Patents by Inventor Chun-Ling Lin

Chun-Ling Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240033521
    Abstract: A nerve stimulation system includes an electrode, an electrode controlling device coupled to the electrode and configured to control the electrode to electrically stimulate a peripheral nerve according to a nerve stimulation signal, and a signal generating device coupled to the electrode controlling device and configured to generate the nerve stimulation signal. The nerve stimulation signal is a signal with a square envelope. The square envelope periodically includes an on-time period with a pulse amplitude and an off-time period without the pulse amplitude, and a ratio of the on-time period and the off-time period is not less than 1, and a length of the off-time period is not longer than 5 seconds.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 1, 2024
    Inventors: Yuan-Yu Hsueh, Wentai Liu, Szu Han Chen, Wan-Ling Tseng, CHUN-WEI LIN
  • Publication number: 20240014043
    Abstract: A method of fabricating a semiconductor device is described. A substrate is provided. A first semiconductor region of a first semiconductor material is formed over the substrate and adjacent a second semiconductor region of a second semiconductor material. The first and second semiconductor regions are crystalline. An etchant is selective to etch the first semiconductor region over the second semiconductor region. The entire first semiconductor region is implanted to form an amorphized semiconductor region. The amorphized semiconductor region is etched with the etchant using the second semiconductor region as a mask to remove the amorphized semiconductor region without removing the second semiconductor region.
    Type: Application
    Filed: August 10, 2023
    Publication date: January 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Ling Chung, Chun-Chih Cheng, Shun-Wu Lin, Ming-Hsi Yeh, Kuo-Bin Huang
  • Patent number: 11854816
    Abstract: A method of fabricating a semiconductor device is described. A substrate is provided. A first semiconductor region of a first semiconductor material is formed over the substrate and adjacent a second semiconductor region of a second semiconductor material. The first and second semiconductor regions are crystalline. An etchant is selective to etch the first semiconductor region over the second semiconductor region. The entire first semiconductor region is implanted to form an amorphized semiconductor region. The amorphized semiconductor region is etched with the etchant using the second semiconductor region as a mask to remove the amorphized semiconductor region without removing the second semiconductor region.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Ling Chung, Chun-Chih Cheng, Shun Wu Lin, Ming-Hsi Yeh, Kuo-Bin Huang
  • Publication number: 20230395976
    Abstract: An antenna structure includes a first signal source, a second signal source, a first radiator, a second radiator, a third radiator, a first circuit, and a second circuit. The first signal source is used to generate a first wireless signal, and the second signal source is used to generate a second wireless signal. The first radiator is coupled to the first signal source to receive the first wireless signal, and the second radiator is coupled to the second signal source to receive the second wireless signal. The first circuit has a first end coupled to the third radiator and a second end coupled to the first radiator or the first signal source. The second circuit has a first end coupled to the third radiator and a second end coupled to the second radiator or the second signal source.
    Type: Application
    Filed: August 18, 2023
    Publication date: December 7, 2023
    Applicant: HTC Corporation
    Inventors: Cheng-Hung Lin, Szu-Po Wang, Chia-Te Chien, Chun-Chieh Wang, Kang-Ling Li, Chun-Hsien Lee, Yu-Chieh Chiu
  • Publication number: 20230369764
    Abstract: A mobile device includes a housing, a first radiation element, a second radiation element, a third radiation element, a first switch element, and a second switch element. The first radiation element has a first feeding point. The second radiation element has a second feeding point. The first radiation element, the second radiation element, and the third radiation element are distributed over the housing. The first switch element is closed or open, so as to selectively couple the first radiation element to the third radiation element. The second switch element is closed or open, so as to selectively couple the second radiation element to the third radiation element. An antenna structure is formed by the first radiation element, the second radiation element, and the third radiation element.
