Patents by Inventor Chun-Lung Lin

Chun-Lung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200025215
    Abstract: A fan has a fan housing and an impeller mounted in the fan housing. The fan housing has a main case, and a foamed metal plate securely mounted in an air inlet of the main case. Hot air inhaled into the main case is forced to flow through pores in the foamed metal plate. Thus, heat in the hot air is conducted to the foamed metal plate and then to the main case. The heat in the hot air is dissipated to reduce temperature of the hot air in advance. Accordingly, heat dissipation efficiency of the fan is improved. Since the foamed metal plate hinders flow of the hot air, the hot air flowing into the main case is reduced. Therefore, air pressure and flowing speed of the hot air flowing into the main case is reduced, such that noise made by the fan is also reduced.
    Type: Application
    Filed: October 26, 2018
    Publication date: January 23, 2020
    Inventors: Fu-Lung Lin, Chun-Hsien Chen, Tongxian Chen
  • Publication number: 20200013674
    Abstract: A semiconductor device is disclosed. The device includes a source/drain feature formed over a substrate. A dielectric layer formed over the source/drain feature. A contact trench formed through the dielectric layer to expose the source/drain feature. A titanium nitride (TiN) layer deposited in the contact trench and a cobalt layer deposited over the TiN layer in the contact trench.
    Type: Application
    Filed: September 16, 2019
    Publication date: January 9, 2020
    Inventors: Chun-Hsien Huang, Hong-Mao Lee, Hsien-Lung Yang, Yu-Kai Chen, Wei-Jung Lin
  • Publication number: 20200013235
    Abstract: A method and an apparatus for processing patches of a point cloud are provided. The apparatus includes an input/output (I/O) device, a storage device, and a processor. The I/O device is used to receive a bit stream of the point cloud. The storage device is configured to store an index table recording indexes corresponding to a plurality of orientations. The processor is coupled to the I/O device and the storage device and is configured to execute a program to demultiplex the bit stream of the point cloud into a patch image and indexes corresponding to a plurality of patches in the patch image, look up the index table obtain an orientation of each patch, transform the patch image according to the orientation to recover the plurality of patches of the point cloud, and reconstruct the point cloud by using the recovered patches.
    Type: Application
    Filed: July 3, 2019
    Publication date: January 9, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Yi-Ting Tsai, Chun-Lung Lin, Ching-Chieh Lin
  • Publication number: 20200006410
    Abstract: A method includes etching a semiconductor substrate to form a trench, filling a dielectric layer into the trench, with a void being formed in the trench and between opposite portions of the dielectric layer, etching the dielectric layer to reveal the void, forming a diffusion barrier layer on the dielectric layer, and forming a high-reflectivity metal layer on the diffusion barrier layer. The high-reflectivity metal layer has a portion extending into the trench. A remaining portion of the void is enclosed by the high-reflectivity metal layer.
    Type: Application
    Filed: September 4, 2018
    Publication date: January 2, 2020
    Inventors: Ming-Chi Wu, Chun-Chieh Fang, Bo-Chang Su, Chien Nan Tu, Yu-Lung Yeh, Kun-Yu Lin, Shih-Shiung Chen
  • Publication number: 20200007862
    Abstract: A method of adaptive filtering for multiple reference line of intra prediction in video coding, a video encoding apparatus and video decoding apparatus therewith are provided in the disclosure. In the method of intra prediction in video coding, a method of adaptive filtering is used to dynamically determine operation of filtering is applied to input samples in the intra prediction or not, which can reduce the complexity of the intra prediction in video coding if multiple reference lines are used for the operation of the intra prediction, and also increase the efficiency of compressing performance of ultra-high resolution video.
    Type: Application
    Filed: June 28, 2019
    Publication date: January 2, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Ching-Chieh Lin, Chun-Lung Lin
  • Publication number: 20200007872
    Abstract: A video decoding method includes: receiving a coding value; and performing the following steps according to an index value of the coding value: collecting a plurality of reference samples, grouping the plurality of reference samples to generate at least one group, establishing a model of the at least one group, obtaining a target pixel from a target block, selecting a target group from the at least one group, and introducing a luminance value of the target pixel into a model of the target group to predict a chromaticity value of the target pixel.
