Patents by Inventor Chun Su

Chun Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12183723
    Abstract: A semiconductor package including at least one functional die; at least one dummy die free of active circuit, wherein the dummy die comprises at least one metal-insulator-metal (MIM) capacitor; and a redistribution layer (RDL) structure interconnecting the MIM capacitor to the at least one functional die.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: December 31, 2024
    Assignee: MEDIATEK INC.
    Inventors: Yao-Chun Su, Chih-Ching Chen, I-Hsuan Peng, Yi-Jou Lin
  • Publication number: 20240361821
    Abstract: An electronic device may include a first wireless transceiver, a second wireless transceiver, and a processor. The processor may establish a first wireless communication with an external device via the first wireless transceiver. Further, processor may monitor a distance between the electronic device and the external device via the first wireless transceiver. In response to a determination that the monitored distance crosses a first threshold, the processor may establish a second wireless communication with the external device via the second wireless transceiver and monitor the distance between the electronic device and the external device via the second wireless transceiver. Furthermore, the processor may control the electronic device to operate in a first power state or a second power state based on the monitored distance via the first wireless transceiver or the second wireless transceiver.
    Type: Application
    Filed: April 30, 2021
    Publication date: October 31, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Huai-Yung Yen, Isaac Lagnado, Chih-Hung Chien, Chien-Pai Lai, Hsiao-Chun Su
  • Publication number: 20240316548
    Abstract: Disclosed are a semiconductor sensing chip and a microfluidic sensing system. The microfluidics sensing system includes a first inlet and a second inlet, a fluidic structure, and a semiconductor sensing chip. The first inlet and the second inlet are respectively configured for injection of a sample and a reagent. The fluidic structure is coupled to the first inlet and the second inlet. The fluidic structure is configured to mix the sample and the reagent to generate a biofluid under test. The semiconductor sensing chip is disposed at the end of the fluidic structure and configured to sense the biofluidic under test and generate a concentration sensing result corresponding to the sample.
    Type: Application
    Filed: March 22, 2024
    Publication date: September 26, 2024
    Applicant: National Taiwan University
    Inventors: Jun-Chau Chien, Shu-Yan Chuang, Yan-Ting Hsiao, Hung-Yu Hou, Yun-Chun Su
  • Patent number: 12072060
    Abstract: A fixing module suitable for fixing to one of a first end and a second end of a screen bracket is provided. The fixing module includes a first part and a second part. The second part is slidably connected to the first part. The fixing module is configured to be fixed to the first end of the screen bracket by the first part or fixed to the second end of the screen bracket by the second part.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: August 27, 2024
    Assignee: Qisda Corporation
    Inventors: Jen-Feng Chen, Shih-An Lin, Kuan-Hsu Lin, Hsin-Hung Lin, Yung-Chun Su, Nien-Tsung Hsu, Hsin-Che Hsieh, Hao-Chun Tung, Yang-Zong Fan
  • Publication number: 20240242535
    Abstract: A detection system and a detection method are provided. The detection method includes: receiving an image containing a face by an angle acquisition module and obtaining a first angle, a second angle and a third angle of the face based on the image; obtaining a first projection value and a second projection value based on the first angle, the second angle and the third angle by a projection calculation module; and performing by a confidence calculation module: performing an exponentiation calculation on the first projection value based on a first correction value to obtain a third value; performing an exponentiation calculation on the second projection value based on a second correction value to obtain a fourth value; and obtaining a confidence value based on the third value and the fourth value.
    Type: Application
    Filed: April 24, 2023
    Publication date: July 18, 2024
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Kai-Chun Su, Chao-Hsun Yang, Shih-Tse Chen
  • Publication number: 20240242536
    Abstract: A detection system and a detection method are provided. The detection method includes: obtaining first, second and third keypoints of a face by a keypoint acquisition module based on an image containing the face, the keypoint acquisition module obtaining the third keypoint based on a predetermined position on a midline of a human face and the first and the second keypoints based on two paired positions outside the midline; obtaining a vector by a first calculation module based on the first and second keypoints; obtaining a two-variable linear function by a second calculation module based on the vector and the third keypoint; and substituting, by a determination module, the coordinates of the first keypoint and the coordinates of the second keypoint into the two-variable linear function to obtain first and second values, respectively, and determining the state of the face based on the first and second values.
    Type: Application
    Filed: April 24, 2023
    Publication date: July 18, 2024
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Kai-Chun Su, Min-Xuan Qiu, Shih-Tse Chen
  • Publication number: 20240242016
    Abstract: A layout routing method includes determining a routing pattern according to a swapping rule, a via pattern, area constraints and pin locations; optimizing swapping in differential pairs according to the routing pattern; extracting features of each routing net to obtain extracted features; using an unsupervised algorithm to generate different routing groups according to the extracted features; and determining a routing order of the routing groups according to complex features of the routing groups.