    Type: Application
    Filed: May 12, 2022
    Publication date: November 16, 2023
    Applicant: HTC Corporation
    Inventors: Cheng-Hung LIN, Szu-Po WANG, Chia-Te CHIEN, Chun-Chieh WANG, Kang-Ling LI, Chun-Hsien LEE, Yu-Chieh CHIU
  • Publication number: 20230318204
    Abstract: A communication device includes a nonconductive track, an antenna element, a first turning wheel, and a second turning wheel. The antenna element is disposed on the nonconductive track. The first turning wheel and the second turning wheel drive the nonconductive track according to a control signal, so as to adjust the position of the antenna element. The communication device provides an almost omnidirectional radiation pattern.
    Type: Application
    Filed: April 4, 2022
    Publication date: October 5, 2023
    Applicant: HTC Corporation
    Inventors: Cheng-Hung LIN, Szu-Po WANG, Chia-Te CHIEN, Chun-Chieh WANG, Kang-Ling LI, Chun-Hsien LEE, Yu-Chieh CHIU
  • Patent number: 11777212
    Abstract: An antenna structure includes a first signal source, a second signal source, a first radiator, a second radiator, a third radiator, a first circuit, and a second circuit. The first signal source is used to generate a first wireless signal, and the second signal source is used to generate a second wireless signal. The first radiator is coupled to the first signal source to receive the first wireless signal, and the second radiator is coupled to the second signal source to receive the second wireless signal. The first circuit has a first end coupled to the third radiator and a second end coupled to the first radiator or the first signal source. The second circuit has a first end coupled to the third radiator and a second end coupled to the second radiator or the second signal source.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: October 3, 2023
    Assignee: HTC Corporation
    Inventors: Cheng-Hung Lin, Szu-Po Wang, Chia-Te Chien, Chun-Chieh Wang, Kang-Ling Li, Chun-Hsien Lee, Yu-Chieh Chiu
  • Publication number: 20230263402
    Abstract: A method for detecting a particular syndrome based on hemodynamic analysis that includes steps of: obtaining a piece of hemodynamic data representing a hemodynamic waveform; performing moving average (MA) filtering on the hemodynamic waveform to obtain a filtered waveform; determining troughs in order to determine waveform segments of the filtered waveform; determining smoothness of the waveform segments; and determining a relation between the hemodynamic waveform and a particular syndrome based on the smoothness of the waveform segments, and generating a detection result.
    Type: Application
    Filed: June 23, 2022
    Publication date: August 24, 2023
    Applicants: Giant Power Technology Biomedical Corp., National Taipei University of Technology
    Inventors: CHIEN-JEN WANG, Po-En Liu, Shu-Hung Chao, Ming-Kun Huang, Ing-Lan Liou, Chun- Young Chang, Chin-Kun Tseng, Zi-Yi Zhuang, Ya-Wen Chao, Hsuan-Yu Liu, Gu-Neng Wu, Chun-Ling Lin, Yuh-Shyan Hwang, San-Fu Wang, I-Chyn Wey, Jason King
  • Publication number: 20230263467
    Abstract: A method for detecting a particular syndrome based on hemodynamic analysis that includes steps of: obtaining a piece of hemodynamic data representing a hemodynamic waveform; performing moving average (MA) filtering on the hemodynamic waveform to obtain a filtered waveform; determining troughs in order to determine waveform segments of the filtered waveform; determining systolic peaks for determining first and second portions of the waveform segments; determining smoothness of the second portions; and determining a relation between the hemodynamic waveform and a particular syndrome based on the smoothness of the second portions, and generating a detection result.