    Type: Application
    Filed: June 19, 2019
    Publication date: January 2, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Sheng-Po WANG, Chun-Lung LIN, Ching-Chieh LIN, Chang-Hao YAU, Po-Han LIN
  • Patent number: 10524349
    Abstract: A printed circuit board with built-in vertical heat dissipation ceramic block, and an electrical assembly are disclosed. The electrical assembly includes the board and a plurality of electronic components. The printed circuit boards includes a dielectric material layer defining at least one through hole, at least one ceramic block corresponding to the through hole, at least one fixing portion for joining the ceramic block to the through hole of the dielectric material layer, a metal circuit layer provided on upper surfaces of the dielectric material layer and the ceramic block, and a high thermal conductivity layer provided on lower surfaces of the dielectric material layer and the ceramic block. The printed circuit board allows the location and size of the ceramic block to be modified according to requirements, so as to implement complicated circuit designs, achieve good effect of thermal conduction, control thermal conduction path, and reduce manufacturing cost.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: December 31, 2019
    Assignees: ICP Technology Co., Ltd., Xiamen Sentecee E&E Co., Ltd.
    Inventors: Ho-Chieh Yu, Cheng-Lung Liao, Chun-Yu Lin, Jason An-Cheng Huang
  • Patent number: 10510539
    Abstract: A method for forming a fin field effect transistor (FinFET) device structure is provided. The FinFET device structure includes a substrate and a first fin structure and a second fin structure extending above the substrate. The FinFET device structure also includes a first transistor formed on the first fin structure and a second transistor formed on the second fin structure. The FinFET device structure further includes an inter-layer dielectric (ILD) structure formed in an end-to-end gap between the first transistor and the second transistor, and the end-to-end gap has a width in a range from about 20 nm to about 40 nm.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chang-Yin Chen, Tung-Wen Cheng, Che-Cheng Chang, Chun-Lung Ni, Jr-Jung Lin, Chih-Han Lin
  • Publication number: 20190353170
    Abstract: A method for controlling a fan in a fan start-up stage including a first time period and a second time period comprises the following steps of: during the first time period, continuously providing a first driving signal to drive the fan; and during the second time period, continuously providing a second driving signal to drive the fan; wherein, during the first time period the signal value (driving energy) of the first driving signal gradually decreases until being equal to the signal value of the second driving signal, and the signal value of the first driving signal is initially greater than the signal value of the second driving signal. A fan is also disclosed.
    Type: Application
    Filed: July 29, 2019
    Publication date: November 21, 2019
    Inventors: Yi-Fan LIN, Chung-Hung TANG, Cheng-Chieh LIU, Chun-Lung CHIU
  • Patent number: 10475742
    Abstract: A method of forming a semiconductor device structure includes: forming a first conductive structure over a substrate, the first conductive structure including twin boundaries; and wherein the forming the first conductive structure includes manipulating process conditions so as to promote formation of the twin boundaries resulting in a promoted density of twin boundaries such that the first conductive structure has an increased failure current density (FCD) relative to a baseline FCD of an otherwise substantially corresponding second conductive structure which has an unpromoted density of twin boundaries, the unpromoted density being less than the promoted density and such that the first conductive structure has a resistance which is substantially the same as the second conductive structure.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: November 12, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jian-Hong Lin, Chwei-Ching Chiu, Yung-Huei Lee, Chien-Neng Liao, Yu-Lun Chueh, Tsung-Cheng Chan, Chun-Lung Huang
  • Patent number: 10418279
    Abstract: A semiconductor device is disclosed. The device includes a source/drain feature formed over a substrate. A dielectric layer formed over the source/drain feature. A contact trench formed through the dielectric layer to expose the source/drain feature. A titanium nitride (TiN) layer deposited in the contact trench and a cobalt layer deposited over the TiN layer in the contact trench.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: September 17, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Hsien Huang, Hong-Mao Lee, Hsien-Lung Yang, Yu-Kai Chen, Wei-Jung Lin
  • Publication number: 20190281716
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing has a first gap communicating the inner surface and the outer surface, and the metallic housing further includes a second gap and at least one connecting terminal. The first non-conductive spacer is selectively disposed in the first gap of the metallic housing, and extends from a first side of the lateral sides of the metallic housing to the back side of the metallic housing.
