Abstract: A system with sound adjustment capability is provided. The system includes a head-mounted device, a first loudspeaker and a processor. The first loudspeaker is detachable from the head-mounted device. The processor is configured to detect a plurality of positions and a plurality of orientations of the head-mounted device and the first loudspeaker to determine whether the first loudspeaker is detached from the head-mounted device. The processor is further configured to modify a first audio signal by at least one first filter or at least one second filter to generate a filtered first audio signal. The at least one first filter is used when the first loudspeaker is coupled to the head-mounted device, and the at least one second filter is used when the first loudspeaker is detached from the head-mounted device. The filtered first audio signal is configured to drive the first loudspeaker.

Abstract: A method for controlling a nail-striking operation of an electric nail gun is proposed. The electric nail gun includes a control module and at least one switch. The at least one switch outputs a first switch signal that has a first voltage and a second switch signal that has a second voltage when triggered. The control module set a flag that corresponds to the at least one switch to a predetermined state upon determining that a striking condition is met. The striking condition includes that, for each of the at least one switch, the first switch signal has the first voltage and the second switch signal has the second voltage.

Abstract: Semiconductor die assemblies with sidewall protection, and associated methods and systems are disclosed. In one embodiment, a semiconductor die assembly includes an interface die with a low-k dielectric layer and a stack of semiconductor dies attached to the interface die. The semiconductor die assembly also includes a molding structure that protects sidewalls of the interface die and sidewalls of the semiconductor dies. In some embodiments, the semiconductor die assembly includes a passivation layer attached to the interface die opposite to the stack of semiconductor dies. Further, the passivation layer may include a sidewall surface coplanar with an outer sidewall surface of the molding structure. The passivation layer may include a ledge underneath the molding structure, which is uncovered by the interface die. The semiconductor die assembly may include a NCF material at the sidewalls of the stack of semiconductor dies, where the molding structure surrounds the NCF material.

Abstract: An apparatus and method for manufacturing a semiconductor package structure are provided. The method includes: providing a process line comprising a first semiconductor manufacturing portion configured to provide a first operation including a first process step, and a second semiconductor manufacturing portion configured to provide a second operation including a second process step; passing a packaging structure through the second semiconductor manufacturing portion, wherein the second semiconductor manufacturing portion applies the second process step to the packaging structure; passing the packaging structure through the first semiconductor manufacturing portion, wherein the first semiconductor manufacturing portion applies the first process step to the packaging structure; and passing the packaging structure through the second semiconductor manufacturing portion again without applying the second process step thereon.

Abstract: A power tool and a safety control circuit module and a safety control method thereof are provided. The power tool includes a power supply device, a control processing device, a safety control circuit module, and a power output device. The control processing device is electrically connected with the power supply device. The safety control circuit module includes a first switch control circuit, a second switch control circuit, a third switch control circuit, a first resistor, and a first diode. The power output device includes a first power connection terminal and a second power connection terminal. Before switch units of the control circuits are controlled, the control processing device detects whether the switch unit has failed, so as to increase safety.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: A three-dimensional memory device includes a plurality of conductive layers and insulating layers alternately formed to define a multi-layer stacked structure on a first region of a semiconductor substrate. The multi-layer stacked structure includes a stair structure and a non-stair structure. A plurality of memory structures are located in the non-stair structure to form a memory array region, and each memory structure passes through the conductive layers and the insulating layers. A plurality of bow-height adjustment features are located in a second region of the semiconductor substrate.

Abstract: Provided is a control system and method for a power-driven nail gun, which includes a battery, a motor, a flywheel rotating along with the motor, an impacting member receiving kinetic energy of the flywheel and a nail channel providing a channel for a nail to move along therewith when hit by the impacting member. The method includes utilizing a microcontroller to provide a pulse width modulation (PWM) signal for a driving circuit to drive the motor based on the PWM signal; and in response to reaching a target rotation speed by the motor, utilizing the microcontroller to output a corresponding PWM duty to the driving circuit based on the voltage of the battery, to make the motor maintain at the target rotation speed. The nails obtain stable and consistent kinetic energy and stability of nail firing is effectively improved.