    Type: Application
    Filed: June 23, 2022
    Publication date: August 24, 2023
    Applicants: Giant Power Technology Biomedical Corp., National Taipei University of Technology
    Inventors: Po-En Liu, Shu-Hung Chao, Ming-Kun Huang, Chien-Jen Wang, Ing-Lan Liou, Chun- Young Chang, Chin-Kun Tseng, Zi-Yi Zhuang, Ya-Wen Chao, Hsuan-Yu Liu, Gu-Neng Wu, Chun-Ling Lin, Yuh-Shyan Hwang, San-Fu Wang, I-Chyn Wey, Jason King
  • Publication number: 20230238364
    Abstract: An electronic device is provided in this disclosure. In some embodiments, the electronic device includes a first substrate and a second substrate adjacent to the first substrate. In some embodiments, the electronic device includes a plurality of organic light emitting diodes, a filter layer, and a third substrate. At least a part of the plurality of organic light emitting diodes are disposed on the first substrate. The filter layer is disposed at least on the second substrate. The third substrate is disposed corresponding to the first substrate and the second substrate. The plurality of organic light emitting diodes and the filter layer are disposed under the third substrate.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Applicant: InnoLux Corporation
    Inventors: Wan-Ling Huang, Chun-Hsien Lin, Yi-An Chen, Tsau-Hua Hsieh
  • Publication number: 20230238445
    Abstract: A high electron mobility transistor (HEMT) includes a substrate, a channel layer, a barrier layer and a passivation layer. A contact structure is disposed on the passivation layer and extends through the passivation layer and the barrier layer to directly contact the channel layer. The contact structure includes a metal layer, and the metal layer includes a metal material doped with a first additive. A weight percentage of the first additive in the metal layer is between 0% and 2%.
    Type: Application
    Filed: February 20, 2022
    Publication date: July 27, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ko-Wei Lin, Chun-Chieh Chiu, Chun-Ling Lin, Shu Min Huang, Hsin-Fu Huang
  • Publication number: 20230218268
    Abstract: A method for detecting a location of a segment of a feeding tube is provided. The feeding tube has a proximal end, a hollow tube body and a distal end, and is placed inside the body of a patient. An audio collecting component is placed on a predetermined part of the patient. The method includes steps of pumping air into the proximal end of the feeding tube, collecting sound to obtain audio data by the audio collecting component, performing audio analysis on the audio data, and determining whether a segment of the hollow tube body is at a part inside the body of the patient that corresponds with the location of the audio collecting component based on result of the audio analysis.
    Type: Application
    Filed: June 3, 2022
    Publication date: July 13, 2023
    Inventors: Ming-Kun Huang, Chien-Jen Wang, Po-En Liu, Shu-Hung Chao, Ing-Lan Liou, Chun- Young Chang, Chin-Kun Tseng, Zi-Yi Zhuang, Ya-Wen Chao, Hsuan-Yu Liu, Gu-Neng Wu, Chun-Ling Lin, Yuh-Shyan Hwang, San-Fu Wang, I-Chyn Wey, Jason King
  • Publication number: 20230201266
    Abstract: The present disclosure provides a method for treating arthritis by using a stem cell preparation. The stem cell preparation of the present disclosure can effectively delay cartilage degeneration caused by arthritis, and it is confirmed by whole blood analysis and blood biochemical analysis that the stem cell preparation in the form of three-dimensional stem cell spheres provides a safe treatment for arthritis. The present disclosure also provides a method for preparing the stem cell preparation.
    Type: Application
    Filed: September 9, 2021
    Publication date: June 29, 2023
    Inventors: Feng-Huei Lin, Che-Yung Kuan, Yu-Ying Lin, Ching-Yun Chen, Zhi-Yu Chen, I-Hsuan Yang, Ming-Hsi Chuang, Po-Cheng Lin, Chia-Hsin Lee, Kai-Ling Zhang, Pei-Syuan Chao, Wan-Sin Syu, Chun-Hung Chen, Ting-Ju Wang
  • Publication number: 20230170354
    Abstract: The disclosure provides an electronic device including a substrate, an electronic element, a driving element, a first trace, a second trace, a conductive pattern, and an electrostatic discharge protection element. The substrate includes a first surface, a second surface, and a third surface. The third surface connects to the first surface and the second surface. The electronic element is disposed on the first surface. The driving element is disposed on the second surface. The first traces are disposed on the first surface. The second traces are disposed on the second surface and are electrically connected to the driving element, and the corresponding first traces are electrically connected to the corresponding second traces. The conductive pattern is electrically connected to the driving element and receives a grounding voltage or is floating. The electrostatic discharge protection element is disposed on the first surface and is electrically connected to the driving element.
