Abstract: A photovoltaic apparatus includes N solar cell modules. The solar cell module includes a first sub-loop, a second sub-loop, and at least one junction box. Each of the first sub-loop and second sub-loop has a first end and a second end. The junction box is electrically connected to the first ends and the second ends and connected to another junction box in another adjacent solar cell module. N is a natural number.

Abstract: An apparatus for patterning a ribbon includes a holding device, a heating device, and an embossing device. The holding device is utilized for positioning the ribbon on a surface of a solar cell. The first solder layer contacts the solar cell. The heating device is utilized for melting the ribbon for string tabbing on the solar cell. The embossing device is utilized for contacting the melted ribbon to form a pattern on the ribbon. A surface energy between the ribbon and the solar cell is greater than a surface energy between the ribbon and the embossing device.

Abstract: An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.

Abstract: A photovoltaic device comprises a photovoltaic panel and a heat sink module. The heat sink module is fastened on a rear surface of the photovoltaic panel. The heat sink module comprises a plurality of fins arranged at intervals, and one surface of each fin defines a wind-facing surface.

Abstract: A photovoltaic device provided in the present disclosure includes a superstrate, a lower substrate, a plurality of photovoltaic cells and a package structure. The superstrate is light-transmissive, and arranged in parallel with the substrate. The photovoltaic cells are disposed side-by-side at intervals with each other between the superstrate and the substrate, and a gap zone is defined by two facing lateral surfaces of every two of the neighboring photovoltaic cells. The package structure is sandwiched between the superstrate and the substrate, and encapsulates the photovoltaic cells between the superstrate and the substrate in which a reflection portion is provided in the package structure, and located in the gap zone for reflecting lights from the superstrate back to the photovoltaic cells.

Abstract: A bridging solar cell includes a substrate, first, second, and third sets of bus bar electrodes, a first welding member, a first insulation film, and a second welding member. The first set of bus bar electrodes is disposed on the front surface of the substrate along a first direction. The second set of bus bar electrodes is disposed on the back surface of the substrate along a second direction and electrically connected to the first set of bus bar electrodes. The first welding member is electrically connected to the second set of bus bar electrodes. The first insulation film is disposed on the back surface. The third set of bus bar electrodes is disposed on the first insulation film along the second direction. The second welding member is disposed on the first insulation film and electrically connected to the third set of bus bar electrodes.

Abstract: An ultraviolet light-absorbing solar module is disclosed. The ultraviolet light transmission of a first sealant disposed between a solar cell and a transparent substrate is greater than the ultraviolet light transmission of a second sealant disposed between the solar cell and a back plate. The ultraviolet light can pass through the first sealant and be utilized by the solar cell. The ultraviolet light can be further absorbed by the second sealant. Therefore the degradation of the back plate caused by being exposed of ultraviolet light can be prevented. A fabricating method of the ultraviolet light-absorbing solar module is also disclosed.

Abstract: A heat dissipation structure is provided and includes a plurality of heat conduction bases and at least one flexible fin. Each of the heat conduction bases includes a first surface and a second surface. A positioning groove is formed in the first surface of each of the heat conduction bases, and the second surface of each of the heat conduction bases is assembled to a backlight surface of a solar module. The fin is coupled to the positioning grooves and connected between the heat conduction bases.

Abstract: A solar panel module includes a solar panel, a supporting stand and a deflecting device. The supporting stand is structurally connected to the solar panel for supporting the solar panel. The solar panel is disposed inclinedly, and the solar panel has a tilt angle with respect to a horizontal plane. The deflecting device is disposed underneath the solar panel for deflecting wind blowing from lateral directions toward a wind exiting direction, which faces a bottom surface of the solar panel.

Abstract: A photovoltaic module and the frame thereof are provided. The frame includes a holding part and an extending part. The holding part is used to hold a photovoltaic panel. The extending part connects to the holding part and includes at least one first wind tunnel structure having an inlet and an outlet, in which the cross-sectional area of the inlet is greater than the cross-sectional area of the outlet.

Abstract: An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space.

Abstract: An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.

Abstract: An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.

Abstract: An active device array substrate and a fabricating method thereof are provided. A first patterned conductive layer including separated scan line patterns is formed on a substrate. Each scan line pattern includes a first and second scan lines adjacent to each other. Both the first and the second scan lines have first and second contacts. An open inspection on the scan line patterns is performed. Channel layers are formed on the substrate. A second patterned conductive layer including data lines interlaced with the first and second scan lines, sources and drains located above the channel layers, and connectors is formed on the substrate. The sources electrically connect the data lines correspondingly. At least one of the connectors electrically connects the first and second scan lines, so as to form a loop in each scan line pattern. Pixel electrodes electrically connected to the drains are formed.