    Type: Application
    Filed: December 25, 2023
    Publication date: July 18, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chih-Jung Hsu, Chen Lien, Deng-Yao Tu, Po-Yang Chen, Guan-Qi Fang, Shu-Huan Chang, Yi-Hung Chen, Yao-Chun Su, Yu-Yang Chen
  • Publication number: 20240227060
    Abstract: Disclosed is a dual heating type ultrasonic bonding apparatus including a stage, a part seating jig disposed on the stage, and an ultrasonic bonding unit disposed to correspond to the part seating jig and that bonds dissimilar parts seated on the part seating jig. The stage includes a first heater that transfers heat to the dissimilar parts through the part seating jig, and the ultrasonic bonding unit includes an ultrasonic horn that applies ultrasonic waves to the dissimilar parts, and a second heater coupled to the ultrasonic horn, and that transfers heat to the dissimilar parts through the ultrasonic horn.
    Type: Application
    Filed: March 17, 2023
    Publication date: July 11, 2024
    Applicant: WITS Co., Ltd.
    Inventors: Du Hyun SONG, Chun Su YOON
  • Publication number: 20240213802
    Abstract: Disclosed is a wireless charging coil module for wirelessly receiving or transmitting electric power or signals by using electromagnetic fields including a base, and a coil part including a coil provided on one surface of the base to be rotated in one direction. The coil includes a rolled thin plate of a conductive metal disposed on the one surface of the base, and a side part of the coil has a shape, a central portion of which protrudes or is recessed.
    Type: Application
    Filed: March 20, 2023
    Publication date: June 27, 2024
    Applicant: WITS Co., Ltd.
    Inventors: Du Hyun SONG, Chun Su YOON, Dong Hyun KIM, Seung Jae BAECK, Yong Gu YOON
  • Publication number: 20240131613
    Abstract: Disclosed is a dual heating type ultrasonic bonding apparatus including a stage, a part seating jig disposed on the stage, and an ultrasonic bonding unit disposed to correspond to the part seating jig and that bonds dissimilar parts seated on the part seating jig. The stage includes a first heater that transfers heat to the dissimilar parts through the part seating jig, and the ultrasonic bonding unit includes an ultrasonic horn that applies ultrasonic waves to the dissimilar parts, and a second heater coupled to the ultrasonic horn, and that transfers heat to the dissimilar parts through the ultrasonic horn.
    Type: Application
    Filed: March 16, 2023
    Publication date: April 25, 2024
    Applicant: WITS Co., Ltd.
    Inventors: Du Hyun SONG, Chun Su YOON
  • Publication number: 20240055358
    Abstract: An electronic package includes a base of a rectangular shape, and a chip package including a first interface circuit die and a second interface circuit die. The first interface circuit die and second interface circuit die are mounted on a redistribution layer structure and encapsulated within a molding compound. The chip package is mounted on a top surface of the base and rotated relative to the base above a vertical axis that is orthogonal to the top surface through a rotation offset angle. A metal ring is mounted on the top surface of the base.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yao-Chun Su, Chih-Jung Hsu, Yi-Jou Lin, I-Hsuan Peng
  • Publication number: 20240048218
    Abstract: An example mobile computing device includes: an antenna capable of switching between a plurality of antenna patterns; an image sensor to capture image data representing an environment of the mobile computing device; a depth sensor to capture depth data representing the environment of the mobile computing device; a processor connected to the antenna, the image sensor and the depth sensor, the processor to: obtain the image data and the depth data; select a designated antenna pattern from the plurality of antenna patterns based on the image data and the depth data; and control the antenna to use the designated antenna pattern.
    Type: Application
    Filed: August 3, 2022
    Publication date: February 8, 2024
    Inventors: Chin-Hung Ma, Huai-Yung Yen, Kun-Jung Wu, Xin-Chang Chen, Hsiao Chun Su
  • Patent number: 11889641
    Abstract: A display device includes a screen, a screen stand and a fixing module. The screen stand is pivotally connected to the screen. The fixing module is connected to the screen stand and configured to clamp a first surface and a second surface of a board and includes a connecting element, a first abutting element and a second abutting element. The first abutting element is fixed to the connecting element and configured to abut against the first surface of the board. The second abutting element is pivotally connected to the connecting element and includes an abutting end configured to abut against the second surface of the board.
    Type: Grant
    Filed: February 10, 2022
    Date of Patent: January 30, 2024
    Assignee: Qisda Corporation
    Inventors: Jen-Feng Chen, Ying-Yu Tsai, Kuan-Hsu Lin, Hsin-Hung Lin, Shih-An Lin, Yung-Chun Su, Hsin-Che Hsieh, Hao-Chun Tung, Yang-Zong Fan, Chih-Ming Chang
  • Publication number: 20230422187
    Abstract: The transmission power at which to drive an antenna of a computing device is adjusted based on a peak transmission gain of the antenna for a current physical configuration mode in which the computing device is operating and on a maximum permitted radiation for the antenna. The antenna is driven at the adjusted transmission power when performing wireless communication using the antenna.