    Type: Application
    Filed: November 3, 2022
    Publication date: June 1, 2023
    Applicant: Innolux Corporation
    Inventors: Wan-Ling Huang, Chun-Hsien Lin
  • Patent number: 11664354
    Abstract: An electronic device is provided in this disclosure. In some embodiments, the electronic device includes two display panels, a first filling element, and a second filling element. The two display panels adjoin each other. The first filling element and the second filling element are disposed between the two display panels, and a material of the first filling element is different from a material of the second filling element. In some embodiments, the electronic device includes a protection substrate, two light emitting plates, and a filling element. The two light emitting plates adjoin each other. The protection substrate is disposed corresponding to the two light emitting plates, and the two light emitting plates emit light towards the protection substrate. The filling element is disposed between the two light emitting plates.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: May 30, 2023
    Assignee: InnoLux Corporation
    Inventors: Wan-Ling Huang, Chun-Hsien Lin, Yi-An Chen, Tsau-Hua Hsieh
  • Publication number: 20200168450
    Abstract: A method for fabricating interconnect of semiconductor device. The method includes providing a base substrate, having an inter-layer dielectric layer on top. A copper interconnect structure is formed in the inter-layer dielectric layer. A pre-sputter clean process is performed with hydrogen radicals on the copper interconnect structure. A degas process is sequentially performed on the copper interconnect structure. A cobalt cap layer is formed on the copper interconnect structure.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 28, 2020
    Applicant: United Microelectronics Corp.
    Inventors: Ko-Wei Lin, Kuan-Hsiang Chen, Hsin-Fu Huang, Chun-Ling Lin, Sheng-Yi Su, Pei-Hsun Kao
  • Patent number: 10446489
    Abstract: An interconnect structure includes a dielectric layer and a conductor embedded in the dielectric layer. A top surface of the conductor is flush with a top surface of the dielectric layer. A cobalt cap layer is deposited on the top surface of the conductor. A nitrogen-doped cobalt layer is disposed on the cobalt cap layer.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: October 15, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su
  • Patent number: 10323332
    Abstract: An electrical chemical plating process is provided. A semiconductor structure is provided in an electrical plating platform. A pre-electrical-plating step is performed wherein the pre-electrical-plating step is carried out under a fixed voltage environment and lasts for 0.2 to 0.5 seconds after the current is above the threshold current of the electrical plating platform. After the pre-electrical-plating step, a first electrical plating step is performed on the semiconductor structure.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: June 18, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Ling Lin, Yen-Liang Lu, Chi-Mao Hsu, Chin-Fu Lin, Chun-Hung Chen, Tsun-Min Cheng, Chi-Ray Tsai
  • Publication number: 20190067184
    Abstract: An interconnect structure includes a dielectric layer and a conductor embedded in the dielectric layer. A top surface of the conductor is flush with a top surface of the dielectric layer. A cobalt cap layer is deposited on the top surface of the conductor. A nitrogen-doped cobalt layer is disposed on the cobalt cap layer.
    Type: Application
    Filed: October 25, 2018
    Publication date: February 28, 2019
    Inventors: Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su
  • Patent number: 10153231
    Abstract: An interconnect structure includes a dielectric layer and a conductor embedded in the dielectric layer. A top surface of the conductor is flush with a top surface of the dielectric layer. A cobalt cap layer is deposited on the top surface of the conductor. A nitrogen-doped cobalt layer is disposed on the cobalt cap layer.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: December 11, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ko-Wei Lin, Hung-Miao Lin, Chun-Ling Lin, Ying-Lien Chen, Huei-Ru Tsai, Sheng-Yi Su