Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.

Abstract: A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.

Abstract: A heat transferring module includes a first conductor plate, a second conductor plate, a working fluid and a reinforcing layer. The second conductor plate is connected to the first conductor plate to form a cavity. The working fluid is located in the cavity. The reinforcing layer is formed on an outer surface of at least one of the first conductor plate and the second conductor plate, wherein at least one of the first conductor plate and the second conductor plate has a capillary structure. The capillary structure is located on an inner surface of at least one of the first conductor plate and the second conductor plate, and a structural strength of the reinforcing layer is greater than a structural strength of the first conductor plate and a structural strength of the second conductor plate. In addition, a manufacturing method of a heat transferring module is also provided.

Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing has a first gap communicating the inner surface and the outer surface, and the metallic housing further includes a second gap and at least one connecting terminal. The first non-conductive spacer is selectively disposed in the first gap of the metallic housing, and extends from a first side of the lateral sides of the metallic housing to the back side of the metallic housing.

Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, the outer surface of the metallic housing is dyed, the inner surface is substantially a recessed structure, and the metallic housing has a first gap communicating the inner surface and the outer surface, wherein the metallic housing further comprises at least one connecting terminal. The first non-conductive spacer, disposed in the first gap of the metallic housing.

Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the metallic housing. A non-conductive layer is formed on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures. The outer surface of the metallic housing is dyed to form the casing of the electronic device. A casing of an electronic device is also provided.

Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, the outer surface of the metallic housing is dyed, the inner surface is substantially a recessed structure, and the metallic housing has a first gap communicating the inner surface and the outer surface, wherein the metallic housing further comprises at least one connecting terminal. The first non-conductive spacer, disposed in the first gap of the metallic housing.

Abstract: A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface. A plurality of apertures are formed on the inner surface of the metallic housing. A non-conductive layer is formed on the inner surface of the metallic housing, and part of the non-conductive layer is extended into the apertures. The outer surface of the metallic housing is dyed to form the casing of the electronic device. A casing of an electronic device is also provided.

Abstract: The present invention discloses a low-temperature co-precipitation method for fabricating TCO powders, which comprises steps: respectively dissolving two or more metals/metal salts in solvents to obtain metal ion solutions; mixing the metal ion solutions to form a precursor solution having a specified composition; enabling a co-precipitation reaction at a temperature lower than 45° C. via adding precipitant in two stages, controlling the temperature of precipitation reactions and undertaking aging processes; flushing, filtering, drying and calcining the precipitates to obtain TCO powders having a specified composition and improved quality.

Abstract: The invention relates to a solar photovoltaic energy conversion apparatus. The apparatus consists of a substrate, a buffer layer formed on the substrate layer, a first transparent conductive oxide layer formed on the buffer layer, periodic protrusions containing first silicon layers formed on the first transparent conductive oxide layer, second silicon layers formed on the first silicon layers, a second transparent conductive oxide layer covering the first silicon layers, the second silicon layers and the first transparent conductive oxide layer, and an anti-reflective protective layer. The first silicon layer and the second silicon layer are the electrodes with the opposite type of charge carriers. The first transparent conductive layer and the second transparent conductive layer are the electrodes with the opposite type of charge carriers. This TCO-based hybrid solar photovoltaic energy conversion device not only can allow the transmission of visible sunlight but also can enhance the photovoltaic energy.

Abstract: An illuminant transparent solar cell device, comprising a transparent substrate and the following layers disposed from bottom up sequentially on the transparent substrate: a transparent fluorescent layer, a p-type transparent conductive oxide layer, an intrinsic-type transparent conductive oxide layer, a n-type transparent conductive oxide layer, and an anti-reflection layer serving as a protection layer. In the illuminant transparent solar cell device, the characteristics of a p-type and an n-type transparent conductive oxide layers as well as a transparent fluorescent layer are utilized so that sunlight can not only be used to provide natural lighting in daytime but also be used to generate electricity which is stored in an electricity storage device by transmitting through this device while the electricity stored therein can be used to provide indoor lighting at night, thus saving the consumption of fossil fuel energy.

Abstract: The invention relates to a solar photovoltaic energy conversion apparatus. The apparatus consists of a substrate, a buffer layer formed on the substrate layer, a first transparent conductive oxide layer formed on the buffer layer, periodic protrusions containing first silicon layers formed on the first transparent conductive oxide layer, second silicon layers formed on the first silicon layers, a second transparent conductive oxide layer covering the first silicon layers, the second silicon layers and the first transparent conductive oxide layer, and an anti-reflective protective layer. The first silicon layer and the second silicon layer are the electrodes with the opposite type of charge carriers. The first transparent conductive layer and the second transparent conductive layer are the electrodes with the opposite type of charge carriers. This TCO-based hybrid solar photovoltaic energy conversion device not only can allow the transmission of visible sunlight but also can enhance the photovoltaic energy.