Abstract: An electronic device has sensors. More particularly, the electronic device is a small form factor electronic device such as earbuds, styluses, or electronic pencils, earphones, and so on. In some implementations, one or more touch sensors and one or more force sensors are coupled to a flexible circuit. In various implementations, the touch sensor and the force sensor are part of a single module controlled by a single controller. In a number of implementations, the flexible circuit is laminated to one or more portions of an interior surface of the electronic device.

Abstract: A method for forming objects includes a step of spreading a base material layer on a surface, a step of initiating a first physical or chemical change of the base material layer by exposure to one of ultra violet beams or infra-red beams so as to become a gelled material, a step of initiating a second physical or chemical change by application of a laser beam to selected areas of the gelled base material layer to make each selected area to become hardened in mature, a step of repeating steps 1-3 a pre-determined number of times, each newly added base material layer being laminated on a preceding layer to form a plurality of stacked layers, the hardened selected areas of the plurality of stacked layers defining a solid object, and a step of removing the portions of base material layers remaining in gelled form to obtain a final prototype.

Abstract: A method for forming objects includes a step of spreading base material on a limited area by nozzles or rollers, step of proceeding a first time of physical or chemical change on selected areas by heating boards, ultra violet beams or infra-red beams so as to have gel-like material, and step of selectively proceeding a second time of physical or chemical change by laser beam or adding additional material on the selected areas of the base material so that the nature of the gel-like material becomes acceptable. The gel-like material is laminated to build a three dimensional object.

Abstract: Compounds are prepared which have at least one aromatic cyanate group and at least one organosiloxane moiety per molecule. These compounds when cured possess excellent thermal stability, moisture resistance properties and a low dielectric constant.

Abstract: Blends containing (1) at least one compound containing an average of more than one vicinal aromatic cyanate group per molecule and at least one organosiloxane moiety per molecule and (2) at least one compound containing an average of more than one vicinal aromatic cyanate group per molecule which is substantially free of organosiloxane moieties. The compositions are useful as a component in adhesives, coatings, laminates, composites, encapsulants, filament winding, and molding.

Abstract: Curable compositions containing a compound containing an average of more than one vicinal aromatic cyanate group per molecule and at least one organosiloxane moiety per molecule and a curing catalyst therefor. The compositions are useful as a component in adhesives, coatings, laminates, composites, encapsulants, filament winding, and molding.

Abstract: Compounds are prepared which contain both an organosiloxane moiety and either a phenolic hydroxyl group or an epoxide group. Also disclosed are curable and cured compositions.

Abstract: Epoxy resins have been reacted with a copolymer of a diunsaturated aliphatic compound and acrylonitrile or methacrylonitrile and a siloxane-containing polymer resulting in a rubber modified epoxy resin suitable for use in electrical and electronic component encapsulation formulations which provide such components with improved thermal shock performance. The rubber modified epoxy resins have improved flexural properties with minimal reduction in glass transition temperature.

Abstract: Adducts of metabrominated monophenols such as 3,5-dibromo-2,4,6-trimethylphenol and multifunctional epoxides such as cresol-formaldehyde epoxy novolac resins are disclosed to be useful in formulations for encapsulating electronic components.

Abstract: Epoxy resins which are relatively low in total bound halide are prepared by concurrently and continuously adding a mixture of (1) a mixture of an epihalohydrin, a compound containing an average of more than one group reactive with a vicinal epoxide group and a solvent and (2) an aqueous or organic solution of an alkali or alkaline earth metal hydroxide; to (3) a mixture of epihalohydrin and a solvent.

Abstract: Adducts of metabrominated monophenols such as 3,5-dibromo-2,4,6-trimethylphenol and multifunctional epoxides such as cresol-formaldehyde epoxy novolac resins are disclosed to be useful in formulations for encapsulating electronic components.

Abstract: Adducts of metabrominated monophenols such as 3,5-dibromo-2,4,6-trimethylphenol and multifunctional epoxides such as cresol-formaldehyde epoxy novolac resins are disclosed to be useful in formulations for encapsulating electronic components.

Abstract: Adducts of metabrominated monophenols such as 3,5-dibromo-2,4,6-trimethylphenol and multifunctional epoxides such as cresol-formaldehyde epoxy novolac resins are disclosed to be useful in formulations for encapsulating electronic components.

Abstract: Advanced epoxy resins are disclosed which result from the reaction of a relatively low molecular weight epoxy resin and a polyhydric phenol wherein at least one of the reactants contains at least one halogen atom which is meta with respect to a glycidyl ether group or a hydroxyl group attached to an aromatic ring. These advanced epoxy resins, when cured with a suitable curing agent, possess an improvement as compared to an advanced epoxy resin containing halogen atoms which are ortho with respect to a glycidyl ether group in at least one of thermal stability, glass transition temperature, relationship of viscosity to molecular weight and resistance to forming hydrolyzed halides in the presence of a refluxing solution of an alkali metal hydroxide.

Abstract: 2,6-dibromo-3,5-dialkyl-4-hydroxybenzyl ethers, glycidyl ethers thereof and reaction products with phenolic hydroxyl-containing compounds, and glycidyl ethers of the resulting new phenolic hydroxyl-containing compounds.

Abstract: The total halide content of epoxy resins is reduced by heating a resin containing undesirable halide dissolved in a solvent mixture containing at least one polar aprotic solvent in the presence of an alkali metal hydroxide for a time sufficient to reduce the total halide content.

Abstract: Glycidyl derivatives of compounds containing --OH, --NH.sub.2 and/or --COOH groups are prepared by reacting in the presence of a mixture of solvents, at least one of which is a polar aprotic solvent, an excess of an epihalohydrin with a compound containing --OH, --NH.sub.2 and/or --COOH groups while continuously or incrementally adding an alkali metal hydroxide to the mixture and removing water from the reaction by codistillation with epihalohydrin and the solvents.

Abstract: The aromatic hydroxyl groups of aromatic hydroxyl-containing compounds can be allylated to greater than 95% conversion by reacting the alkali metal salt of said aromatic hydroxyl-containing compounds with an allyl halide such as allyl chloride in the presence of a polar aprotic solvent such as dimethylformamide. These compounds are useful in preparing epoxy resins containing a low halogen content.

Abstract: Titled materials and their preparation. The materials contain a moiety such as, for example, 4-oxy-3,5-dimethyl-2,6-dibromobenzyl which can impart a high degree of thermal and hydrolytic stability to the materials, for example, epoxy thermosets such as in electronic encapsulations. For example, when used in electronic encapsulation formulations, these materials can provide a substantial increase in electronic device reliability. Their preparation involves an alkylation of an aromatic ring, for example, such as a Friedel-Crafts alkylation with 4-bromomethyl-3,5-dibromo-2,6-dimethylphenol or with 4-hydroxymethyl-3,5-dibromo-2,6-dimethylphenol.

Abstract: Halogenated aromatic epoxy resins are disclosed wherein the halogen atoms are in the meta position with respect to a glycidyl ether group attached to an aromatic ring.Advanced epoxy resins are disclosed which result from the reaction of a relatively low molecular weight epoxy resin and a polyhydric phenol wherein at least one of the reactants contains at least one halogen atom which is meta with respect to a glycidyl ether group or a hydroxyl group attached to an aromatic ring. These advanced epoxy resins, when cured with a suitable curing agent, possess an improvement as compared to an advanced epoxy resin containing halogen atoms which are ortho with respect to a glycidyl ether group in at least one of thermal stability, glass transition temperature, relationship of viscosity to molecular weight and resistance to forming hydrolyzed halides in the presence of a refluxing solution of an alkali metal hydroxide.