Patents by Inventor Chun-Lung Lin

Chun-Lung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120078753
    Abstract: A network business transaction system includes a foreground system and a background system. The foreground system has an order module. The background system has a commodity management module for sellers to share their own commodities with other sellers for consignment sale, and to share commodities of the other sellers in their own online stores for selling as agent for buyers to shop and purchase. When the commodity is owned by the seller, the commodity management module notifies the seller for account processing and commodity delivery processing. When the commodity is a commodity for consignment sale, the commodity management module notifies the original seller of the commodity who owned the commodity for account processing and commodity delivery processing. Therefore, each seller in the system can determine whether its commodities are willing to share with other sellers for consignment sale to ensure better product circulation.
    Type: Application
    Filed: September 21, 2011
    Publication date: March 29, 2012
    Inventor: CHUN LUNG LIN
  • Patent number: 7757627
    Abstract: An automatic coating device uses a driving motor and a conveyer to form a cyclically rotating module. An injector filled with a coating material is disposed on one side of the conveyer. When an object to be coated is disposed on the other side of the moving conveyer, the coating material is then applied onto the object by the injector. This can increase the coating speed and quality.
    Type: Grant
    Filed: December 15, 2006
    Date of Patent: July 20, 2010
    Assignee: Inventec Corporation
    Inventors: Yi-Lun Cheng, Feng-Ku Wang, Chun-Lung Lin, Chih-Kai Yang
  • Patent number: 7589969
    Abstract: A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.
    Type: Grant
    Filed: April 12, 2006
    Date of Patent: September 15, 2009
    Assignee: Inventec Corporation
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chun-Yi Chang, Jui-Chan Fan, Chun-Lung Lin, Chih-Kai Yang
  • Patent number: 7558062
    Abstract: A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: July 7, 2009
    Assignee: Inventec Corporation
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chun-Lung Lin, Chih-Kai Yang, Cheng-Shi Liu
  • Publication number: 20090016020
    Abstract: A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment.
    Type: Application
    Filed: September 5, 2007
    Publication date: January 15, 2009
    Applicant: INVENTEC CORPORATION
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chun-Lung Lin, Chih-Kai Yang, Cheng-Shi Liu
  • Patent number: 7436673
    Abstract: A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: October 14, 2008
    Assignee: Inventec Corporation
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Jui-Chan Fan, Chun-Yi Chang, Chun-Lung Lin, Chih-Kai Yang
  • Publication number: 20080130240
    Abstract: A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.
    Type: Application
    Filed: November 30, 2006
    Publication date: June 5, 2008
    Applicant: INVENTEC CORPORATION
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Jui-Chan Fan, Chun-Yi Chang, Chun-Lung Lin, Chih-Kai Yang
  • Patent number: 7339787
    Abstract: A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as well. Due to the hook design of the fan set and the ear design of the heat sink plate, the number of screws is reduced. Furthermore, the screws pass through the first lug of the heat sink plate and the second lug of the fan set, so that the heat sink plate and the fan set are fixed on the motherboard, and thereby the number of the parts to be fixed by screws is reduced. Heat from the heat source on the motherboard is conducted to the fan set to be dispersed through the heat sink plate extending to the heat source and covering the fan set.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: March 4, 2008
    Assignee: Inventec Corporation
    Inventors: Yi-Lun Cheng, Chun-Lung Lin, Feng-Ku Wang
  • Patent number: 7319592
    Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.
    Type: Grant
    Filed: April 11, 2006
    Date of Patent: January 15, 2008
    Assignee: Inventec Corporation
    Inventors: Frank Wang, Yi-Lun Cheng, Jui-Chan Fan, Chun-Yi Chang, Chun-Lung Lin, Chih-Kai Yang
  • Publication number: 20070243345
    Abstract: A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.