    Type: Application
    Filed: May 29, 2019
    Publication date: September 12, 2019
    Applicant: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Patent number: 10390020
    Abstract: A video encoding method includes receiving a source video frame, dividing the source video frame into a coding tree unit, determining a coding unit from the coding tree unit, enabling or disabling a coding mode of the coding unit, determining, if the coding mode is enabled, whether to evaluate a size of a transform unit for the enabled coding mode, and determining a transform unit of the coding unit for the enabled coding mode, wherein the size of the coding unit is defined by a number (N) of samples.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: August 20, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yao-Jen Chang, Chun-Lung Lin, Jih-Sheng Tu, Ching-Chieh Lin
  • Patent number: 10369923
    Abstract: An operation method of an adaptive driving beam headlamp system includes: in response to receipt of a sequence of images, when it is determined that a nearby vehicle is in the sequence of images, determining whether the nearby vehicle is in a first condition moving in a direction opposite to a moving direction of a driving vehicle and approaching the driving vehicle, or is in a second condition moving ahead of the driving vehicle in the moving direction of the driving vehicle; calculating a area into which the nearby vehicle is projected to move based on whether the nearby vehicle is in the first or the second condition; and controlling a headlamp to dim a part of a high beam pattern that corresponds with the area.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: August 6, 2019
    Assignee: Automotive Research & Testing Center
    Inventors: Yi-Cheng Chen, Hung-Pang Lin, Yu-Lung Chang, Chun-Yao Shih
  • Publication number: 20190221548
    Abstract: In some embodiments, the present disclosure relates to a method of forming a multi-dimensional integrated chip. The method includes forming a first plurality of interconnect layers within a first dielectric structure on a front-side of a first substrate and forming a second plurality of interconnect layers within a second dielectric structure on a front-side of a second substrate. A first redistribution layer coupled to the first plurality of interconnect layers is bonded to a second redistribution layer coupled to the second plurality of interconnect layers along an interface. A recess is formed within a back-side of the second substrate and over the second plurality of interconnect layers. A bond pad is formed within the recess. The bond pad is laterally separated from the first redistribution layer by a non-zero distance.
    Type: Application
    Filed: March 28, 2019
    Publication date: July 18, 2019
    Inventors: Sin-Yao Huang, Chun-Chieh Chuang, Ching-Chun Wang, Sheng-Chau Chen, Dun-Nian Yaung, Feng-Chi Hung, Yung-Lung Lin
  • Patent number: 10356923
    Abstract: A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, the outer surface of the metallic housing is dyed, the inner surface is substantially a recessed structure, and the metallic housing has a first gap communicating the inner surface and the outer surface, wherein the metallic housing further comprises at least one connecting terminal. The first non-conductive spacer, disposed in the first gap of the metallic housing.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: July 16, 2019
    Assignee: HTC Corporation
    Inventors: Tim Chung-Ting Wu, Cheng-Chieh Chuang, Chi-Jen Lu, Chun-Lung Chu, Chien-Hung Lin
  • Publication number: 20190182503
    Abstract: A method and an image processing apparatus for video coding are proposed. The method is applicable to an image processing apparatus and includes the following steps. A current coding unit is received, and the number of control points of a current coding unit is set, where the number of control points is greater than or equal to 3. At least one affine model is generated based on the number of control points, and an affine motion vector corresponding to each of the at least one affine model is computed. A motion vector predictor of the current coding unit is computed based on the at least one motion vector so as to accordingly perform inter-prediction coding on the current coding unit.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 13, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Yi-Ting Tsai, Ching-Chieh Lin, Chun-Lung Lin
  • Publication number: 20190181174
    Abstract: A method for forming an image sensor device is provided. The method includes providing a semiconductor substrate including a front surface, a back surface opposite to the front surface, at least one light-sensing region close to the front surface, and a first trench surrounding the light-sensing region. The method includes forming an insulating layer over the back surface and in the first trench. A void is formed in the insulating layer in the first trench, and the void is closed. The method includes removing the insulating layer over the void to open up the void. The opened void forms a second trench partially in the first trench. The method includes filling a reflective structure in the second trench. The reflective structure has a light reflectivity ranging from about 70% to about 100%.
    Type: Application
    Filed: February 15, 2019
    Publication date: June 13, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Chieh FANG, Ming-Chi WU, Ji-Heng JIANG, Chi-Yuan WEN, Chien-Nan TU, Yu-Lung YEH, Shih-Shiung CHEN, Kun-Yu LIN
  • Patent number: 10319618
    Abstract: A metal recycling method comprises attaching a tape to a metal layer of a semiconductor structure; and separating a part of the metal layer from the semiconductor structure and transferring the part of the metal layer to the tape by a pressure difference.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: June 11, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Chun-Lung Tseng, Hung-Yao Lin, Hsin-Yi Wang, Chin-Kang Hu, Sheng-Hsiung Chuang
  • Publication number: 20190142488
    Abstract: A minimally invasive bone fracture positioning device includes a sleeve, a movable unit, and a support. The sleeve includes an alignment portion located on a longitudinal axis of the sleeve. The movable unit includes a positioning portion. The positioning portion is located on the longitudinal axis and is spaced from the alignment portion. The movable unit is mounted in a radial direction of the sleeve. The movable unit is slideable relative to the sleeve along the longitudinal axis. A support is coupled to the sleeve and the movable unit. The movable unit is spaced from the sleeve by the support.
    Type: Application
    Filed: November 16, 2017
    Publication date: May 16, 2019
    Inventors: Yue-Jun Wang, Chih-Hao Chang, Shih-Hua Huang, Chih-Lung Lin, Tung-Lin Tsai, Chun-Chieh Tseng, Li-Wen Weng