Abstract: Monomers and oligomers containing a plurality of vinylbenzyl ether groups are prepared by reacting a material containing a plurality of aromatic hydroxyl groups such as tetramethyltetrabromobisphenol A with a vinylbenzyl halide such as vinylbenzyl chloride in the presence of a polar aprotic solvent such as dimethylformamide. The monomers and oligomers prepared by this process have an improvement in one or more properties selected from dielectric constant (before and/or after moisture absorption) or thermal stability. Also disclosed are new monomers and oligomers containing a plurality of vinylbenzyl ether groups such as bis(vinylbenzyl)ether of dicyclopentadienyl bisdimethylphenol.

Abstract: Advanced epoxy resin products are prepared by reacting a triglycidyl ether of a trihydric phenol such as the triglycidyl ether of 1,1,1-tri(hydroxyphenyl)methane with a dihydric phenol such as bisphenol A. These advanced epoxy resins are non-sintering solid resins useful in the preparation of electrical potting or molding compositions.

Abstract: Advanced epoxy resins having a low total aliphatic halide content are prepared by reacting an epoxy resin having an average of more than one 1,2-epoxide group per molecule with a material having an average of more than one phenolic hydroxyl group per molecule in the presence of a solvent having at least one aliphatic hydroxide group per molecule and a catalytic quantity of an alkali metal hydroxide. These low aliphatic halide-containing advanced epoxy resins are useful in formulations for preparing laminates, moldings, pottings and coatings for the electronics industry.

Abstract: A composition comprising a polyepoxy aromatic hydantoin having epoxy functionality on the aromatic and the hydantoin rings.

Abstract: Solid non-sintering epoxy resin products are prepared by reacting a trihydric phenol such as 1,1,1-tri(hydroxyphenyl)methane with an epihalohydrin such as epichlorohydrin in the presence of an alkali metal hydroxide such as sodium hydroxide. These epoxy resins are non-sintering solid resins useful in the preparation of electrical potting or molding compositions.

Abstract: New epoxy resins result from dehydrohalogenation of the reaction product of an epihalohydrin such as epichlorohydrin with the reaction product of a trisphenol such as 1,1,1-tris(hydroxyphenyl)methane with dicyclopentadiene or an oligomer thereof. These new epoxy resins are useful in the electronics industry as encapsulants, potting compounds, laminates and the like.

Abstract: The total halide content of epoxy resins is reduced by heating a resin containing halide dissolved in a solvent mixture containing at least one ketone, at least one aromatic hydrocarbon and optionally at least one compound containing at least one aliphatic hydroxyl group in the presence of an alkali metal hydroxide for a time sufficient to reduce the total halide content.

Abstract: Unwanted halogen values are removed from liquid resin, organic or hydrocarbon material by adding particulate crystalline lithium aluminate compounds to the liquid material to act as a halogen scavenger, then separating the crystalline aluminate compound from the liquid material.

Abstract: Epoxy resins are prepared by reacting an excess of an epihalohydrin with a phenolic hydroxyl-containing compound in the presence of the incremental addition of a basic catalyst while removing water by codistilling with a solvent and epihalohydrin.

Abstract: A process for the dehydrohalogenation of a (polyhaloalkyl)benzene containing a benzylic halogen such as 1,3-dichloro-5-(2,4,4,4-tetrachlorobutyl)-benzene by contacting the (polyhaloalkyl)benzene with a Lewis acid such as AlCl.sub.3 deposited on an inert support such as silica gel or alumina under conditions sufficient to catalyze said dehydrohalogenation to form a (polyhaloalkenyl)benzene such as 3,5-dichloro-.alpha.-(2,2,2-trichloroethyl)styrene.