    Type: Application
    Filed: June 27, 2022
    Publication date: December 28, 2023
    Inventors: Cheng-Fang Lin, Huai-Yung Yen, Ruei-Ting Lin, Ren-Hao Chen, Lo-Chun Tung, Sheng-Yen Chan, Hsiao Chun Su
  • Patent number: 11849247
    Abstract: A magnetic template with adjustable magnetic force is provided. The magnetic template is applied to a display device. The display device can be fixed on a plane by the magnetic template, wherein the magnetic template includes an assembly shell and an adjustment element. A magnetic element is arranged inside the assembly shell. The adjustment element is arranged in the assembly shell and is configured to adjust the magnetic force of the magnetic element relative to the plane or adjust the magnetic force of the magnetic element.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: December 19, 2023
    Assignee: Qisda Corporation
    Inventors: Yung-Chun Su, Hung-Mao Chen, Hui-Chieh Hu, Hsin-Che Hsieh, Shih-An Lin, Kuan-Hsu Lin, Hsin-Hung Lin, Jen-Feng Chen, Hao-Chun Tung, Yang-Zong Fan, Chih-Ming Chang
  • Patent number: 11830820
    Abstract: An electronic package includes a package substrate of a rectangular shape, and a chip package including a first interface circuit die and a second interface circuit die. The first interface circuit die and second interface circuit die are mounted on a redistribution layer structure and encapsulated within a molding compound. The chip package is mounted on a top surface of the package substrate and rotated relative to the package substrate above a vertical axis that is orthogonal to the top surface through a rotation offset angle. A metal ring is mounted on the top surface of the package substrate.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: November 28, 2023
    Assignee: MEDIATEK INC.
    Inventors: Yao-Chun Su, Chih-Jung Hsu, Yi-Jou Lin, I-Hsuan Peng
  • Publication number: 20230352620
    Abstract: A display device includes a display, at least one light emitting element and at least one reflector. The display has a display surface and a back surface opposite to each other, and the display surface faces a front of the display. The light emitting element is disposed on the back surface. The reflector is slidably connected to the back surface and has a reflecting surface. When the reflector slides to a first position, the reflecting surface is hidden. When the reflector slides to a second position, the reflecting surface is exposed, such that light emitted from the light emitting element is reflected toward the front of the display by the reflecting surface.
    Type: Application
    Filed: November 29, 2022
    Publication date: November 2, 2023
    Applicant: Qisda Corporation
    Inventors: Yung-Chun Su, Yu-Liang Cheng, Sheng-Chan Chen
  • Patent number: 11802657
    Abstract: A display device includes a screen, a screen support and a fixing module. The screen support is pivotally connected to the screen, and the screen support includes a first end and a second end. The fixing module is detachably connected to the screen support and includes a first sub-component and a second sub-component. The first sub-component has a first surface and a second surface, and the first sub-component is selectively connected to one of the first end and the second end. The second sub-component has a third surface and a fourth surface, and the second sub-component is configured for clamping a board. One of the first surface and the second surface of the first sub-component and one of the third surface and the fourth surface of the second sub-component are detachably connected.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: October 31, 2023
    Assignee: Qisda Corporation
    Inventors: Hsin-Che Hsieh, Shih-An Lin, Kuan-Hsu Lin, Hsin-Hung Lin, Yung-Chun Su, Jen-Feng Chen, Hao-Chun Tung, Yang-Zong Fan, Chih-Ming Chang
  • Patent number: 11803685
    Abstract: The disclosure discloses a layout design method, chip and terminal of power device, wherein the non-top metal layout design: the metal is routed along the first direction and several metal wires that fully occupy the available area of the die unit are thereby obtained, and the wiring properties of the metal wires are sequentially changed at intervals, making the source ends and the drain ends of the device are alternately distributed at intervals, and the metal routing in two or more layers of non-top metal are arranged vertically; the top metal layout design: the source end region and drain end region in the top metal are formed into sheets independently and the pad is arranged in the top metal region; eventually realize the interconnection of metal layers and complete the layout design.
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: October 31, 2023
    Inventors: Chun Su, Shuai Zhang, Yu Liu, Hongshuang Dong, Wei Chen, Yi Chen, Xin Wang, Gaoqiang Dai
  • Patent number: 11783612
    Abstract: A system configured to reduce false positives when performing human presence detection is provided. In addition to calculating a Human Detection (HD) confidence score during human presence detection, the system may use human keypoint detection (HKD) techniques to calculate a true positive (TP) confidence score and detect false positives based on a combination of the two confidence scores. For example, the device system may generate keypoint data, which indicates a location and maximum confidence value for individual keypoints associated with a human body. The system may input the keypoint data to a model configured to generate the TP confidence score, such as a logistic regression model that is configured to receive numerical values as inputs (e.g., HD confidence score and 17 keypoint confidence values) and generate the TP confidence score. The system then detects false positives using the TP confidence score and may remove corresponding bounding boxes.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: October 10, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Cheng-Hao Kuo, Zhuo Deng, Che-Chun Su, Yelin Kim