    Type: Application
    Filed: April 12, 2006
    Publication date: October 18, 2007
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Chun-Yi Chang, Jui-Chan Fan, Chun-Lung Lin, Chih-Kai Yang
  • Publication number: 20070242436
    Abstract: A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as well. Due to the hook design of the fan set and the ear design of the heat sink plate, the number of screws is reduced. Furthermore, the screws pass through the first lug of the heat sink plate and the second lug of the fan set, so that the heat sink plate and the fan set are fixed on the motherboard, and thereby the number of the parts to be fixed by screws is reduced. Heat from the heat source on the motherboard is conducted to the fan set to be dispersed through the heat sink plate extending to the heat source and covering the fan set.
    Type: Application
    Filed: April 14, 2006
    Publication date: October 18, 2007
    Inventors: Yi-Lun Cheng, Chun-Lung Lin, Feng-Ku Wang
  • Publication number: 20070240639
    Abstract: An injector with a coating head, for uniformly coating a heat sink paste onto a surface to be coated is provided, which includes a body, a piston, and a coating head, wherein the piston is pressed to force the heat sink paste out of the body through the coating head, and the heat sink paste is molded by the coating head into a shape suitable for uniformly coating the surface to be coated, and is also quantified. Moreover, a scraping surface is provided at the opening of the coating head, for scraping off the redundant heat sink paste from the steel plate and for smoothing the surface of the heat sink paste, in the case that a steel plate is used to assist the quantifying operation of the heat sink paste.
    Type: Application
    Filed: April 18, 2006
    Publication date: October 18, 2007
    Inventors: Frank Wang, Yi-Lun Cheng, Jui-Chan Fan, Chun-Yi Chang, Chun-Lung Lin, Chih-Kai Yang
  • Publication number: 20070235177
    Abstract: A heat conducting medium protection device is provided. At least one cutout is formed in a sheet, and the sheet is bent to closely engage the cutouts so as to transform the sheet into a three-dimensional shape and form an accommodating space. When the heat conducting medium protection device is covered on a heat sink coated with a heat conducting medium, the accommodating space accommodates the heat conducting medium for holding the heat conducting medium, thereby making it easy to transmit the heat sink coated with a heat conducting medium.
    Type: Application
    Filed: April 7, 2006
    Publication date: October 11, 2007
    Inventors: Feng-Ku Wang, Yi-Lun Cheng, Jui-Chan Fan, Chun-Yi Chang, Chun-Lung Lin, Chih-Kai Yang
  • Publication number: 20070237896
    Abstract: A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.
    Type: Application
    Filed: April 11, 2006
    Publication date: October 11, 2007
    Inventors: Frank Wang, Yi-Lun Cheng, Jui-Chan Fan, Chun-Yi Chang, Chun-Lung Lin, Chih-Kai Yang
  • Publication number: 20070236887
    Abstract: A heatsink module of heat-generating electronic elements on a circuit board is provided. The heatsink module is used to conduct and dissipate the heat generated by heat-generating electronic elements. The heatsink module includes a heat-conducting substrate contacting the heat-generating electronic elements. The heat-conducting substrate is locked on the heat-generating electronic element by a spring fastening. With die elastic force, the spring fastening can continuously press the heat-conducting substrate, such that the heat is conducted from the heat-generating electronic element to the heat-conducting substrate efficiently. Also, a heat pipe is disposed in the heat-conducting substrate, thus shortening the path between the heat pipe and the heat-generating electronic element for conducting heat, and increasing the contact area and improving the heat dissipation.
    Type: Application
    Filed: April 10, 2006
    Publication date: October 11, 2007
    Inventors: Yi-Lun Cheng, Chun-Lung Lin, Frank Wang
  • Publication number: 20070137565
    Abstract: An automatic coating device uses a driving motor and a conveyer to form a cyclically rotating module. An injector filled with a coating material is disposed on one side of the conveyer. When an object to be coated is disposed on the other side of the moving conveyer, the coating material is then applied onto the object by the injector. This can increase the coating speed and quality.
    Type: Application
    Filed: December 15, 2006
    Publication date: June 21, 2007
    Inventors: Yi-Lun Cheng, Feng-Ku Wang, Chun-Lung Lin, Chih-Kai Yang
  • Patent number: D516246
    Type: Grant
    Filed: November 3, 2004
    Date of Patent: February 28, 2006
    Assignee: Beauty First International Co., Ltd.
    Inventor: Chun-Lung Lin