a control system unit, being installed in the case and against the second lateral wall. Thereby, with the sophisticated configuration and layout formed among the components, the resulting power supply has reduced distortion, enhanced performance, and improved efficiency.
    Type: Grant
    Filed: July 27, 2023
    Date of Patent: June 24, 2025
    Assignee: HONG LIU CO., LTD.
    Inventor: Mu-Chun Lin
  • Publication number: 20250203903
    Abstract: A semiconductor device structure and a formation method are provided. The method includes forming a fin structure over a substrate, and the fin structure has multiple sacrificial layers and multiple semiconductor layers laid out in an alternating manner. The method also includes forming a dummy gate stack extending across a portion of the fin structure and forming gate spacers over sidewalls of the dummy gate stack. The gate spacers extend across portions of the fin structure. The method further includes removing the dummy gate stack to form a trench exposing the portion of the fin structure and trimming the semiconductor layers exposed by the trench. Each of the semiconductor layers covered by the gate spacers becomes wider than each of the semiconductor layers that is trimmed. In addition, the method includes removing the sacrificial layers and forming a metal gate stack wrapped around the semiconductor layers.
    Type: Application
    Filed: January 3, 2024
    Publication date: June 19, 2025
    Inventors: Ta-Chun LIN, Jhon-Jhy LIAW
  • Publication number: 20250204007
    Abstract: The invention provides a semiconductor structure, which comprises a substrate, a high-voltage device region is defined on the substrate, in the high-voltage device region, the substrate comprises a first region, a first groove surrounds the first region, and a second region surrounds the first groove, and a contact gate structure is located in the high-voltage device region, when viewed from a top view, the contact gate structure comprises a plurality of columnar dielectric layers arranged in an array.
    Type: Application
    Filed: January 16, 2024
    Publication date: June 19, 2025
    Applicant: United Microelectronics Corp.
    Inventors: Chun-Wen Cheng, Ming-Hua Tsai, Chun-Lin Chen, Ming-Hsiang Tu, Ya-Hsin Huang, Yung-Fang Yang
  • Publication number: 20250203069
    Abstract: A video decoding method includes: receiving an encoded video bitstream, and decoding a first block. The encoded video bitstream includes data to be decoded as the first block of pixels in a picture, and the first block includes a luma block and at least one chroma block. Decoding the first block includes: determining whether to apply a neural network (NN) filter on the luma block and the at least one chroma block according to an NN filter mode of the luma block and at least one NN filter mode of the at least one chroma block.
    Type: Application
    Filed: February 4, 2024
    Publication date: June 19, 2025
    Applicant: MEDIATEK INC.
    Inventors: Wen-Chun Lin, Ching-Yeh Chen, Tzu-Der Chuang
  • Publication number: 20250202349
    Abstract: Bonding a full-bridge device and an LLC device in a stack, or forming the full-bridge device and the LLC device on a same substrate, rather than connecting the devices, reduces a chip area associated with a power converter including the full-bridge device and the LLC device. Additionally, the full-bridge device and the LLC device consume less power because parasitic inductance and capacitance are reduced. Additionally, raw materials and production time are conserved that would otherwise have been used to connect the full-bridge device and the LLC device (e.g., via wires).
    Type: Application
    Filed: February 26, 2025
    Publication date: June 19, 2025
    Inventors: Yen-Ku LIN, Ru-Yi SU, Haw-Yun WU, Chun-Lin TSAI
  • Publication number: 20250194750
    Abstract: An adjustment system for an article of footwear includes a body attached to an outer surface of the article of footwear and including a plurality of segments cooperating to define a chamber, the body movable between an elongated state and a collapsed state and a bladder attached to the article of footwear and defining an interior void in fluid communication with the chamber, the bladder movable from a relaxed state to a constricted state when the body is moved from the collapsed state to the elongated state.
    Type: Application
    Filed: December 16, 2024
    Publication date: June 19, 2025
    Applicant: NIKE, Inc.
    Inventors: Austin J. Orand, Yen-Lin Lee, To-Chun Lin, Chih-Ta Chien, Richard Kristian Hansen, Chia-Chi Lin, Kimberly A. Sokol
  • Publication number: 20250203063
    Abstract: A system with integration of a flat display and a floating-image display and an operating method are provided. The system includes a flat display module and a floating-image display module. In an initialization procedure, a signal channel is established between the flat display module and the floating-image module. The flat display module displays a 2D image according to a flat display signal. A floating-image display signal is generated according to a control instruction, and accordingly a floating-image display is used to display a floating image. After that, the floating-image display module receives an interaction instruction that is calculated when the floating-image display module receives a signal generated by manipulating the floating image. The floating-image display module updates the floating image according to the interaction instruction, and the flat display module correspondingly displays another 2D image.