Abstract: An information handling system couples a solid state drive assembly having plural solid state drives to a motherboard with a single M.2 connector coupled to the motherboard by interfacing the plural solid state drives with an adapter circuit board having an M.2 interface defined at one end to insert into the motherboard connector and having plural M.2 connectors to interface with the plural solid state drives in a desired configuration, such as a stacked vertical configuration that more efficiently uses motherboard footprint to include persistent memory.

Abstract: An optical module and a projector including the optical module are provided. The optical module includes a base, a first frame body disposed in the base, an optical element disposed in the first frame body, and at least one driving assembly disposed between the base and the first frame body. The first frame body is configured to swing relative to the base through a magnetic force generated by the at least one driving assembly, and each of the at least one driving assembly includes a coil and a magnetic structure that is separated from the coil and includes a magnetic permeable plate, a separation medium, and a magnet element. The separation medium is located on one side of the magnetic permeable plate facing the coil. The magnet element is disposed on the side of the magnetic permeable plate facing the coil and is separated by the separation medium.

Abstract: A mechanical pneumatic valve system of a paintball gun is disclosed herein. It comprises a trigger activated valve body, a firing control valve body connected at a top of the trigger activated valve body, a firing control piston disposed in the firing control valve body, a push pilot piston positioned at a posterior end of the firing control piston and having a diameter greater than a diameter of the firing control piston, a dump chamber air reservoir communicated with the trigger activated valve body and having a volume adjustable piston to increase or decrease a volume of the dump chamber air reservoir, and a dump chamber control valve piston housed in the trigger activated valve body.

Abstract: The present disclosure relates to processes for preparing functionalized cyclooctenes and the synthetic intermediates prepared thereby.

Abstract: An information handling system couples a solid state drive assembly having plural solid state drives to a motherboard with a single M.2 connector coupled to the motherboard by interfacing the plural solid state drives with an adapter circuit board having an M.2 interface defined at one end to insert into the motherboard connector and having plural M.2 connectors to interface with the plural solid state drives in a desired configuration, such as a stacked vertical configuration that more efficiently uses motherboard footprint to include persistent memory.

Abstract: A semiconductor package structure includes a first package including a bonding region and a periphery region surrounding the bonding region, at least one insulating structure disposed in the bonding region of the first package, a second package disposed over the first package and the insulating structure in the bonding region, and a plurality of connectors disposed between the first package and the second package. The plurality of connectors provide electrical connection between the first package and the second package. Further, the insulating structure penetrates the first package and is spaced apart from the plurality of connectors.

Abstract: A three-dimensional memory device includes a plurality of conductive layers and insulating layers alternately formed to define a multi-layer stacked structure on a first region of a semiconductor substrate. The multi-layer stacked structure includes a stair structure and a non-stair structure. A plurality of memory structures are located in the non-stair structure to form a memory array region, and each memory structure passes through the conductive layers and the insulating layers. A plurality of bow-height adjustment features are located in a second region of the semiconductor substrate.

Abstract: A light-guide optical element is provided, including a transparent light-guide body having a first inclined surface and a second inclined surface disposed therein. The transparent light-guide body includes a side surface facing a first direction, and a first surface and a second surface which are adjacent to the side surface and face each other. The first inclined surface extends from the first surface to the second surface. The second inclined surface is located at the other side of the first inclined surface facing the side surface. The second inclined surface extends from the first surface to the second surface. When an input light enters the transparent light-guide body, the input light is partially reflected by the first inclined surface and the second inclined surface to form an output light output from the transparent light-guide body.

Abstract: An optical module and a projector including the optical module are provided. The optical module includes a base, a first frame body disposed in the base, an optical element disposed in the first frame body, and at least one driving assembly disposed between the base and the first frame body. The first frame body is configured to swing relative to the base through a magnetic force generated by the at least one driving assembly, and each of the at least one driving assembly includes a coil and a magnetic structure that is separated from the coil and includes a magnetic permeable plate, a separation medium, and a magnet element. The separation medium is located on one side of the magnetic permeable plate facing the coil. The magnet element is disposed on the side of the magnetic permeable plate facing the coil and is separated by the separation medium.

Abstract: A battery device includes a battery unit, a temperature port, a temperature sensitive component, a switch component and a battery management unit. The temperature sensitive component senses a temperature of the battery unit, and provides a temperature indication signal at the temperature port. The switch component is electrically connected to the temperature sensitive component. When the battery device operates abnormally, the battery management unit controls the switch component to make the switch component stop provision of the temperature indication signal at the temperature port.