Abstract: Method of forming a switch bracket of a hinge for a two-body information handling system, including mixing metal powders and binders to form a blended mix; pelletizing the blended mix to form feedstock; injecting the feedstock into a switch bracket mold cavity to form a first article of the switch bracket; de-binding the first article to remove the binders from the first article forming a second article of the switch bracket; and sintering the second article by shrinking the second article to form the switch bracket.

Abstract: A method of controlling a rotational speed of an electric tool is provided. The electric tool includes a battery, a battery voltage detection circuit, a motor unit, and a controller. The controller stores at least one regression equation of duty ratio on voltage, and detects a voltage of the battery through the battery voltage detection circuit. The controller obtains a duty ratio for a control signal by substituting the voltage of the battery into the at least one regression equation, and outputs the control signal with the duty ratio obtained from the at least one regression equation to the motor unit for controlling operation of the motor unit.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: An adjustable dumbbell includes a handle assembly and weight assemblies. The weight assemblies connect ends of the handle assembly. Each weight assembly includes an outer shell assembly, a counterweight element, and a locking assembly. The outer shell assembly includes a housing, the housing is connected to the handle assembly. A receiving cavity is defined in the housing. An opening communicated with the receiving cavity is defined at a side of the housing facing the handle assembly. The counterweight element is detachably received in the receiving cavity. The counterweight is fixed with the outer shell assembly by the locking element. The adjustable dumbbell of the disclosure hides the counterweight element, locking element, and two ends of the handle assembly in the outer shell element, prevents the counterweight element from shaking and making abnormal noise due to collision, and raising appearance beauty of the adjustable dumbbell.

Abstract: Method of forming a switch bracket of a hinge for a two-body information handling system, including mixing metal powders and binders to form a blended mix; pelletizing the blended mix to form feedstock; injecting the feedstock into a switch bracket mold cavity to form a first article of the switch bracket; de-binding the first article to remove the binders from the first article forming a second article of the switch bracket; and sintering the second article by shrinking the second article to form the switch bracket.

Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.

Abstract: A battery device includes a battery unit, a temperature port, a temperature sensitive component, a switch component and a battery management unit. The temperature sensitive component senses a temperature of the battery unit, and provides a temperature indication signal at the temperature port. The switch component is electrically connected to the temperature sensitive component. When the battery device operates abnormally, the battery management unit controls the switch component to make the switch component stop provision of the temperature indication signal at the temperature port.

Abstract: A semiconductor structure includes a substrate, a common source plane disposed on the substrate, a plurality of memory cells vertically disposed on the substrate and electrically connected to the common source plane, a common source line disposed on the substrate and electrically connected to the common source plane, and an isolation pillar. The common source line extends along a first direction and has a first segment and a second segment. The isolation pillar interposes the first segment and the second segment of the common source line.

Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.

Abstract: A system with sound adjustment capability is provided. The system includes a head-mounted device, a first loudspeaker and a processor. The first loudspeaker is detachable from the head-mounted device. The processor is configured to detect a plurality of positions and a plurality of orientations of the head-mounted device and the first loudspeaker to determine whether the first loudspeaker is detached from the head-mounted device. The processor is further configured to modify a first audio signal by at least one first filter or at least one second filter to generate a filtered first audio signal. The at least one first filter is used when the first loudspeaker is coupled to the head-mounted device, and the at least one second filter is used when the first loudspeaker is detached from the head-mounted device. The filtered first audio signal is configured to drive the first loudspeaker.

Abstract: A method for controlling a nail-striking operation of an electric nail gun is proposed. The electric nail gun includes a control module and at least one switch. The at least one switch outputs a first switch signal that has a first voltage and a second switch signal that has a second voltage when triggered. The control module set a flag that corresponds to the at least one switch to a predetermined state upon determining that a striking condition is met. The striking condition includes that, for each of the at least one switch, the first switch signal has the first voltage and the second switch signal has the second voltage.

Abstract: Semiconductor die assemblies with sidewall protection, and associated methods and systems are disclosed. In one embodiment, a semiconductor die assembly includes an interface die with a low-k dielectric layer and a stack of semiconductor dies attached to the interface die. The semiconductor die assembly also includes a molding structure that protects sidewalls of the interface die and sidewalls of the semiconductor dies. In some embodiments, the semiconductor die assembly includes a passivation layer attached to the interface die opposite to the stack of semiconductor dies. Further, the passivation layer may include a sidewall surface coplanar with an outer sidewall surface of the molding structure. The passivation layer may include a ledge underneath the molding structure, which is uncovered by the interface die. The semiconductor die assembly may include a NCF material at the sidewalls of the stack of semiconductor dies, where the molding structure surrounds the NCF material.

Abstract: An apparatus and method for manufacturing a semiconductor package structure are provided. The method includes: providing a process line comprising a first semiconductor manufacturing portion configured to provide a first operation including a first process step, and a second semiconductor manufacturing portion configured to provide a second operation including a second process step; passing a packaging structure through the second semiconductor manufacturing portion, wherein the second semiconductor manufacturing portion applies the second process step to the packaging structure; passing the packaging structure through the first semiconductor manufacturing portion, wherein the first semiconductor manufacturing portion applies the first process step to the packaging structure; and passing the packaging structure through the second semiconductor manufacturing portion again without applying the second process step thereon.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: A power tool and a safety control circuit module and a safety control method thereof are provided. The power tool includes a power supply device, a control processing device, a safety control circuit module, and a power output device. The control processing device is electrically connected with the power supply device. The safety control circuit module includes a first switch control circuit, a second switch control circuit, a third switch control circuit, a first resistor, and a first diode. The power output device includes a first power connection terminal and a second power connection terminal. Before switch units of the control circuits are controlled, the control processing device detects whether the switch unit has failed, so as to increase safety.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: A three-dimensional memory device includes a plurality of conductive layers and insulating layers alternately formed to define a multi-layer stacked structure on a first region of a semiconductor substrate. The multi-layer stacked structure includes a stair structure and a non-stair structure. A plurality of memory structures are located in the non-stair structure to form a memory array region, and each memory structure passes through the conductive layers and the insulating layers. A plurality of bow-height adjustment features are located in a second region of the semiconductor substrate.

Abstract: Provided is a control system and method for a power-driven nail gun, which includes a battery, a motor, a flywheel rotating along with the motor, an impacting member receiving kinetic energy of the flywheel and a nail channel providing a channel for a nail to move along therewith when hit by the impacting member. The method includes utilizing a microcontroller to provide a pulse width modulation (PWM) signal for a driving circuit to drive the motor based on the PWM signal; and in response to reaching a target rotation speed by the motor, utilizing the microcontroller to output a corresponding PWM duty to the driving circuit based on the voltage of the battery, to make the motor maintain at the target rotation speed. The nails obtain stable and consistent kinetic energy and stability of nail firing is effectively improved.

Abstract: An information handling system couples a solid state drive assembly having plural solid state drives to a motherboard with a single M.2 connector coupled to the motherboard by interfacing the plural solid state drives with an adapter circuit board having an M.2 interface defined at one end to insert into the motherboard connector and having plural M.2 connectors to interface with the plural solid state drives in a desired configuration, such as a stacked vertical configuration that more efficiently uses motherboard footprint to include persistent memory.