    Type: Application
    Filed: December 17, 2024
    Publication date: June 19, 2025
    Inventors: CHUN-HSIANG YANG, CHUN-LIN LIN, YUNG-CHENG CHENG, CHIH-HUNG TING, CHIH-WEI SHIH
  • Publication number: 20250204238
    Abstract: Provided are compounds having a first ligand LA having a structure of Formula I: that are useful in OLED application and provide improved OLED properties.
    Type: Application
    Filed: December 15, 2023
    Publication date: June 19, 2025
    Applicant: UNIVERSAL DISPLAY CORPORATION
    Inventors: Geza SZIGETHY, Scott BEERS, Chun LIN, Eric A. MARGULIES, Ivan MILAS, Nicholas J. THOMPSON, Henry Carl HERBOL, Zhiqiang JI
  • Publication number: 20250204144
    Abstract: Provided is a pixel arrangement of a device comprising at least one pixel, wherein the at least one pixel comprises: a first subpixel comprising a first OLED (1) comprising an emissive region ER11 as described herein; a second subpixel comprising a second OLED (2) comprising an emissive region ER21 as described herein. Also provided is an organic light emitting device (OLED) (5) comprising: an anode; an emissive region ER11? and an emissive region ER21? disposed over the anode and separated by a charge generation layer (CGL); and a cathode disposed over the ER11? and ER21? as described herein. The present disclosure further provides a consumer product comprising a pixel arrangement or an OLED (5) as described herein.
    Type: Application
    Filed: March 6, 2025
    Publication date: June 19, 2025
    Applicant: Universal Display Corporation
    Inventors: Michael S. WEAVER, Tyler FLEETHAM, Nicholas J. THOMPSON, Chun LIN, Jerald FELDMAN
  • Patent number: 12334434
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: August 2, 2023
    Date of Patent: June 17, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 12336427
    Abstract: Provided is an OLED that includes, sequentially: an anode; a first emissive region; and a cathode; wherein the first emissive region comprises: a first compound; and a second compound; wherein the first compound is capable of functioning as a perovskite emitter in an OLED; wherein the second compound is capable of functioning as an emitter in an OLED, wherein the second compound is selected from the group consisting of phosphorescent emitters, fluorescent emitters, and delayed fluorescent emitters.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: June 17, 2025
    Assignee: UNIVERSAL DISPLAY CORPORATION
    Inventors: Chun Lin, Nicholas J. Thompson
  • Publication number: 20250193758
    Abstract: A mobility pattern-based cell change control method includes collecting network signal quality information of at least one historic time series, predicting an area type of a user device according to the network signal quality information of the at least one historic time series, restricting mobility of the user device when the area type of the user device is predicted to be in an intensive cell change state, and switching the mobility of the user device from a current serving cell to at least one significantly better cell or forcing the user device to remain on the current serving cell after the mobility of the user device has been restricted.
    Type: Application
    Filed: December 2, 2024
    Publication date: June 12, 2025
    Applicant: MEDIATEK INC.
    Inventors: Wan-Ting Huang, Po-Wen Hsiao, Yung-Chun Lin
  • Publication number: 20250192105
    Abstract: A 3D stack package structure includes a first chip, a second chip, a through-silicon via (TSV), and a multi-layer protective structure. The second chip is bonded to the first chip. The second chip includes an interconnect structure composed of multiple metal layers and a plurality of vias respectively connecting upper and lower layers of the multiple metal layers. The TSV extends through the second chip. The multi-layer protective structure is disposed within the second chip and surrounds the TSV. The multi-layer protective structure includes: multiple protective layers, each having an opening for passage of the TSV; and a plurality of sealing rings, respectively connecting upper and lower layers of the multiple protective layers and surrounding the TSV.
    Type: Application
    Filed: December 13, 2023
    Publication date: June 12, 2025
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Yu-Chang Lin, Pei-Rong Ni, Chun-Lin Lu, Sheng Chieh Lin, Yung-Hsiang Chang
  • Patent number: 12325719
    Abstract: A compound including a first ligand LA of is disclosed. In the structure of Formula I, one of L1 and L2 is C, and the other is N; Y1 to Y14 are each C or N; at least two adjacent Y7, Y8, Y9, and Y10 are carbon atoms that are fused to a structure of Z1 and Z2 are each O, S, Se, NR, CRR?, or SiRR?; and each R, R?, RA, RB, RC, and RD is hydrogen or a substituent; and any two substituents may be joined or fused together to form a ring. In the compound, LA is complexed to a metal M by L1 and L2, and M has an atomic weight greater than 40. Organic light emitting devices and consumer products containing the compounds are also disclosed.
    Type: Grant
    Filed: November 29, 2023
    Date of Patent: June 10, 2025
    Assignee: UNIVERSAL DISPLAY CORPORATION
    Inventors: Zhiqiang Ji, Jui-Yi Tsai, Alexey Borisovich Dyatkin, Chun Lin